IRMD22141SS

Datasheet rev 2.1 IRMD22141SS IRMD22141SS Demo Board For 3-phase / 380V motor drives • • • • • • • • • • • • • • IRMD22141SS Demo Board Up to 1200V DC-bus capability Up to 50A maximum phase current Optional on-board phase shunt resistors 3 x IR22141SS devices connected in 3phase configuration On-board bootstrap supply for high-side gate drive Full protection of phase-to-phase, DC-bus and ground short circuit by monitoring IGBT de-saturation Fault feedback to ground level Internal minimum dead time Anti-shoot-through management Undervoltage lockout 3.3V digital input/output CMOS compatible Power Module Standard ECONO2-6PACK IGBT module compatible IGBT short circuit rated up to 1200V/50A. Easy to mount heat-sink IR22141SS Demo Board (Shown with optional IGBT Power Module) The IRMD22141SS demo board is an evaluation board for IR22141SS gate driver. With three connected IR22141SS (see the device datasheet), IRMD22141SS is designed to drive 3-phase power modules with pin-out compatible to ECONO2-6PACK. The board can drive AC or Brushless motors using power modules with up to 50A output current. The board is a flexible solution for different applications and can be customized providing place for external components. The control signals are 3.3V CMOS compatible; threephase shunt resistor (with sensing pins) can be placed for current loop control; power module short circuits are managed synchronizing the IGBT turn off in a local network. Board layout reduces the noise coupling between high and low voltage signals and EM emissions. IRMD2214SS + Power Module INTRODUCTION Application Block Diagram (Refer to connections section to know the interface pins) This diagram shows the main blocks and connections of the demo board and the external components necessary in a typical motor drive application. DCbus AC/DC Conveter Low Voltage Power Supply IR22141SS 3-phase half bridge (Power Module) shunt resistor shunt resistor shunt resistor IR22141SS Motor System Control IR22141SS 3-phase Current Sensor www.irf.com page 1/22 Sep 9 , 2004 th Datasheet rev 2.1 IRMD22141SS Table of contents INTRODUCTION .........................................................................................................................................1 Table of contents......................................................................................................................................2 Table of figures ........................................................................................................................................2 The IR22141SS........................................................................................................................................3 The power module ...................................................................................................................................3 Important Notice.......................................................................................................................................3 BOARD CONNECTORS .............................................................................................................................4 Connection with the system controller .....................................................................................................4 FAULT/SD logic signal .............................................................................................................................5 VCC supply pin ........................................................................................................................................5 VSS ground pin (GND).............................................................................................................................5 Connecting the current sensors ...............................................................................................................5 High power signal connector....................................................................................................................6 Connecting the power module .................................................................................................................6 Test Points ...............................................................................................................................................7 TEST BENCH CONNECTION ....................................................................................................................7 OPERATING DESCRIPTION......................................................................................................................8 