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RS2104SPbF

RS2104SPbF

  • 厂商:

    IRF

  • 封装:

  • 描述:

    RS2104SPbF - HALF-BRIDGE DRIVER - International Rectifier

  • 数据手册
  • 价格&库存
RS2104SPbF 数据手册
Data Sheet No.PD60267 IRS2104(S)PbF HALF-BRIDGE DRIVER Features • Floating channel designed for bootstrap operation • Fully operational to +600 V • Tolerant to negative transient voltage, dV/dt • Gate drive supply range from 10 V to 20 V • Undervoltage lockout • 3.3 V, 5 V, and 15 V input logic compatible • Cross-conduction prevention logic • Internally set deadtime • High-side output in phase with input • Shutdown input turns off both channels • Matched propagation delay for both channels • RoHS compliant immune Product Summary VOFFSET IO+/VOUT ton/off (typ.) Deadtime (typ.) 600 V max. 130 mA/270 mA 10 V - 20 V 680 ns/150 ns 520 ns Packages Description The IRS2104 is a high voltage, high speed power MOSFET and IGBT driver with dependent high- and lowside referenced output channels. Proprietary HVIC and 8 Lead SOIC 8 Lead PDIP latch immune CMOS technologies enable ruggedized IRS2104S IRS2104 monolithic construction. The logic input is compatible with standard CMOS or LSTTL output, down to 3.3 V logic. The output drivers feature a high pulse current buffer stage designed for minimum driver crossconduction. The floating channel can be used to drive an N-channel power MOSFET or IGBT in the high-side configuration which operates from 10 V to 600 V. Typical Connection up to 600 V VCC VCC IN SD VB HO VS LO TO LOAD IN SD COM (Refer to Lead Assignment for correct pin configuration). This diagram shows electrical connections only. Please refer to our Application Notes and DesignTips for proper circuit board layout. www.irf.com 1 IRS2104(S) PbF Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol VB VS VHO VCC VLO VIN dVs/dt PD RthJA TJ TS TL Definition High-side floating absolute voltage High-side floating supply offset voltage High-side floating output voltage Low-side and logic fixed supply voltage Low-side output voltage Logic input voltage (IN & SD ) Allowable offset supply voltage transient Package power dissipation @ TA ≤ +25 °C Thermal resistance, junction to ambient Junction temperature Storage temperature Lead temperature (soldering, 10 seconds) (8 lead PDIP) (8 lead SOIC) (8 lead PDIP) (8 lead SOIC) Min. -0.3 V B - 25 VS - 0.3 -0.3 -0.3 -0.3 — — — — — — -55 — Max. 625 VB + 0.3 VB + 0.3 25 VCC + 0.3 VCC + 0.3 50 1.0 0.625 125 200 150 150 300 Units V V/ns W °C/W °C Recommended Operating Conditions The input/output logic timing diagram is shown in Fig. 1. For proper operation the device should be used within the recommended conditions. The VS offset rating is tested with all supplies biased at a 15 V differential. Symbol VB VS VHO VCC VLO VIN TA Definition High-side floating supply absolute voltage High-side floating supply offset voltage High-side floating output voltage Low-side and logic fixed supply voltage Low-side output voltage Logic input