PD -95651
IRG4BC30FPbF
INSULATED GATE BIPOLAR TRANSISTOR
Features
Fast: optimized for medium operating frequencies ( 1-5 kHz in hard switching, >20 kHz in resonant mode). Generation 4 IGBT design provides tighter parameter distribution and higher efficiency than Generation 3 Industry standard TO-220AB package Lead-Free
C
Fast Speed IGBT
VCES = 600V
G E
VCE(on) typ. = 1.59V
@VGE = 15V, IC = 17A
n-channel
Benefits
Generation 4 IGBTs offer highest efficiency available IGBTs optimized for specified application conditions Designed to be a "drop-in" replacement for equivalent industry-standard Generation 3 IR IGBTs
TO-220AB
Absolute Maximum Ratings
Parameter
VCES IC @ TC = 25°C IC @ TC = 100°C ICM ILM VGE EARV PD @ TC = 25°C PD @ TC = 100°C TJ TSTG Collector-to-Emitter Breakdown Voltage Continuous Collector Current Continuous Collector Current Pulsed Collector Current Clamped Inductive Load Current Gate-to-Emitter Voltage Reverse Voltage Avalanche Energy Maximum Power Dissipation Maximum Power Dissipation Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds Mounting torque, 6-32 or M3 screw.
Max.
600 31 17 120 120 ± 20 10 100 42 -55 to + 150 300 (0.063 in. (1.6mm from case ) 10 lbfin (1.1Nm)
Units
V A
V mJ W °C
Thermal Resistance
Parameter
RθJC RθCS RθJA Wt Junction-to-Case Case-to-Sink, Flat, Greased Surface Junction-to-Ambient, typical socket mount Weight
Typ.
0.5 2.0 (0.07)
Max.
1.2 80
Units
°C/W g (oz)
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1
7/23/04
IRG4BC30FPbF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
V(BR)CES V(BR)ECS
∆V(BR)CES/∆TJ
VCE(ON) VGE(th) ∆VGE(th)/∆TJ gfe ICES IGES
Parameter Min. Typ. Collector-to-Emitter Breakdown Voltage 600 Emitter-to-Collector Breakdown Voltage 18 Temperature Coeff. of Breakdown Voltage 0.69 1.59 Collector-to-Emitter Saturation Voltage 1.99 1.7 Gate Threshold Voltage 3.0 Temperature Coeff. of Threshold Voltage -11 Forward Transconductance
6.1 10 Zero Gate Voltage Collector Current Gate-to-Emitter Leakage Current
Max. Units Conditions V VGE = 0V, IC = 250µA V VGE = 0V, IC = 1.0A V/°C VGE = 0V, IC = 1.0mA VGE = 15V 1.8 IC = 17A IC = 31A See Fig.2, 5 V IC = 17A , TJ = 150°C 6.0 VCE = VGE, IC = 250µA mV/°C VCE = VGE, IC = 250µA S VCE = 100V, IC = 17A 250 VGE = 0V, VCE = 600V µA 2.0 VGE = 0V, VCE = 10V, TJ = 25°C 1000 VGE = 0V, VCE = 600V, TJ = 150°C ±100 n A VGE = ±20V
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Qg Qge Qgc t d(on) tr td(off) tf Eon Eoff Ets t d(on) tr t d(off) tf E ts LE Cies Coes Cres Notes: Parameter Total Gate Charge (turn-on) Gate - Emitter Charge (turn-on) Gate - Collector Charge (turn-on) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Switching Loss Internal Emitter Inductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Min. Typ. Max. Units Conditions 51 77 IC = 17A 7.9 12 nC VCC = 400V See Fig. 8 19 28 VGE = 15V 21 15 TJ = 25°C ns 200 300 IC = 17A, VCC = 480V 180 270 VGE = 15V, RG = 23Ω 0.23 Energy losses include "tail" 1.18 mJ See Fig. 10, 11, 13, 14 1.41 2.0 20 TJ = 150°C, 16 IC = 17A, VCC = 480V ns 290 VGE = 15V, RG = 23Ω 350 Energy losses include "tail" 2.5 mJ See Fig. 13, 14 7.5 nH Measured 5mm from package 1100 VGE = 0V 74 pF VCC = 30V See Fig. 7 14 = 1.0MHz
Repetitive rating; VGE = 20V, pulse width limited by
max. junction temperature. ( See fig. 13b )
VCC = 80%(VCES), VGE = 20V, L = 10µH, RG = 23Ω,
(See fig. 13a)
Pulse width ≤ 80µs; duty factor ≤ 0.1%.