Power on sequence .................................................................................................................................8 Normal operating mode............................................................................................................................8 Fault management ...................................................................................................................................8 Multilevel board solution...........................................................................................................................9 BOARD SOLUTIONS................................................................................................................................10 Bootstrap circuit .....................................................................................................................................10 Gate resistances ....................................................................................................................................10 OTHER EXTRA COMPONENTS ..............................................................................................................11 Desat circuit ...........................................................................................................................................11 Clamping Diode for Vs below ground ....................................................................................................11 RC filter on com pin................................................................................................................................12 Fast diode between gate and supply pin ...............................................................................................13 Zener diode to preserve the IGBT gate .................................................................................................13 Optional output shunt resistor ................................................................................................................14 Resistor on vcc ........................................................................................................................................14 BILL OF MATERIAL .................................................................................................................................15 SCHEMATIC .............................................................................................................................................16 LAYOUT ....................................................................................................................................................16 LAYOUT ....................................................................................................................................................17 Table of figures Figure 1: TOP image of board .....................................................................................................................4 Figure 2: LED connection ............................................................................................................................5 Figure 3: Test bench connection .................................................................................................................7 Figure 4: Power on sequence......................................................................................................................8 Figure 5: Three phase connection...............................................................................................................9 Figure 6: Example of a desaturation detection event ..................................................................................9 Figure 7: Bootstrap circuit..........................................................................................................................10 Figure 8: Desat external filter ....................................................................................................................11 Figure 9: -Vs clamp ....................................................................................................................................12 Figure 10: COM below ground protection..................................................................................................12 Figure 11: Collector-Gate current protection .............................................................................................13 Figure 12: Zener clamp for IGBT gate.......................................................................................................13 