voltage (IN & SD ) Ambient temperature Min. VS + 10 Note 1 VS 10 0 0 -40 Max. VS + 20 600 VB 20 VCC VCC 125 Units V °C Note 1: Logic operational for VS of -5 V to +600 V. Logic state held for VS of -5 V to -VBS. (Please refer to the Design Tip DT97-3 for more details). www.irf.com 2 IRS2104(S) PbF Dynamic Electrical Characteristics VBIAS (VCC, VBS) = 15 V, CL = 1000 pF and TA = 25 °C unless otherwise specified. Symbol ton toff tsd tr tf DT MT Definition Turn-on propagation delay Turn-off propagation delay Shutdown propagation delay Turn-on rise time Turn-off fall time Deadtime, LS turn-off to HS turn-on & HS turn-on to LS turn-off Delay matching, HS & LS turn-on/off Min. Typ. Max. Units Test Conditions — — — — — 400 — 680 150 160 70 35 520 — 820 220 220 170 90 650 60 ns VS = 0 V VS = 600 V Static Electrical Characteristics VBIAS (VCC, VBS) = 15 V and TA = 25 °C unless otherwise specified. The VIN, VTH, and IIN parameters are referenced to COM. The VO and IO parameters are referenced to COM and are applicable to the respective output leads: HO or LO. Symbol VIH VIL VSD,TH+ VSD,THVOH VOL ILK IQBS IQCC IIN+ IINVCCUV+ VCCUVIO+ IO- Definition Logic “1” (HO) & Logic “0” (LO) input voltage Logic “0” (HO) & Logic “1” (LO) input voltage SD input positive going threshold SD input negative going threshold High level output voltage, VBIAS - VO Low level output voltage, VO Offset supply leakage current Quiescent VBS supply current Quiescent VCC supply current Logic “1” input bias current Logic “0” input bias current VCC supply undervoltage positive going threshold VCC supply undervoltage negative going threshold Output high short circuit pulsed current Output low short circuit pulsed current Min. Typ. Max. Units Test Conditions 2.5 — 2.5 — — — — — — — — 8 7.4 130 270 — — — — 0.05 0.02 — 30 150 3 — 8.9 8.2 290 600 — 0.8 — 0.8 0.2 0.1 50 55 270 10 5 9.8 V 9 — mA — VO = 0 V PW ≤ 10 µs VO = 15 V PW ≤ 10 µs µA V IO = 2 mA VB = VS = 600 V VIN = 0 V or 5 V VIN = 5 V VIN = 0 V VCC = 10 V to 20 V www.irf.com 3 IRS2104(S) PbF Functional Block Diagram VB HV LEVEL SHIFT Q PULSE FILTER R S VS HO IN PULSE GEN DEAD TIME & SHOOT-THROUGH PREVENTION UV DETECT VCC SD LO COM Lead Definitions Symbol Description IN Logic input for high-side and low-side gate driver outputs (HO and LO), in phase with HO Logic input for shutdown High-side floating supply High-side gate drive output High-side floating supply return Low-side and logic fixed supply Low-side gate drive output Low-side return SD VB HO VS VCC LO COM Lead Assignments 1 2 3 4 VCC IN SD COM VB HO VS LO 8 7 6 5 1 2 3 4 VCC IN SD COM VB HO VS LO 8 7 6 5 8 Lead PDIP 8 Lead SOIC IRS2104PbF www.irf.com IRS2104SPbF 4 IRS2104(S) PbF IN IN(LO) 50% 50% SD IN(HO) ton tr 90% toff 90% tf HO LO LO HO Figure 1. Input/Output Timing Diagram 10% 10% Figure 2. Switching Time Waveform Definitions 50% 50% SD 50% IN tsd 90% HO LO 90% HO DT 10% DT LO Figure 3. Shutdown Waveform Definitions 90% 10% Figure 4. Deadtime Waveform Definitions IN (LO) 50% 50% IN (HO) LO HO 10% MT 90% MT LO HO Figure 5. Delay Matching Waveform Definitions www.irf.com 5 IRS2104(S) PbF 1400 1400 Turn-On Delay Time (ns) y ( Turn-On Delay Time (ns) ) 1200 1000 800 600 400 200 0 -50 -25 0 25 50 75 100 125 1200 1000 800 600 400 200 0 10 12 14 16 18 20 Typ. Max. Max. Typ. Temperature (°C) VBIAS Supply Voltage (V) Figure 6A. Turn-On Time vs. Temperature Figure 6B. Turn-On Time vs. Supply Voltage 1000 Max . Turn-Off Delay Time (ns) 500 400 300 200 100 Max. Turn-On Delay Time (ns) 800 600 Typ. 400 200 0 0 2 4 6 8 10 12 14 16 18 20 Typ. 0 -50 -25 0 25 50 75 100 125 Input Voltage (V) Temperature (°C) Figure 6C. Turn-On Time vs. Input Voltage Figure 7A. Turn-Off Time vs. Temperature 500 1000 Turn-Off Delay Time (ns) Turn-Off Delay Time (ns) 400 300 200 Typ. 100 0 10 12 14 16 18 20 Max. 800 600 400 200 Typ 0 0 2 4 6 8 10 12 14 16 18 20 Ma x . VBIAS Supply Voltage (V) Input Voltage (V) Figure 7B. Turn-Off Time vs. Supply Voltage Figure 7C. Turn-Off Time vs. Input Voltage www.irf.com 6 IRS2104(S) PbF 500 Shutdown Delay Time (ns) 500 Shutdown Delay Time (ns) 400 300 200 100 0 -5 0 -2 5 0 25 50 75 100 125 M ax. 400 300 200 Typ. 100 0 10 12 14 16 18 20 VBIAS Supply Voltage (V) Max. T y p. Temperature (°C) Figure 8A. Shutdown Time vs. Temperature Figure 8B. Shutdown Time vs. Voltage 500 Turn-On Rise Time (ns) ( 500 Turn-On Rise Time (ns) 400 300 200 100 Typ. 400 300 200 100 Typ. Max. Max. 0 -50 0 -25 0 25 50 75 100 125 10 12 14 16 18 20 VBIAS Supply Voltage (V) MAX Temperature (°C) Figure 9A. Turn-On Rise Time vs. Temperature 200 Turn-Off Fall Time (ns) V BIAS Supply Voltage (V) Figure 9B. Turn-On Rise Time vs. Voltage 200 Turn-Off Fall Time (ns) 150 100 Max. 150 Max. 100 50 Typ. 50 Typ. 0 -50 0 -25 0 25 50 75 100 125 10 12 14 16 18 20 Temperature (°C) Input Voltage Figure 10A. Turn-Off Fall Time vs. Temperature Figure 10B. Turn-Off Fall Time vs. Input Voltage www.irf.com 7 IRS2104(S) PbF 1400 1200 1400 1200 Deadtime (ns) 1000 800 600 400 200 0 -5 0 -2 5 0 25 50 75 100 125 Typ. Mi. n M ax. Deadtime (ns) 1000 M ax. 800 600 Typ. 400 Mi. n 200 0 10 12 14 16 18 20 Temperature (°C) VBIAS Supply Voltage (V) Figure 11A. Deadtime vs. Temperature 8 7 Input Voltage (V) Figure 11B. Deadtime vs. Voltage 8 7 6 Input Voltage (V) 6 5 4 3 2 1 0 -50 -25 0 25 50 75 100 125 Min. 5 4 3 2 1 0 10 12 14 16 18 20 Min. Temperature (oC) V BAIS Supply Voltage (V) Min 4 3.2 2.4 1.6 Figure12A. Logic "1" Input Voltage vs. Temperature Min. 4 Figure 12B. Logic "1" Input Voltage vs. Supply Voltage Input Voltage (V) Input Voltage (V) 3 .2 2 .4 1 .6 M ax. 0 .8 0 Max . 