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IRF7207PBF

IRF7207PBF

  • 厂商:

    IRF

  • 封装:

  • 描述:

    IRF7207PBF - HEXFET® Power MOSFET - International Rectifier

  • 详情介绍
  • 数据手册
  • 价格&库存
IRF7207PBF 数据手册
PD - 95166 IRF7207PbF HEXFET® Power MOSFET Generation 5 Technology P-Channel Mosfet l Surface Mount l Available in Tape & Reel l Dynamic dv/dt Rating l Fast Switching l Lead-Free Description l l S 1 2 3 4 8 7 A D D D D S S G VDSS = -20V RDS(on) = 0.06Ω 6 5 Top View Fifth Generation HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application. SO-8 Absolute Maximum Ratings VDS ID @ TC = 25°C ID @ TC = 70°C IDM PD @TC = 25°C PD @TC = 70°C VGS VGSM EAS dv/dt TJ, TSTG Parameter Drain- Source Voltage Continuous Drain Current, VGS @ -4.5V Continuous Drain Current, VGS @ -4.5V Pulsed Drain Current  Power Dissipation Power Dissipation Linear Derating Factor Gate-to-Source Voltage Gate-to-Source Voltage Single Pulse tp
IRF7207PBF
物料型号: - 型号为IRF7207PbF,是一款来自International Rectifier的HEXFET® Power MOSFET。

器件简介: - IRF7207PbF是一款第五代P沟道MOSFET,采用表面贴装技术。它利用先进的加工技术实现了极低的导通电阻,结合快速开关速度和坚固的器件设计,提供了一个高效可靠的设备,适用于多种应用场景。

引脚分配: - 文档中提到的SO-8封装经过定制的引脚框架改良,具有更好的热特性和多芯片能力,适合各种功率应用。

参数特性: - 绝对最大额定值包含漏源电压、连续漏电流、脉冲漏电流、功率耗散、门源电压等参数。 - 热阻和电性特性在25°C下进行了规定,包括漏源击穿电压、静态漏源导通电阻、门阈值电压等。

功能详解: - IRF7207PbF具有快速开关的能力,能够在多种应用中实现高效率和高可靠性。其SO-8封装设计适用于多种焊接技术,能够在典型PCB安装应用中实现大于0.8W的功率耗散。

应用信息: - 该器件适用于需要高效率和高可靠性的各种功率应用,如电源、电机控制等。

封装信息: - 提供了SO-8封装的详细尺寸信息,符合JEDEC标准。还提供了带卷封装的尺寸信息,符合EIA标准。
IRF7207PBF 价格&库存

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