PD - 97426
INSULATED GATE BIPOLAR TRANSISTOR Features
• • • • • • • • • Low VCE (ON) Trench IGBT Technology Low Switching Losses Maximum Junction Temperature 175 °C 5 µS short circuit SOA Square RBSOA 100% of The Parts Tested for ILM Positive VCE (ON) Temperature Coefficient Tight Parameter Distribution Lead Free Package
IRGP4069PbF IRGP4069-EPbF
C
VCES = 600V IC(Nominal) = 35A
G E
tSC ≥ 5µs, TJ(max) = 175°C
n-channel
VCE(on) typ. = 1.6V
Benefits
• High Efficiency in a Wide Range of Applications • Suitable for a Wide Range of Switching Frequencies due to Low VCE (ON) and Low Switching Losses • Rugged Transient Performance for Increased Reliability • Excellent Current Sharing in Parallel Operation
C
C
GC
E
TO-247AC IRGP4069PbF
E GC TO-247AD IRGP4069-EPbF
G Gate
C Collector
E Emitter
Absolute Maximum Ratings
Parameter
VCES IC @ TC = 25°C IC @ TC = 100°C INOMINAL ICM ILM VGE PD @ TC = 25°C PD @ TC = 100°C TJ TSTG Collector-to-Emitter Voltage Continuous Collector Current Continuous Collector Current Nominal Current Pulse Collector Current, VGE = 15V Clamped Inductive Load Current, VGE = 20V Continuous Gate-to-Emitter Voltage Transient Gate-to-Emitter Voltage Maximum Power Dissipation Maximum Power Dissipation Operating Junction and Storage Temperature Range Soldering Temperature, for 10 sec. Mounting Torque, 6-32 or M3 Screw 300 (0.063 in. (1.6mm) from case) 10 lbf·in (1.1 N·m)
Max.
600 76 50 35 105 140 ±20 ±30 268 134 -55 to +175
Units
V
c
A V W
°C
Thermal Resistance
Parameter
RθJC RθCS RθJA Thermal Resistance Junction-to-Case
f
Min.
––– ––– –––
Typ.
––– 0.24 40
Max.
0.56 ––– –––
Units
°C/W
Thermal Resistance, Case-to-Sink (flat, greased surface) Thermal Resistance, Junction-to-Ambient (typical socket mount)
1
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10/02/09
IRGP4069PbF/IRGP4069-EPbF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
V(BR)CES
∆V(BR)CES/∆TJ
Min.
600 — — — — 4.0 — — — — —
Typ.
— 1.3 1.6 1.9 2.0 — -18 25 1.0 770 —
Max.
— — 1.85 — — 6.5 — — 20 — ±100
Units
V
Conditions
VGE = 0V, IC = 100µA
Collector-to-Emitter Breakdown Voltage
Temperature Coeff. of Breakdown Voltage
e d d = 175°C d
mV/°C VGE = 0V, IC = 1mA (25°C-175°C) IC = 35A, VGE = 15V, TJ = 25°C V V IC = 35A, VGE = 15V, TJ = 150°C IC = 35A, VGE = 15V, TJ VCE = VGE, IC = 1.0mA
VCE(on) VGE(th)
∆VGE(th)/∆TJ
Collector-to-Emitter Saturation Voltage Gate Threshold Voltage Threshold Voltage temp. coefficient Forward Transconductance Collector-to-Emitter Leakage Current Gate-to-Emitter Leakage Current
gfe ICES IGES
mV/°C VCE = VGE, IC = 1.0mA (25°C - 175°C) VCE = 50V, IC = 35A, PW = 60µs S µA nA VGE = 0V, VCE = 600V VGE = 0V, VCE = 600V, TJ = 175°C VGE = ±20V
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Qg Qge Qgc Eon Eoff Etotal td(on) tr td(off) tf Eon Eoff Etotal td(on) tr td(off) tf Cies Coes Cres RBSOA SCSOA Total Gate Charge (turn-on) Gate-to-Emitter Charge (turn-on) Gate-to-Collector Charge (turn-on) Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Turn-On delay time Rise time Turn-Off delay time Fall time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Turn-On delay time Rise time Turn-Off delay time Fall time Input Capacitance Output Capacitance Reverse Transfer Capacitance Reverse Bias Safe Operating Area Short Circuit Safe Operating Area
Min.
— — — — — — — — — — — — — — — — — — — —
Typ.
69 18 29 390 632 1022 46 33 105 44 1013 929 1942 43 35 127 61 2113 197 65
Max.