0.8 0 -50 -25 0 25 50 75 100 125 10 12 14 16 18 20 Temperature (°C) Vcc Supply Voltage (V) Figure 13A. Logic "0" (HO) & Logic “1” (LO) & Active SD Input Voltage vs. Temperature Figure 13B. Logic "0" (HO) & Logic “1” (LO) & Active SD Input Voltage vs. Voltage www.irf.com 8 IRS2104(S) PbF High Level Output Voltage (V) 0.5 High Level Output Voltage (V) 0.5 0.4 0.3 0.2 0.1 Typ. 0.4 0.3 0.2 0.1 Typ. Max. Max. 0.0 -50 -25 0 25 50 75 100 125 Temperature ( oC) 0.0 10 12 14 16 18 20 VBIAS Supply Voltage (V) Figure 14A. High Level Output Voltage vs. Temperature 0.5 Low Level Output Voltage (V) Low Level Output Voltage (V) Figure 14B. High Level Output Voltage vs. Supply Voltage 0.5 0.4 0.3 0.2 Max. 0.4 0.3 0.2 0.1 0.0 -50 -25 0 25 50 o Max. Typ. 0.1 Typ. 0 75 100 125 10 12 14 16 18 20 Temperature ( C) V BIAS Supply Voltage (V) Figure 15A. Low Level Output Voltage vs. Temperature Offset Supply Leakage Current (µA) 500 400 300 200 100 Figure 15B. Low Level Output Voltage vs. Supply Voltage Offset Supply Leakage Current (µA) 500 400 300 200 100 0 0 100 200 300 400 500 600 Max. Max. 0 -50 -25 0 25 50 75 100 125 Temperature (°C) VB Boost Voltage (V) Figure 16A. Offset Supply Current vs. Temperature Figure 16B. Offset Supply Current vs. Voltage www.irf.com 9 IRS2104(S) PbF 150 150 VBS Supply Current (µA) 120 90 60 30 0 -50 Typ. - 25 0 25 50 75 100 125 VBS Supply Current (µA) 120 90 60 30 Ty p. 0 10 12 14 16 18 20 Max. Max . Temperature (°C) VBS Floating Supply Voltage (V) Figure 17A. VBS Supply Current vs. Temperature 700 Figure 17B. VBS Supply Current vs. Voltage 700 Vcc Supply Current (µA) 600 500 400 300 200 100 Typ. Max. Vcc Supply Current (µA) 600 500 400 300 200 100 Typ. 0 Max. 0 -50 -25 0 25 50 75 100 125 10 12 14 16 18 20 Temperature (°C) Vcc Supply Voltage (V) Figure 18A. Vcc Supply Current vs. Temperature 30 Figure 18B. Vcc Supply Current vs. Voltage 30 Logic 1” Input Current (µA) 25 20 15 10 5 Typ. 0 -50 -25 0 25 50 75 100 125 Logic 1” Input Current (µA) 25 20 15 10 5 0 10 12 14 16 18 20 Max. Typ. Max. Temperature (°C) Vcc Supply Voltage (V) Figure 19A. Logic"1" Input Current vs. Temperature Figure 19B. Logic"1" Input Current vs. Voltage www.irf.com 10 IRS2104(S) PbF Logic “0” Input Bias Current (µA) 6 5 4 3 2 1 0 - 50 - 25 0 25 50 75 100 125 Temperature (°C) Temp er atur e ( °C) Logic "0" Input Bias C ur r ent ( µA) 6 5 4 3 2 1 0 10 12 14 16 18 20 Supply Voltage (V) Supply V oltage (V ) Max Max Figure 20A. Logic "0" Input Bias Current vs. Temperature 11 10 9 8 7 6 -50 Typ. Min. V CC UVLO T hreshold - (V) VCC UVLO T hreshold +(V) Figure 20B. Logic "0" Input Bias Current vs. Voltage 11 Max. 10 Max. 9 Typ. 8 7 Min. -25 0 25 50 75 100 125 6 -50 -25 0 25 50 75 100 125 Temperature (°C) Temperature (°C) Figure 21A. Vcc Undervoltage Threshold(+) vs. Temperature 500 Output Source Current (mA) Output Source Current (mA) Figure 21B. Vcc Undervoltage Threshold(-) vs. Temperature 500 400 300 200 100 0 -50 Typ. 400 300 200 100 0 Typ. Min. Min. -25 0 25 50 75 100 125 10 12 14 16 18 20 Temperature (°C) VBIAS Supply Voltage (V) Figure 22A. Output Source Current vs. Temperature Figure 22B. Output Source Current vs. Voltage www.irf.com 11 IRS2104(S) PbF 1000 Output Sink Current (mA) Output Sink Current (mA) 1000 800 600 400 Typ. 800 600 400 200 0 -50 Min. Typ. 200 Min. 0 -25 0 25 50 75 100 125 10 12 14 16 18 20 Temperature (°C) VBIAS Supply Voltage (V) Figure 23A. Output Sink Current vs. Temperature 