WBC-T0303GG-01-1002-C

Wire Bondable Chip Resistors WBC Series • Discrete or tapped schematics • MIL inspection available • High resistor density IRC Advanced Film Division IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application. The WBC combines IRC’s TaNSil® tantalum nitride thin film technology with silicon substrate processing to produce an extremely small nitride lm substrate processing to produce an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil® resistor film. lm. Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applications. Custom resistance values, sizes and schematics are available on request from the factory. Physical Data R0202 - Discrete (0.508mm ±0.025) 0.020˝ ±0.001 Electrical Data Absolute Tolerance Absolute TCR R Package Power Rating (@ 70°C) Rated Rated Operating Voltage (not (not to exceed √ P x R ) Operating Temperature Back Back contact Noise Substrate Material Top contact Substrate Thickness Aluminum Gold R0202 and T0303 B0202 Passivation to ±0.1% to ±25ppm/°C 250mW 100V -55°C to +150°C