104 27 44 508 753 1261 56 42 117 54 — — — — — — — — — —
Units
IC = 35A nC VGE = 15V VCC = 400V
Conditions
IC = 35A, VCC = 400V, VGE = 15V µJ RG = 10Ω, L = 200µH, LS = 150nH, TJ = 25°C
Energy losses include tail & diode reverse recovery
IC = 35A, VCC = 400V, VGE = 15V ns RG = 10Ω, L = 200µH, LS = 150nH, TJ = 25°C
IC = 35A, VCC = 400V, VGE=15V µJ RG=10Ω, L=200µH, LS=150nH, TJ = 175°C
Energy losses include tail & diode reverse recovery
IC = 35A, VCC = 400V, VGE = 15V ns RG = 10Ω, L = 200µH, LS = 150nH TJ = 175°C pF VGE = 0V VCC = 30V f = 1.0Mhz TJ = 175°C, IC = 140A VCC = 480V, Vp =600V Rg = 10Ω, VGE = +20V to 0V
FULL SQUARE 5 — — µs
VCC = 400V, Vp =600V Rg = 10Ω, VGE = +15V to 0V
Notes: VCC = 80% (VCES), VGE = 20V, L = 19µH, RG = 10Ω. Pulse width limited by max. junction temperature. Refer to AN-1086 for guidelines for measuring V(BR)CES safely. Rθ is measured at TJ of approximately 90°C.
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IRGP4069PbF/IRGP4069-EPbF
80 70 60 50 40 30 20 10 0 25 50 75 100 T C (°C) 125 150 175
300 250 200
Ptot (W)
IC (A)
150 100 50 0 25 50 75 100 T C (°C) 125 150 175
Fig. 1 - Maximum DC Collector Current vs. Case Temperature
1000
Fig. 2 - Power Dissipation vs. Case Temperature
1000
100 100µsec 10µsec 100
IC (A)
10
1msec DC
IC (A)
10 1 1000
1 Tc = 25°C Tj = 175°C Single Pulse 0.1 1 10 VCE (V) 100 10 100 VCE (V) 1000
Fig. 3 - Forward SOA TC = 25°C, TJ ≤ 175°C; VGE =15V
140 120 100 VGE = 18V VGE = 15V VGE = 12V VGE = 10V VGE = 8.0V
ICE (A)
Fig. 4 - Reverse Bias SOA TJ = 175°C; VGE =20V
140 120 100 80 60 40 20 0 VGE = 18V VGE = 15V VGE = 12V
ICE (A)
80 60 40 20 0 0 2 4
VGE = 10V VGE = 8.0V
6
8
10
0
2
4
6
8
10
Fig. 5 - Typ. IGBT Output Characteristics TJ = -40°C; tp = ≤60µs
VCE (V)
Fig. 6 - Typ. IGBT Output Characteristics TJ = 25°C; tp = ≤60µs
VCE (V)
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3
IRGP4069PbF/IRGP4069-EPbF
140 120 100 VGE = 18V VGE = 15V VGE = 12V VGE = 10V VGE = 8.0V
20 18 16 14
VCE (V)
ICE (A)
80 60 40 20 0 0
12 10 8 6 4 2 0
ICE = 18A ICE = 35A ICE = 70A
2
4
6
8
10
5
10 VGE (V)
15
20
VCE (V)
Fig. 7 - Typ. IGBT Output Characteristics TJ = 175°C; tp = ≤60µs
20 18 16 14 20 18 16 14
Fig. 8 - Typical VCE vs. VGE TJ = -40°C
VCE (V)
VCE (V)
12 10 8 6 4 2 0 5 10
ICE = 18A ICE = 35A ICE = 70A
12 10 8 6 4 2 0
ICE = 18A ICE = 35A ICE = 70A
15 VGE (V)
20
5
10 VGE (V)
15
20
Fig. 9 - Typical VCE vs. VGE TJ = 25°C
140
IC, Collector-to-Emitter Current (A)
Fig. 10 - Typical VCE vs. VGE TJ = 175°C
4000 3500
120 100 80 60 40 20 0 4 5 6 7 8 9 10 11 12 13 14 VGE, Gate-to-Emitter Voltage (V) T J = 175°C TJ = 25°C
3000
Energy (µJ)
2500 2000 1500 1000 500 0 0 10 20 30
EON
EOFF
40
50
60
70
IC (A)
Fig. 11 - Typ. Transfer Characteristics VCE = 50V; tp = 60µs
Fig. 12 - Typ. Energy Loss vs. IC TJ = 175°C; L = 200µH; VCE = 400V, RG = 10Ω; VGE = 15V
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IRGP4069PbF/IRGP4069-EPbF
1000
3000 2500
Swiching Time (ns)
EON
Energy (µJ)
tdOFF 100 tF
2000 EOFF 1500
tdON tR 10 0 10 20 30 40 50 60 70 IC (A)
1000
500 0 25 50 Rg ( Ω) 75 100
Fig. 13 - Typ. Switching Time vs. IC TJ = 175°C; L = 200µH; VCE = 400V, RG = 10Ω; VGE = 15V
1000
Fig. 14 - Typ. Energy Loss vs. RG TJ = 175°C; L = 210µH; VCE = 400V, ICE = 35A; VGE = 15V
20 Isc 15 300
Swiching Time (ns)
Tsc
225
Current (A)
Time (µs)
tdOFF 100 tF
10
150
tdON
5
tR 10 0 10 20 30 40 50 RG ( Ω)
