WBDDSS4-B-01-1002-FA

Wire Bondable Resistor Network Arrays Chip Network Array Series • Absolute tolerances to ±0.1% • Tight TCR tracking to ±5ppm/°C • Ratio match tolerances to ±0.05% • Ultra-stable tantalum nitride resistors IRC’s TaNSil® network array resistors are ideally suited for applications that demand a small footprint. The small wire bondable chip package provides higher component density, lower resistor cost and high reliability. The tantalum nitride film system on silicon provides precision tolerance, exceptional TCR tracking and low cost. Excellent performance in harsh, humid environments is a trademark of IRC’s self-passivating TaNSil® resistor film. For applications requiring high performance resistor networks in a low cost, wire bondable package, specify IRC network array die. Electrical Data Isolated Resistance Range Absolute Tolerance Ratio Tolerance to R1 Absolute TCR Tracking TCR Element Power Rating Package Power Rating Rated Operating Voltage (not to exceed √ P x R) Operating Temperature Noise Substrate Material Substrate Thickness Bond Pad Metallization Backside Passivation General Note TCR/Inspection Code Table Bussed 10Ω to 1.25MΩ ±300ppm/°C to ±0.1% ±100ppm/°C ±50ppm/°C ±25ppm/°C Absolute TCR 10Ω to 2.5MΩ Commercial Code 00 01 02 03 MIL Inspection Code* 04 05 06 07 to ±0.1% to ±0.05% to ±25ppm/°C to ±5ppm/°C 100mW @ 70°C 50mW @ 70°C 8-Pad 400mW @ 70°C 16-Pad 800mW @ 70°C 24-Pad 1.0W @ 70°C 100V -55°C to +150°C