45.72mm [1.800"]
45.72mm [1.800"]
Top View
4
26.67mm [1.050"]
Side View
5.78mm [0.227"]
2
1 3
1
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2 oz.] Cu clad. SnPb plating. Substrate: 3.18mm ±0.18mm [0.125" ±0.007"] FR4/G10 or equivalent high temp material. Non-clad. Pins: shell material- Brass Alloy 360 1/2 hard; finish- 0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.). Contact material- BeCu; finish 0.25µm [10µ"] Au over 2.54µm [100µ"] Ni (min. ).
Test points: material- Phosphor Bronze; plating- Sn over 1.27µm [50µ"] Ni. Gold flash on contact end.
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3
Description: Carrier Adapter 52 Position PLCC ZIF Socket with test points to mini-grid array interface.
4
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
CA-PLCC52-Z-M-T-01 Drawing
© 2002 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com
Status: Preliminary Drawing: H. Hansen
File: CA-PLCC52-Z-M-T-01 Dwg
Scale: 2:1
Rev: A
Date: 10/04/02
Modified:
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