www.irf.com page 2/22 Sep 9 , 2004 th Datasheet rev 2.1 IRMD22141SS Parameters Values Description, condition DCBus voltage positive with 1200V power module DCbus voltage negative Low voltage power supply. Follow IR22141 datasheet for supply setting Low voltage ground quiescent Vcc current max phase dc output current see “Board Connectors” section on page 4 Input Power DC+ DCVcc Vss Icc Output Power Ilmax Control Inputs/Outputs 40 pin connector J1 I/Os 3.3V to 15V compatible 50A @25C 0 to 1200V ground 15V typ ground 100 mA The IR22141SS is a half bridge gate driver suited for power switching applications. The high side driver can float up to 1200V. The IR22141SS have a high gate driving capability (2A source and 3A sink) with a low quiescent current. The device is designed to manage all the half-bridge faults by turning off smoothly the desaturated transistor through the dedicated soft shut down pin preventing over-voltages and reducing EM emissions. In a multi-phase system the drivers communicate using a dedicated local network (SY_FLT and FAULT/SD signals) to properly manage phase-to-phase short circuits. The system controller may force shutdown or read device fault state through the 3.3 V compatible CMOS I/O pin (FAULT/SD). To improve the signal immunity from DC-bus noise, the control and power ground use dedicated pins enabling low-side emitter current sensing as well. Undervoltage conditions in floating and low voltage circuits are managed independently. For further technical information see the IR2214/IR22141 datasheet at http://www.irf.com. IRMD22141SS demo board is ECONO2 compatible with SixPack™ standard pin out. The IR22141SS The power module mentioned power module. It is strongly recommended to customize the demo board to fit the application requirements for the power module that has been chosen. Suggestions on passive sizing are also present in “Design Tips: Using monolithic high voltage gate drivers”. IRMD22141SS demo board is supplied with a Bill Of Material suitable for a 1200V/50A@100C power module. The BOM presented on page 15 provides a suggestion for the above Important Notice www.irf.com page 3/22 Sep 9 , 2004 th Datasheet rev 2.1 IRMD22141SS BOARD CONNECTORS P1 P2 P3 J1 Figure 1: TOP image of board On board there is a 40 pins connector for the control signals. The driver board uses only 17 pins. The remaining pins are for the sensing board (IRCS2277S) that can be connected on top of IRMD22141SS board. CONNECTOR J1 HIN1 LIN1 HIN2 LIN2 HIN3 LIN3 FLT_CLR FAULT/SD VCC VSS 1 2 12 13 24 25 3 5/6 37 - 40 17 - 20 Table 1: 40-pin connector J1 Input logical signals HIN1, LIN1, HIN2, LIN2, HIN3, LIN3 and FLT_CLR: These logic inputs are 3.3 V compatible CMOS I/O port. The logic signals are active high with internal pull-down resistor of 10 kOhm. When both HIN and LIN of the same phase are active at the same time an internal anti-shot trough circuit turns off the output drivers. HIN turns on the high side IGBT while LIN the low side. www.irf.com page 4/22 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 Connection with the system controller Sep 9 , 2004 th Datasheet rev 2.1 IRMD22141SS FLT_CLR is active high and it is used to reset the fault state of all devices (see also the Fault management section and the IR22141SS datasheet). This is an input/output logic signal, 3.3 V compatible CMOS I/O port. The logic signal is active low, tied to connector VCC with a 10 k pull-up resistor. As an input, the signal shuts down (SD) all the drivers; as an output, it reports the power module fault (IGBT desaturation detection) or the VCC undervoltage (see also IR22141SS datasheet for more information). On board a red LED (DL2) indicates when the signal is active; Figure 2a shows the connection. This is the supply pin for all the devices. On board a green LED (DL1) indicates the supply power on; Figure 2b shows the connection. VCC 15k VCC 15k FAULT/SD logic signal VCC supply pin Red FAULT/SD (a) GND (b) Green Figure 2: LED connection The board ground is connected to the power module DC- pin. The VSS pin of the connector and the devices ground pin are star-connected to the DC- pin. DC- star connection has been chosen to reduce the noise coupled from the floating signals. VSS ground pin (GND) Connecting the current sensors P1, P2 and P3 are connected with the optional shunt resistors placed on the phase output nodes. CONNECTOR P1 SHU+ 1 (motor side) SHU2 (power module side) U SHV+ (motor side) SHV(power module side) V 3 CONNECTOR P2 1 2 3 1 2 3 1 2 3 CONNECTOR P3 SHW+ 1 (motor side) SHW2 (power module side) W 3 1 2 3 Table 2: P1, P2 and P3 connectors for kelvin contacts to shunt signals www.irf.com page 5/22 Sep 9 , 2004 th Datasheet rev 2.1 IRMD22141SS The SHU, SHV and SHW are sense pins connected as close as possible to the shunt resistors terminals to reduce the parasitic effects of the traces. There are two connectors dedicated to each power signal (DC+, U, V, W and DC-). Each single connector has 30 Ampere of maximal nominal dc current. DCbus traces are both on top and on one of the internal layers of the PC board in order to reduce power dissipation. Connectors, DC-bus, phase and ground wires can be soldered directly on board using the corresponding pads located under the power connectors (to be removed). The board is fully compatible with the ECONO2-6PACK power module. The following table shows the module pin-out. CONNECTION POINTS BETWEEN BOARD AND MODULE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 VGHU - phase U - high side IGBT gate VEHU - phase U - high side IGBT emitter VGLU - phase U - low side IGBT gate VELU - phase U - low side IGBT emitter VGHV - phase V - high side IGBT gate VEHV - phase V - high side IGBT emitter VGLV - phase V - low side IGBT gate VELV - phase V - low side IGBT emitter VGHW - phase W - high side IGBT gate VEHW - phase W - high side IGBT emitter VGLW - phase W - low side IGBT gate VELW - phase W - low side IGBT emitter DC+ Phase W Phase V Phase U DC- (GND) Table 3: High power module connection High power signal connector Connecting the power module www.irf.com page 6/22 Sep 9 , 2004 th Datasheet rev 2.1 IRMD22141SS Test Points Test points on board provide signals that are not available at the connectors. See the following table: ONE FOR EACH DEVICE (U1 -> U, U2 - > V, U3 -> W) VB VS DSH DSL VCC GND FAULT/SD SY_FLT High side floating supply voltage High side floating supply offset voltage High side desat input voltage Low side desat input voltage Low side and logic fixed supply voltage Device VSS COMMON FOR ALL DEVICES Fault and Shut Down (or-wired) Synchronized Fault (or-wired) Table 4: Test points Note: the FAULT/SD signal is present on pin 5 and 6 of the 40-pin connector, too. TEST BENCH CONNECTION IRMD22141SS does NOT provide opto isolation. The following picture shows the recommended connections for board evaluation. Bold lines are equipotential (DC-=Vss=gnd). Low Voltage supply Oscilloscope High Voltage supply Vcc Vdd Vss gnd DC- DC+ Controller board Flat cable to provide signals and Vcc-Vss=15V typ supply Figure 3: Test bench connection www.irf.com page 7/22 Sep 9 , 2004 th Datasheet rev 2.1 IRMD22141SS OPERATING DESCRIPTION Before beginning the normal operating mode, it is strongly recommended to follow the power ON sequence. The purpose of this procedure is to set the internal device logic. This is achieved by charging all bootstrap capacitors for the first time with the FLT_CLR signal active. See Figure 4 for the correct procedure. power-on charging Cboot Power on sequence VCC HIN1 HIN2 normal operation HIN3 LIN1 LIN2 LIN3 FLT_CLR 0 10 20 30 40 50 60 70 80 90 100 time (usec) Figure 4: Power on sequence In the normal operating mode when HIN or LIN is active the high or low side IGBT turns on respectively. Turn on and turn off propagation delays and the propagation delay matching are specified in the IR22141SS datasheet. Devices introduce also a minimum dead-time (typical 330 ns). The IR22141SS is able to detect the excessive current increase by monitoring the IGBT desaturation. The three-phase connection of the IR22141SS allows managing all power module faults using the FAULT/SD and SYNC_FLT signals in a local network. Figure 5 shows how the devices are interconnected to each other and with the FAULT/SD pin on the connector. The fault management procedure starts when one of the drivers senses the IGBT desaturation (see Figure 5 where, as an example, only one low side IGBT is shown). Figure 6 shows an example where the low side IGBT of U1 and U3 and the high side of U2 are on. The procedure is totally managed by an integrated FAULT LOGIC block without the controller assistance. Normal operating mode Fault management www.irf.com page 8/22 Sep 9 , 2004 th Datasheet rev 2.1 IRMD22141SS (Connector J1) (output) SD (input) FAULT IR22141SS U3 HOP3 HON3 IR22141SS U2 HOP2 HON2 SSDH2 COMPARE with VDESAT IR22141SS U1 HOP1 HON1 SSDH1 DSL1 LOP1 FAULT LOGIC management desat diode VCC SSDH3 VC LOP3 FAULT LOGIC management LOP2 FAULT LOGIC management LON3 SSDL3 LON2 SSDL2 LON1 SSDL1 VG VE red LED FAULT/SD SYNC_FLT COM3 FAULT/SD SYNC_FLT COM2 FAULT/SD SYNC_FLT