Pulse width 5.0µs, single shot.
Repetitive rating; pulse width limited by maximum
junction temperature.
2
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IRG4BC30FPbF
50 For both:
Triangular wave:
I
40
Load Current ( A )
Duty cycle: 50% TJ = 125°C Tsink = 90°C Gate drive as specified
Power Dissipation = 21W
Clamp voltage: 80% of rated
30 Square wave: 60% of rated voltage 20
I
10 Ideal diodes
0 0.1 1 10
A
100
f, Frequency (kHz)
(For square wave, I=IRMS of fundamental; for triangular wave, I=IPK)
Fig. 1 - Typical Load Current vs. Frequency
1000
1000
IC , Collector-to-Emitter Current (A)
100
TJ = 25°C
IC , Collector-to-Emitter Current (A)
100
TJ = 150°C
TJ = 150°C TJ = 25°C
10
10
1 1
V GE = 15V 20µs PULSE WIDTH A
10
1 5 6 7 8 9
V CC = 50V 5µs PULSE WIDTH A
10 11 12 13
VCE , Collector-to-Emitter Voltage (V)
VGE, Gate-to-Emitter Voltage (V)
Fig. 2 - Typical Output Characteristics www.irf.com
Fig. 3 - Typical Transfer Characteristics 3
IRG4BC30FPbF
40
VGE = 15V
2.5
VCE , Collector-to-Emitter Voltage (V)
Maximum DC Collector Current (A)
VGE = 15V 80µs PULSE WIDTH I C = 34A
30
2.0
20
I C = 17A
1.5
10
I C = 8.5A
0 25 50 75 100 125 150
1.0 -60 -40 -20 0 20 40 60 80
A
100 120 140 160
TC , Case Temperature (°C)
TJ , Junction Temperature (°C)
Fig. 4 - Maximum Collector Current vs. Case Temperature
Fig. 5 - Typical Collector-to-Emitter Voltage vs. Junction Temperature
10
Thermal Response (Z thJC )
1
D = 0.50
0.20 0.10
P DM
0.1
0.05 0.02 0.01 SINGLE PULSE (THERMAL RESPONSE)
t
1 t2
Notes: 1. Duty factor D = t
1
/t
2
0.01 0.00001
2. Peak TJ = PDM x Z thJC + T C
0.0001
0.001
0.01
0.1
1
10
t 1 , Rectangular Pulse Duration (sec)
Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-Case 4 www.irf.com
IRG4BC30FPbF
2000 VGE = 0V f = 1 MHz Cies = Cge + Cgc + Cce Cres = Cce Coes = Cce + Cgc
20
SHORTED
VCE = 400V I C = 17A
1600
VGE , Gate-to-Emitter Voltage (V)
16
C, Capacitance (pF)
1200
Cies
12
800
8
Coes
400
4
Cres
0 1 10
A
100
0 0 10 20 30 40 50
A
60
VCE, Collector-to-Emitter Voltage (V)
Qg , Total Gate Charge (nC)
Fig. 7 - Typical Capacitance vs. Collector-to-Emitter Voltage
Fig. 8 - Typical Gate Charge vs. Gate-to-Emitter Voltage
1.50
Total Switching Losses (mJ)
Total Switching Losses (mJ)
VCC VGE TJ IC
= 480V = 15V = 25°C = 17A
10
RG = 23 Ω VGE = 15V VCC = 480V I C = 34A
1.45
I C = 17A
1
1.40
I C = 8.5A
1.35
1.30 0 10 20 30 40 50
A
60
0.1 -60 -40 -20 0 20 40 60 80
A 100 120 140 160
R G, Gate Resistance ( Ω)
TJ , Junction Temperature (°C)
Fig. 9 - Typical Switching Losses vs. Gate Resistance www.irf.com
