PD -96225
IRG4PH50S-EPbF
INSULATED GATE BIPOLAR TRANSISTOR
Features
Standard: Optimized for minimum saturation voltage and low operating frequencies ( < 1kHz) Generation 4 IGBT design provides tighter parameter distribution and higher efficiency than Generation 3 Industry standard TO-247AC package Lead-Free
C
Standard Speed IGBT
VCES =1200V
G E
VCE(on) typ. = 1.47V
@VGE = 15V, IC = 33A
n-channel
C
Benefits
Generation 4 IGBT's offer highest efficiency available IGBT's optimized for specified application conditions Designed to be a "drop-in" replacement for equivalent industry-standard Generation 3 IR IGBT's
E GC TO-247AD IRG4PH50S-EPbF
Absolute Maximum Ratings
Parameter
VCES IC@ TC = 25°C IC@ TC = 100°C ICM ILM VGE EARV PD @ TC =25° PD @ TC =100° TJ TSTG Collector-to-Emitter Voltage Continuous Collector Current Continuous Collector Current Pulsed Collector Current Clamped Inductive Load Current 1200 57 33 114 114 ± 20 ± 30 270 200 80 -55 to + 150 300 (0.063 in. (1.6mm) from case) 10 lbf·in (1.1 N·m)
Max.
Units
V A
c
d e
Gate-to-Emitter Voltage Transient Gate-to-Emitter Voltage Reverse Voltage Avalanche Energy Maximum Power Dissipation Maximum Power Dissipation Operating Junction and Storage Temperature Range Soldering Temperature, for 10 sec.
V mJ W °C
Mounting Torque, 6-32 or M3 Screw.
Thermal Resistance
Parameter
RθJC RθCS RθJA Wt Junction-to-Case Case-to-Sink, Flat, Greased Surface Junction-to-Ambient, typical socket mount Weight
Min.
— — — —
Typ.
—
Max.
0.64
—
Units
°C/W g (oz)
0.24
—
40
—
6.0(0.21)
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1
02/09/09
IRG4PH50S-EPbF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
V(BR)CES V(BR)ECS Parameter Min. Typ. Collector-to-Emitter Breakdown Voltage 1200 — Emitter-to-Collector Breakdown Voltage 18 — ∆V(BR)CES/∆TJ Temperature Coeff. of Breakdown Voltage — 1.22 — 1.47 Collector-to-Emitter Saturation Voltage — 1.75 VCE(ON) — 1.55 VGE(th) Gate Threshold Voltage 3.0 — DVGE(th)/DTJ Temperature Coeff. of Threshold Voltage — -11 gfe Forward Transconductance
27 40 — — ICES Zero Gate Voltage Collector Current — — — — IGES Gate-to-Emitter Leakage Current — — Max. Units Conditions — V VGE = 0V, IC = 250µA — V VGE = 0V, IC = 1.0 A — V/°C VGE = 0V, IC = 2.0 mA 1.7 IC = 33A VGE = 15V — IC = 57A See Fig.2, 5 V — IC = 33A , TJ = 150°C 6.0 VCE = VGE, IC = 250µA — mV/°C VCE = VGE, IC = 250µA — S VCE = 100V, IC = 33A 250 VGE = 0V, VCE = 1200V µA 2.0 VGE = 0V, VCE = 10V, TJ = 25°C 1000 VGE = 0V, VCE = 1200V, TJ = 150°C ±100 nA VGE = ±20V
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Qg Qge Q gc td(on) tr td(off) tf Eon Eoff Ets td(on) tr td(off) tf Ets LE Cies Coes Cres Notes: Parameter Total Gate Charge (turn-on) Gate - Emitter Charge (turn-on) Gate - Collector Charge (turn-on) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Switching Loss Internal Emitter Inductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Min. — — — — — — — — — — — — — — — — — — — Typ. 167 25 55 32 29 845 425 1.80 19.6 21.4 32 30 1170 1000 37 13 3600 160 30 Max. Units Conditions 251 IC = 33A 38 nC VCC = 400V See Fig. 8 83 VGE = 15V — — TJ = 25°C ns 1268 IC = 33A, VCC = 960V 638 VGE = 15V, RG = 5.0Ω — Energy losses include "tail" — mJ See Fig. 9, 10, 14 44 — TJ = 150°C, — IC = 33A, VCC = 960V ns — VGE = 15V, RG = 5.0Ω — Energy losses include "tail" — mJ See Fig. 10,11,14 — nH Measured 5mm from package — VGE = 0V — pF VCC = 30V See Fig. 7 — ƒ = 1.0MHz
Repetitive rating; VGE = 20V, pulse width limited by
max. junction temperature. ( See fig. 13b ) (See fig. 13a)
Pulse width ≤ 80µs; duty factor ≤ 0.1%.
Pulse width 5.0µs, single shot.
VCC = 80%(VCES), VGE = 20V, L = 10µH, RG = 5.0Ω, Repetitive rating; pulse width limited by maximum
junction temperature.