COM1 Figure 5: Three phase connection VCE DSL1 SYNC_FLT FAULT/SD LOP1 LON1 SSDL1 VGE HOP2 HON2 LOP3 LON3 three state three state freeze state freeze state freeze state freeze state three state three state three state three state three state three state VDESAT Figure 6: Example of a desaturation detection event With the optional shunt resistor the IRMD22141SS driver board can be connected with the IRCS2277S current sensing board through J1 and P1, P2, and P3 connectors. More information available with IRCS2277S board datasheet. Multilevel board solution www.irf.com page 9/22 Sep 9 , 2004 th Datasheet rev 2.1 IRMD22141SS BOARD SOLUTIONS Sizing of the components mentioned in this section is indicated in the Bill of material on page 15. The high side floating supply (VBS) is provided by a bootstrap capacitor. Figure 7 shows the circuit on board. DC+ Rboot* Dboot Bootstrap circuit VCC VB Cboot* + Cboot** VGH 15V CVCC IR2214SS Rboot ** VS VEH phase VSS VGL VEL Figure 7: Bootstrap circuit The following table shows the names of these components on board. U CVCC Cboot* Cboot** Rboot* Rboot** C5 C9 C8 R13 R14 V C11 C15 C14 R25 R26 W C17 C21 C20 R37 R38 Gate resistances The following table shows the names of gate resistances on board. U high side gate to HOP high side gate to HON high side gate to SSDH low side gate to LOP low side gate to LON low side gate to SSDL R18 R17 R15 R9 R7 R6 V R30 R29 R27 R22 R20 R19 W R42 R41 R39 R34 R32 R31 www.irf.com page 10/22 Sep 9 , 2004 th Datasheet rev 2.1 IRMD22141SS OTHER EXTRA COMPONENTS These components are provided to make IRMD22141SS board as customizable as possible. In many cases the extra components are not required. The IR22141S is able to detect the IGBT desaturation. To reject the noise on the desat pins the IR22141SS have an internal filter of 1 sec. If this is not enough an RC filter has been placed on board (see figure 8, RDSH, CDSH and RDSL, CDSL). High side desat diode Desat circuit DC+ VCC VB BIAS RDSH VGH VEH DSH 15V CVCC IR2214SS CDSH VS Vcc Low side desat diode phase VSS DSL CDSL VGL VEL COM Figure 8: Desat external filter The external resistor is in parallel with the internal bias circuit of the desat diode. If added, the external resistor may cause an higher diode bias current that must be taken into account in bootstrap capacitor sizing. External RC filter delays desaturation detection, that causes a delay in turning the IGBT off. Consider this delay when sizing the soft-shut-down resistors. The following table shows the names of these components on board. U CDSH RDSH CDSL RDSL C7 R16 C4 R8 V C13 R28 C10 R21 W C19 R40 C16 R33 This solution preserves the device when the VS pin goes below ground out of the device absolute maximum ratings. The VS voltage is clamped to the maximum value allowed by a zener diode. Clamping Diode for Vs below ground BIAS RDSL www.irf.com page 11/22 Sep 9 , 2004 th Datasheet rev 2.1 IRMD22141SS DC+ Rboot* Dboot VCC VB Cboot* + Cboot** VGH 15V CVCC IR2214SS Rboot** VS VEH phase VSS Clamping structure with zener diode VGL VEL Figure 9: -Vs clamp The following table shows the names of these components on board. U DIODE ZENER D4 Z2 V D10 Z5 W D16 Z8 An RC filter (RCOM, CCOM) is provided to preserve the IC device from low side IGBT emitter undervoltage spikes. RC filter on com pin Vcc CCOM RGOFF ON CVcc Vss COM GATE DRIVER RCOM Figure 10: COM below ground protection The following table shows the names of these components on board. U CCOM RCOM C6 R10 V C12 R23 W C18 R35 www.irf.com page 12/22 Sep 9 , 2004 th Datasheet rev 2.1 IRMD22141SS Fast diode between gate and supply pin On all low and high side drivers a fast diode is provided to clamp the gate coming over the VCC or VB supply pins and to recover the current coming from the collector node through the gate-collector capacitance. DC+ DG DH VOUT RONp DPn VCC RGATE VG VE QL Figure 11: Collector-Gate current protection The following table shows the names of these components on board. U (high side) DG (low side) DG D6 D2 V D12 D8 W D18 D14 To avoid a VGE increasing over the absolute maximum rating a zener diode is connected between gate and emitter pins on all the IGBTs. Zener diode to preserve the IGBT gate DC+ GATE DRIVER VCC low voltage supply high side driver Rboot VS VOUT LOAD VSS low side driver RCOM QL DL COM GND Figure 12: Zener clamp for IGBT gate www.irf.com page 13/22 Sep 9 , 2004 th Datasheet rev 2.1 IRMD22141SS The following table shows the names of these components on board. U (high side) ZENER (low side) ZENER Z3 Z1 V Z6 Z4 W Z9 Z7 Optional output shunt resistor Two type of output