BUH313D

INCHANGE Semiconductor isc Product Specification isc Silicon NPN Power Transistor BUH313D DESCRIPTION ·High Switching Speed ·High Voltage ·Built-in Integrated Diode APPLICATIONS ·Horizontal deflection stage in standard and high resolution Displays for TV’s and monitors. ABSOLUTE MAXIMUM RATINGS(Ta=25℃) SYMBOL VCBO VCEO VEBO IC ICM IB B PARAMETER Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current-Continuous Collector Current-Peak Base Current Base Current-Peak Collector Power Dissipation @TC=25℃ Junction Temperature Storage Temperature VALUE 1300 600 10 5 8 3 5 50 150 -65~150 UNIT V V V A A A A W ℃ ℃ IBM PC TJ Tstg THERMAL CHARACTERISTICS SYMBOL Rth j-c PARAMETER Thermal Resistance, Junction to Case MAX 2.5 UNIT ℃/W isc Website：www.iscsemi.cn INCHANGE Semiconductor isc Product Specification isc Silicon NPN Power Transistor ELECTRICAL CHARACTERISTICS TC=25℃ unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN BUH313D TYP MAX UNIT VCEO(SUS) Collector-Emitter Sustaining Voltage IC= 100mA ;IB= 0,L= 25mH 600 V VCE(sat) Collector-Emitter Saturation Voltage IC= 3A; IB= 0.75A B 1.5 V VBE(sat) Base-Emitter Saturation Voltage IC= 3A; IB= 0.75A B 1.3 V IEBO Emitter Cutoff Current VEB= 5V; IC=0 VCE= 1300V;VBE= 0 VCE= 1300V;VBE= 0;TC=125℃ IC= 3A ; VCE= 5V IC= 3A ; VCE= 5V;TC=100℃ IF= 3A 5 3 300 1.0 2.0 mA ICES Collector Cutoff Current mA hFE DC Current Gain VECF C-E Diode Forward Voltage 2.5 V Switching Times; Resistive Load ts Storage Time IC= 3A;IB1= 1A; IB2= 1.5A VCC= 400V 1.8 2.7 μs tf Fall Time 0.2 0.3 μs isc Website：www.iscsemi.cn