2
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IRG4PH50S-EPbF
For both:
Triangular wave:
60
Load Current (A)
Duty cycle: 50% TJ = 125°C Tsink= 90°C Gate drive as specified Power Dissipation = 40W
Clamp voltage: 80% of rated
40
Square wave: 60% of rated voltage
20
Ideal diodes
0 0.1 1
A
10
f, Frequency (kHz)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = IRMS of fundamental)
1000
1000
TJ = 25 °C
100
TJ = 150 °C
I C , Collector-to-Emitter Current (A)
I C, Collector-to-Emitter Current (A)
100
TJ = 150 °C
10
10
TJ = 25 °C
1 0.0
V GE = 15V 80µs PULSE WIDTH
1.0 2.0 3.0 4.0 5.0
1
V CC = 50V 5µs PULSE WIDTH
5 6 7 8 9 10 11 12
VCE , Collector-to-Emitter Voltage (V)
VGE , Gate-to-Emitter Voltage (V)
Fig. 2 - Typical Output Characteristics
Fig. 3 - Typical Transfer Characteristics
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3
IRG4PH50S-EPbF
60
2.5
50
VCE , Collector-to-Emitter Voltage(V)
VGE = 15V 80 us PULSE WIDTH IC = 66 A
Maximum DC Collector Current(A)
40
2.0
30
IC = 33 A
1.5
20
10
IC =16.5 A
0
25
50
75
100
125
150
1.0 -60 -40 -20
0
20
40
60
80 100 120 140 160
TC , Case Temperature ( °C)
TJ , Junction Temperature ( °C)
Fig. 4 - Maximum Collector Current vs. Case Temperature
Fig. 5 - Typical Collector-to-Emitter Voltage vs. Junction Temperature
1
Thermal Response (Z thJC )
0.50 0.20 0.1 0.10 0.05 0.02 0.01 SINGLE PULSE (THERMAL RESPONSE) PDM t1 t2 Notes: 1. Duty factor D = t 1 / t 2 2. Peak TJ = PDM x Z thJC + TC 0.0001 0.001 0.01 0.1 1
0.01
0.001 0.00001
t1 , Rectangular Pulse Duration (sec)
Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
4
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IRG4PH50S-EPbF
7000 6000
Cies
VGE , Gate-to-Emitter Voltage (V)
100
VGE = 0V, f = 1MHz Cies = Cge + Cgc , Cce SHORTED Cres = Cgc Coes = Cce + Cgc
20
VCC = 400V I C = 33A
C, Capacitance (pF)
5000 4000
15
Coes
3000 2000 1000 0
10
Cres
5
1
10
0
0
25
50
75
100
125
150
175
VCE , Collector-to-Emitter Voltage (V)
QG , Total Gate Charge (nC)
Fig. 7 - Typical Capacitance vs. Collector-to-Emitter Voltage
Fig. 8 - Typical Gate Charge vs. Gate-to-Emitter Voltage
25.0
Total Switching Losses (mJ)
24.0
Total Switching Losses (mJ)
V CC = 960V V GE = 15V TJ = 25 °C I C = 33A
1000
5Ω RG = 15 Ω 5Ohm VGE = 15V VCC = 960V
100
IC = 66 A IC = 33 A IC = 16.5 A
23.0
10
22.0
21.0
0
10
20
30
40
50
1 -60 -40 -20
0
20
40
60
80 100 120 140 160
RG , Gate Resistance ) RG , Gate Resistance ( Ω(Ohm)
TJ , Junction Temperature (° C )
Fig. 9 - Typical Switching Losses vs. Gate Resistance
Fig. 10 - Typical Switching Losses vs. Junction Temperature
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IRG4PH50S-EPbF
120
Total Switching Losses (mJ)
80
60
I C , Collector Current (A)
RG TJ VCC 100 VGE
= 5Ω 5Ohm = 150 ° C = 960V = 15V
1000
VGE = 20V T J = 125 oC
100
40
10
20
0
0
10
20
30
40
50
60
70
1
SAFE OPERATING AREA
1 10 100 1000 10000
I C , Collector Current (A)
VCE , Collector-to-Emitter Voltage (V)
Fig. 11 - Typical Switching Losses vs. Collector-to-Emitter Current
Fig. 12 - Reverse Bias SOA
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IRG4PH50S-EPbF
L 50V 1000V VC *
0-960V
D.U.T.
RL =
960V 4 X IC@25°C
c
480µF 960V
d
* Driver same type as D.U.T.; Vc = 80% of Vce(max) * Note: Due to the 50V power supply, pulse width and inductor will increase to obtain rated Id.
Fig. 13a - Clamped Inductive
Load Test Circuit
Fig. 13b - Pulsed Collector
Current Test Circuit
IC L Driver* 50V 1000V VC D.U.T.
Fig. 14a - Switching
Loss Test Circuit
* Driver same type as D.U.T., VC = ----V
Ã
d
e
Fig. 14b - Switching Loss
Waveforms
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IRG4PH50S-EPbF
TO-247AD Package Outline (Dimensions are shown in millimeters (inches))
TO-247AD Part Marking Information
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TO-247AD package is not recommended for Surface Mount Application. Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/ Data and specifications subject to change without notice.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information.02/2009
8
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