shunt resistor, for current sensor, are possible see the following table: U TO220 or OARS-1 R3 R3A // R3B V R4 R4A // R4B W R5 R5A // R5B The OARS-1 type (A and B) are connected in parallel. Resistor on vcc Provided to decouple VCC_U1, VCC_U2 and VCC_U3 from supply line. U Vcc decoupling R12 V R24 W R36 www.irf.com page 14/22 Sep 9 , 2004 th Datasheet rev 2.1 IRMD22141SS BILL OF MATERIAL The hereafter provided BOMs represent a suggestion based on the IGBT characteristics shown below. Numeration R01 R02 R06 R07 R08 R09 R10 R11 R12 R13 R14 R15 R16 R17 R18 R19 R20 R21 R22 R23 R24 R25 R26 R27 R28 R29 R30 R31 R32 R33 R34 R35 R36 R37 R38 R39 R40 R41 R42 Description Supply LED bias pull-up FAULT/SD and fault LED bias Driver U1 - gate SSDL Driver U1 - gate LON Driver U1 - Noise filter on DSL Driver U1 - gate LOP Driver U1 - COM resistor pull-up del SYNC_FLT Driver U1 - Noise filter on VCC Driver U1 - Bootstrap resistor Driver U1 - Vs resistor Driver U1 - gate SSDH Driver U1 - Noise filter on DSH Driver U1 - gate HON Driver U1 - gate HOP Driver U2 - gate SSDL Driver U2 - gate LON Driver U2 - Noise filter on DSL Driver U2 - gate LOP Driver U2 - resistenza sul COM Driver U2 - Noise filter on VCC Driver U2 - Bootstrap resistor Driver U2 - Vs resistor Driver U2 - gate SSDH Driver U2 - Noise filter on DSH Driver U2 - gate HON Driver U2 - gate HOP Driver U3 - gate SSDL Driver U3 - gate LON Driver U3 - Noise filter on DSL Driver U3 - gate LOP Driver U3 - resistenza sul COM Driver U3 - Noise filter on VCC Driver U3 - Bootstrap resistor Driver U3 - Vs resistor Driver U3 - gate SSDH Driver U3 - Noise filter on DSH Driver U3 - gate HON Driver U3 - gate HOP Value 15k 15k 330 2R2 33 2R2 4.7k 0 0 2R2 330 2R2 33 330 2R2 33 2R2 0 0 2R2 330 2R2 33 330 2R2 33 2R2 0 0 2R2 330 2R2 33 Numeration C01 C02 C03 C04 C05 C06 C07 C08 C09 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 D01 D02 D03 D04 D05 D06 D07 D08 D09 D10 D11 D12 D13 D14 D15 D16 D17 D18 DL1 DL2 Z01 Z02 Z03 Z04 Z05 Z06 Z07 Z08 Z09 Description power on reset flt_clr 15V connector supply (ceramic) 15V connector supply (electrolitic) Driver U1 - Noise filter on DSL Driver U1 - Noise filter on VCC (ceramic) Driver U1 - Vcc to COM (ceramic) Driver U1 - Noise filter on DSH Driver U1 - high side supply (electrolitic) Driver U1 - high side supply (ceramic) Driver U2 - Noise filter on DSL Driver U2 - Noise filter on VCC (ceramic) Driver U2 - loop corto tra COM e VCC (ceramic) Driver U2 - Noise filter on DSH Driver U2 - high side supply (electrolitic) Driver U2 - high side supply (ceramic) Driver U3 - Noise filter on DSL Driver U3 - Noise filter on VCC (ceramic) Driver U3 - loop corto tra COM e VCC (ceramic) Driver U3 - Noise filter on DSH Driver U3 - high side supply (electrolitic) Driver U3 - high side supply (ceramic) Driver U1 - DSL Driver U1 - gate to supply diode Cgc_L Driver U1 - Bootstrap Driver U1 - VS undershoot Driver U1 - DSH Driver U1 - gate to supply diode Cgc_H Driver U2 - DSL Driver U2 - gate to supply diode Cgc_L Driver U2 - Bootstrap Driver U2 - VS undershoot Driver U2 - DSH Driver U2 - gate to supply diode Cgc_H Driver U3 - DSL Driver U3 - gate to supply diode Cgc_L Driver U3 - Bootstrap Driver U3 - VS undershoot Driver U3 - DSH Driver U3 - gate to supply diode Cgc_H green LED for +15V supply red LED for FAULT/SD Driver U1 - zener clamp Vge_L Driver U1 - zener clamp for VS undershoot Driver U1 - zener clamp Vge_H Driver U2 - zener clamp Vge_L Driver U2 - zener clamp for VS undershoot Driver U2 - zener clamp Vge_H Driver U3 - zener clamp Vge_L Driver U3 - zener clamp for VS undershoot Driver U3 - zener clamp Vge_H Value 1uF - 35V 47uF - 35V 1uF - 35V 330nF -35V 1uF - 35V 1uF - 35V 330nF -35V 1uF - 35V 1uF - 35V 330nF -35V 1uF - 35V 1200V - low recovery fast 1200V - low recovery 1200V - low recovery 1200V - low recovery fast 1200V - low recovery fast 1200V - low recovery 1200V - low recovery 1200V - low recovery fast 1200V - low recovery fast 1200V - low recovery 1200V - low recovery 1200V - low recovery fast 10V - 1W 10V - 1W 10V - 1W - www.irf.com page 15/22 Sep 9 , 2004 th Datasheet rev 2.1 IRMD22141SS SCHEMATIC www.irf.com page 16/22 Sep 9 , 2004 th Datasheet rev 2.1 IRMD22141SS LAYOUT www.irf.com page 17/22 Sep 9 , 2004 th Datasheet rev 2.1 IRMD22141SS www.irf.com page 18/22 Sep 9 , 2004 th Datasheet rev 2.1 IRMD22141SS www.irf.com page 19/22 Sep 9 , 2004 th Datasheet rev 2.1 IRMD22141SS www.irf.com page 20/22 Sep 9 , 2004 th Datasheet rev 2.1 IRMD22141SS www.irf.com page 21/22 Sep 9 , 2004 th Datasheet rev 2.1 IRMD22141SS www.irf.com page 22/22 Sep 9 , 2004 th