75
0 8 10 12 14 16 18 VGE (V)
0
Fig. 15 - Typ. Switching Time vs. RG TJ = 175°C; L = 210µH; VCE = 400V, ICE = 35A; VGE = 15V
10000
Fig. 16 - VGE vs. Short Circuit Time VCC = 400V; TC = 25°C
Cies
Capacitance (pF)
1000
100
Coes Cres
10 0 100 200 300 400 500 VCE (V)
Fig. 17 - Typ. Capacitance vs. VCE VGE= 0V; f = 1MHz
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5
IRGP4069PbF/IRGP4069-EPbF
16
VGE, Gate-to-Emitter Voltage (V)
14 12 10 8 6 4 2 0 0 10 20
VCES = 400V VCES = 300V
30
40
50
60
70
Q G, Total Gate Charge (nC)
Fig. 18 - Typical Gate Charge vs. VGE ICE = 35A; L = 740µH
1
D = 0.50
Thermal Response ( Z thJC )
0.1
0.20 0.10 0.05
τJ R1 R1 τJ τ1 τ2 R2 R2 R3 R3 τ3 R4 R4 τC τ τ1 τ2 τ3 τ4 τ4
Ri (°C/W)
0.01041 0.15911 0.23643 0.15465
0.000006 0.002035
τi (sec)
0.01
0.02 0.01
0.000142 0.013806
Ci= τi/Ri Ci i/Ri
SINGLE PULSE ( THERMAL RESPONSE ) 0.001 1E-006 1E-005 0.0001 0.001
Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthjc + Tc 0.01 0.1
t1 , Rectangular Pulse Duration (sec)
Fig 19. Maximum Transient Thermal Impedance, Junction-to-Case (IGBT)
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IRGP4069PbF/IRGP4069-EPbF
L
L
0
DUT 1K
VCC
80 V +
-
DUT Rg
VCC
Fig.C.T.1 - Gate Charge Circuit (turn-off)
Fig.C.T.2 - RBSOA Circuit
diode clamp / DUT L
4X DC DUT VCC
-5V DUT / DRIVER Rg VCC
SCSOA
Fig.C.T.3 - S.C. SOA Circuit Fig.C.T.4 - Switching Loss Circuit
C force
R=
V CC ICM
100K D1
DUT
Rg
22K
C sens e
VCC
G force
DUT
0.0075µF
E sense
E force
Fig.C.T.5 - Resistive Load Circuit Fig.C.T.6 - BVCES Filter Circuit
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7
IRGP4069PbF/IRGP4069-EPbF
600 500 400
90% ICE
60 tf 50 40 30 20
5% V CE
600 500 400
ICE (A)
TEST CURRENT
60 50 40 30
tr
VCE (V)
V CE (V)
200 100 0
Eoff Loss
200 100 0 -100 6.4 6.6 6.8
10% test current
90% test current 5% V CE
20 10 0 -10
5% ICE
10 0 -10
-100 -0.5
Eon Loss 7 7.2
0
0.5
1
1.5
2
time(µs)
Fig. WF1 - Typ. Turn-off Loss Waveform @ TJ = 175°C using Fig. CT.4
time (µs)
Fig. WF2 - Typ. Turn-on Loss Waveform @ TJ = 175°C using Fig. CT.4
700 600 500 400 Vce (V) 300 200 100 0 -100 -4.5 VCE ICE
350 300 250 200 150 100 50 0 -50 0.5 5.5 Time (uS)
Fig. WF3 - Typ. S.C. Waveform @ TJ = 25°C using Fig. CT.3
10.5
8
ICE (A)
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ICE (A)
300
300
IRGP4069PbF/IRGP4069-EPbF
Dimensions are shown in millimeters (inches)
TO-247AC Package Outline
TO-247AC Part Marking Information
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TO-247AC package is not recommended for Surface Mount Application. Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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IRGP4069PbF/IRGP4069-EPbF
TO-247AD Package Outline
Dimensions are shown in millimeters (inches)
TO-247AD Part Marking Information
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rrÅ DIU@SI6UDPI6G S@8UDAD@S GPBP 6TT@H7G` GPUÃ8P9@ Q6SUÃIVH7@S
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TO-247AD package is not recommended for Surface Mount Application. Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ Data and specifications subject to change without notice. This product has been designed and qualified for Industrial market. Qualification Standards can be found on IR’s Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information. 10/09
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