Fig. 10 - Typical Switching Losses vs. Junction Temperature 5
IRG4BC30FPbF
6.0
Total Switching Losses (mJ)
5.0
4.0
I C , Collector-to-Emitter Current (A)
RG TJ V CC V GE
= 23 Ω = 150°C = 480V = 15V
1000
VGE = 20V GE TJ = 125°C
100
SAFE OPERATING AREA
3.0
2.0
10
1.0
0.0 0 10 20 30
A 40
1 1 10 100 1000
IC , Collector-to-Emitter Current (A)
VCE , Collector-to-Emitter Voltage (V)
Fig. 11 - Typical Switching Losses vs. Collector-to-Emitter Current
Fig. 12 - Turn-Off SOA
6
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IRG4BC30FPbF
L 50V 1000V VC *
D.U.T.
RL = 0 - 480V
480V 4 X IC@ 25°C
c
480µF 960V
d
* Driver same type as D.U.T.; Vc = 80% of Vce(max) * Note: Due to the 50V power supply, pulse width and inductor will increase to obtain rated Id.
Fig. 13a - Clamped Inductive
Load Test Circuit
Fig. 13b - Pulsed Collector
Current Test Circuit
IC L Driver* 50V D.U.T. VC
Fig. 14a - Switching Loss
Test Circuit
* Driver same type as D.U.T., VC = 480V
Ã
1000V
d
e
c d
90%
e
VC 90%
10%
t d(off)
Fig. 14b - Switching Loss
Waveforms
10% I C 5% t d(on)
tr E on E ts = (Eon +Eoff )
tf t=5µs E off
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IRG4BC30FPbF
TO-220AB Package Outline
Dimensions are shown in millimeters (inches)
10.54 (.415) 10.29 (.405) 3.78 (.149) 3.54 (.139) -A6.47 (.255) 6.10 (.240) -B4.69 (.185) 4.20 (.165) 1.32 (.052) 1.22 (.048)
2.87 (.113) 2.62 (.103)
4 15.24 (.600) 14.84 (.584)
LEAD ASSIGNMENTS
1.15 (.045) MIN 1 2 3 LEAD ASSIGNMENTS IGBTs, CoPACK 1 - GATE 2 1- GATE- DRAIN 1- GATE 32- DRAINSOURCE 2- COLLECTOR 3- SOURCE 3- EMITTER 4 - DRAIN
HEXFET
14.09 (.555) 13.47 (.530)
4- DRAIN
4.06 (.160) 3.55 (.140)
4- COLLECTOR
3X 3X 1.40 (.055) 1.15 (.045)
0.93 (.037) 0.69 (.027) M BAM
3X
0.55 (.022) 0.46 (.018)
0.36 (.014)
2.54 (.100) 2X NOTES: 1 DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION : INCH
2.92 (.115) 2.64 (.104)
3 OUTLINE CONFORMS TO JEDEC OUTLINE TO-220AB. 4 HEATSINK & LEAD MEASUREMENTS DO NOT INCLUDE BURRS.
TO-220AB Part Marking Information
E X AMPL E : T H IS IS AN IR F 1010 L OT CODE 1789 AS S E MB L E D ON WW 19, 1997 IN T H E AS S E MB L Y L INE "C" INT E R NAT IONAL R E CT IF IE R L OGO AS S E MB L Y L OT CODE P AR T NU MB E R
Note: " P" in assembly line position indicates "Lead-Free"
DAT E CODE YE AR 7 = 1997 WE E K 19 L INE C
Data and specifications subject to change without notice.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information. 07/04
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