6 SD Input Threshold (+) (V) Figure 23B. Output Sink Current vs. Supply Voltage 6 SD Input Threshold (+) (V) 5 4 3 2 1 -50 Max. 5 4 3 2 1 Max. -25 0 25 50 75 100 125 10 12 14 16 18 20 Temperature (°C) Vcc Supply Voltage (V) Figure 24A. SD Input Positive Going Threshold (+) vs. Temperature Figure 24B. SD Input Positive Going Threshold (+) vs. Supply Voltage www.irf.com 12 IRS2104(S) PbF Case Outline D A 5 B FOOTPRINT 8X 0.72 [.028] DIM A b INCHES MIN .0532 .013 .0075 .189 .1497 MAX .0688 .0098 .020 .0098 .1968 .1574 MILLIMETERS MIN 1.35 0.10 0.33 0.19 4.80 3.80 MAX 1.75 0.25 0.51 0.25 5.00 4.00 A1 .0040 c 8 6 E 1 7 6 5 H 0.25 [.010] A 6.46 [.255] D E e e1 H K L 8X 1.78 [.070] 2 3 4 .050 BASIC .025 BASIC .2284 .0099 .016 0° .2440 .0196 .050 8° 1.27 BASIC 0.635 BASIC 5.80 0.25 0.40 0° 6.20 0.50 1.27 8° 6X e 3X 1.27 [.050] y e1 A C 0.10 [.004] 8X b 0.25 [.010] NOTES: 1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 2. CONTROLLING DIMENSION: MILLIMETER 3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES]. 4. OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA. K x 45° y A1 CAB 8X L 7 8X c 5 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006]. 6 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010]. 7 DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO A SUBSTRATE. 8 Lead SOIC 01-6027 01-0021 11 (MS-012AA) 8 Lead PDIP www.irf.com 01-6014 01-3003 01 (MS-001AB) 13 IRS2104(S) PbF Tape & Reel 8-lead SOIC LOAD ED TA PE FEED DIRECTION B A H D F C N OT E : CO NTROLLING D IMENSION IN MM E G C A R R I E R T A P E D IM E N S I O N F O R 8 S O I C N M e tr ic Im p e ri a l Co d e M in M ax M in M ax A 7 .9 0 8.1 0 0. 31 1 0 .3 18 B 3 .9 0 4.1 0 0. 15 3 0 .1 61 C 11 .7 0 1 2 . 30 0 .4 6 0 .4 84 D 5 .4 5 5.5 5 0. 21 4 0 .2 18 E 6 .3 0 6.5 0 0. 24 8 0 .2 55 F 5 .1 0 5.3 0 0. 20 0 0 .2 08 G 1 .5 0 n/ a 0. 05 9 n/ a H 1 .5 0 1.6 0 0. 05 9 0 .0 62 F D C B A E G H R E E L D IM E N S I O N S F O R 8 S O IC N M e tr ic Im p e ri a l Co d e M in M ax M in M ax A 3 2 9 . 60 3 30 .2 5 1 2 .9 76 1 3 .0 0 1 B 20 .9 5 2 1 . 45 0. 82 4 0 .8 44 C 12 .8 0 1 3 . 20 0. 50 3 0 .5 19 D 1 .9 5 2.4 5 0. 76 7 0 .0 96 E 98 .0 0 1 02 .0 0 3. 85 8 4 .0 15 F n /a 1 8 . 40 n /a 0 .7 24 G 14 .5 0 1 7 . 10 0. 57 0 0 .6 73 H 12 .4 0 1 4 . 40 0. 48 8 0 .5 66 www.irf.com 14 IRS2104(S) PbF LEADFREE PART MARKING INFORMATION Part number S IRxxxxxx Date code YWW? ?XXXX IR logo Pin 1 Identifier ? P MARKING CODE Lead Free Released Non-Lead Free Released Lot Code (Prod mode - 4 digit SPN code) Assembly site code Per SCOP 200-002 ORDER INFORMATION 8-Lead PDIP IRS2104PbF 8-Lead SOIC IRS2104SPbF 8-Lead SOIC Tape & Reel IRS2104STRPbF The SOIC-8 is MSL2 qualified. This product has been designed and qualified for the industrial level. Qualification standards can be found at www.irf.com IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: (310) 252-7105 Data and specifications subject to change without notice. 11/27/2006 www.irf.com 15
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