IR2175S

Data Sheet No. PD60208 Rev. E IR2175(S) & (PbF) LINEAR CURRENT SENSING IC Features • • • • • • • • Floating channel up to +600V Monolithic integration Linear current feedback through shunt resistor Direct digital PWM output for easy interface Low IQBS allows the boot strap power supply Independent fast overcurrent trip signal High common mode noise immunity Input overvoltage protection for IGBT short circuit condition • Open Drain outputs • Also available LEAD-FREE Product Summary VOFFSET IQBS Vin Gain temp.drift fo Overcurrent trip signal delay Overcurrent trip level 600Vmax 2mA +/-260mVmax 20ppm/oC (typ.) 130kHz (typ.) 2µsec (typ) +/-260mV (typ.) Description The IR2175 is a monolithic current sensing IC designed for motor drive applications. It senses the motor phase current through an external shunt resistor, converts from analog to digital signal, and transfers the signal to the low side. IR’s proprietary high voltage isolation technology is implemented to enable the high bandwidth signal processing. The output format is discrete PWM to eliminate need for the A/D input interface for the IR2175. The dedicated overcurrent trip (OC) signal facilitates IGBT short circuit protection. The open-drain outputs make easy for any interface from 3.3V to 15V. S Packages 8 Lead PDIP IR2175 8 Lead SOIC IR2175S Block Diagram Up to 600V 15V PWM Output GND Overcurrent VCC PO V+ VS IR2175 COM OC VB To Motor Phase (Refer to Lead Assignments for correct pin configuration). This/These diagram(s) show electrical connections only. Please refer to our Application Notes and DesignTips for proper circuit board layout. IR2175(S) & (PbF) Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol VS VBS VCC VIN VPO VOC dV/dt PD RthJA TJ TS TL Definition High side offset voltage High side floating supply voltage Low side and logic fixed supply voltage Maximum input voltage between VIN+ and VS Digital PWM output voltage Overcurrent output voltage Allowable offset voltage slew rate Package power dissipation @ TA ≤ +25°C Thermal resistance, junction to ambient Junction temperature Storage temperature Lead temperature (soldering, 10 seconds) 8 lead SOIC 8 lead PDIP 8 lead SOIC 8 lead PDIP Min. -0.3 -0.3 -0.3 -5 COM -0.3 COM -0.3 — — — — — — -55 — Max. 600 25 25 5 VCC +0.3 VCC +0.3 50 .625 1.0 200 125 150 150 300 Units V V/ns W °C/W °C Note 1: Capacitors are required between VB and Vs when bootstrap power is used. The external power supply, when used, is required between VB and Vs pins. Recommended Operating Conditions The output logic timing diagram is shown in figure 1. For proper operation the device should be used within the recommended conditions. Symbol VB VS VPO VOC VCC VIN TA Definition High side floating supply voltage High side floating supply offset voltage Digital PWM output voltage Overcurrent output voltage Low side and logic fixed supply voltage Input voltage between VIN+ and VS Ambient temperature Min. VS +13.0 0.3 COM COM 9.5 -260 -40 Max. VS +20 600 VCC VCC 20 +260 125 Units V mV °C 2 www.irf.com IR2175(S) & (PbF) DC Electrical Characteristics VCC = VBS = 15V, and TA = 25o unless otherwise specified. Symbol VIN VOC+ VOCVOS ∆V OS/ ∆T A G ∆G/ ∆T A ILK IQBS IQCC LIN ∆VLIN/∆TA IOPO IOCC VIN+ _ VS Definition Nominal input voltage range before saturation Overcurrent trip positive input voltage Overcurrent trip negative input voltage Input offset voltage Input offset voltage temperature drift Gain (duty cycle % per VIN) Gain temperature drift Offset supply leakage current Quiescent VBS supply current Quiescent VCC supply current Linearity (duty cycle deviation from ideal linearity curve) Linearity temperature drift Digital PWM output sink current OC output sink current Min. Typ. Max. Units Test Conditions -260 — — -10 — 155 — — — — — — 20 2 10 1 — 260 — — 10 — 165 — 50 — 0.5 1 — — — — — mA µV/ C o 260 -260 0 25 160 20 — 2 — 0.5 .005 — — — — mV VIN = 0V (Note 1) %/V ppm/ C µA mA % %/oC VO = 1V VO = 0.1V VO = 1V VO = 0.1V VB = VS = 600V VS = 0V o max gain error=5% (Note 2) Note 1: ±10mV offset represents ±1.5% duty cycle fluctuation Note 2: Gain = (full range of duty cycle in %) / (full input voltage range). AC Electrical Characteristics VCC = VBS = 15V, and TA = 25o unless otherwise specified. Symbol Definition Propagation delay characteristics fo ∆ f/ ∆T A Dmin Dmax BW PHS tdoc twoc Carrier frequency output Temperature drift of carrier frequency Minimum duty Maximum duty fo bandwidth Phase shift at 1kHz Propagation delay time of OC Low true pulse width of OC Min. Typ. Max. Units Test Conditions 100 — — — — — 1 — 130 500 9 91 15 -10 2 1.5 180 — — — — — — — kHz ppm/oC % % kHz o figure 1 VIN = 0 & 5V VIN+=-260mV, VIN+=+260mV VIN+ = 100mVpk -pk sine wave, gain=-3dB VIN+ =100mVpk-pk sine wave µsec www.irf.com 3 IR2175(S) & (PbF) Timing Waveforms PO Duty=9% Vin+= -260mV Vs = 0V Duty=91% PO Vin+= +260mV Vs = 0V Carrier Frequency = 130kHz Figure 1 Output waveform Application Hint: Temperature drift of the output carrier frequency can be cancelled by measuring both a PWM period and the on-time of PWM (Duty) at the same time. Since both periods vary in the same direction, computing the ratio between these values at each PWM period gives consistent measurement of the current feedback over the temperature drift. 4 www.irf.com IR2175(S) & (PbF) Lead Definitions Symbol Description VCC COM VIN+ VB VS PO OC N.C. Low side and logic supply voltage Low side logic ground Positive sense input High side supply High side return Digital PWM output Overcurrent output (negative logic) No connection Lead Assignment 1 VC C VIN + 8 1 VC C VIN + 8 2 PO Vs 7 2 PO Vs 7 3 COM V B 6 3 COM V B 6 4 OC NC 5 4 OC NC 5 8 lead SOIC Also available LEAD-FREE (PbF) 8 lead PDIP Also available LEAD-FREE (PbF) IR2175S IR2175 www.irf.com 5 IR2175(S) & (PbF) Case Outlines 8 Lead PDIP 01-6014 01-3003 01 (MS-001AB) D A 5 B FOOTPRINT 8X 0.72 [.028] DIM A b c D INCHES MIN .0532 .013 .0075 .189 .1497 MAX .0688 .0098 .020 .0098 .1968 .1574 MILLIMETERS MIN 1.35 0.10 0.33 0.19 4.80 3.80 MAX 1.75 0.25 0.51 0.25 5.00 4.00 A1 .0040 6 E 8 7 6 5 H 0.25 [.010] A E 6.46 [.255] 1 2 3 4 e e1 H K L 8X 1.78 [.070] .050 BASIC .025 BASIC .2284 .0099 .016 0° .2440 .0196 .050 8° 1.27 BASIC 0.635 BASIC 5.80 0.25 0.40 0° 6.20 0.50 1.27 8° 6X e e1 3X 1.27 [.050] y A C 0.10 [.004] y K x 45° 8X b 0.25 [.010] A1 CAB 8X L 7 8X c NOTES: 1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 2. CONTROLLING DIMENSION: MILLIMETER 3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES]. 4. OUTLINE C ONFORMS TO JEDEC OUTLINE MS-012AA. 5 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006]. 6 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010]. 7 DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO A SUBSTRATE. 8 Lead SOIC 6 01-6027 01-0021 11 (MS-012AA) www.irf.com IR2175(S) & (PbF) LEADFREE PART MARKING INFORMATION Part number IRxxxxxx YWW? ?XXXX Lot Code (Prod mode - 4 digit SPN code) IR logo Date code Pin 1 Identifier ? P MARKING CODE Lead Free Released Non-Lead Free Released Assembly site code Per SCOP 200-002 ORDER INFORMATION Basic Part (Non-Lead Free) 8-Lead PDIP IR2175 order IR2175 8-Lead SOIC IR2175S order IR2175S Leadfree Part 8-Lead PDIP IR2175 order IR2175PbF 8-Lead SOIC IR2175S order IR2175SPbF Thisproduct has been designed and qualified for the industrial market. Qualification Standards can be found on IR’s Web Site http://www.irf.com Data and specifications subject to change without notice. IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: (310) 252-7105 9/6/2004 www.irf.com 7