ICPL3120

ICPL3120 DESCRIPTION The ICPL3120 consists of an Infrared Light Emitting Diode optically coupled to an Integrated Circuit with a Power Driving Output. ICPL3120 is ideally suitable to drive the Power IGBT and MOSFET in Inverters of Motor Controls and in Power Supplies. 1 2 3 4 5 6 7 8 The 2.5A peak output current is capable to direct drive IGBT/MOSFET up to ratings of 1200V/100A. For IGBTs with higher ratings, ICPL3120 can be used to drive a discrete power stage which drives the IGBT gate. FEATURES • • • • • • • • • • • A 0.1μF bypass Capacitor must be connected between Pins 8 and 5. ±2.5A Maximum Peak Output Current 35kV/μs Minimum Common Mode Rejection at VCM 1500V Maximum Propagation Delay 500ns Maximum Propagation Delay Difference 100ns Wide Operating Voltage Range VCC 15 to 30 V Maximum Supply Current ICC 3.5mA Under Voltage Lock Out (UVLO) Protection with Hysteresis Guaranteed Performance over Temperature Range - 40°C to +105°C MSL 1 Lead Free and RoHS Compliant Safety Approvals Pending APPLICATIONS • • • • IGBT/MOSFET Gate Drive UPS Inverters AC Brushless and DC Motor Drives ORDER INFORMATION • • • Add G after PN for 10mm lead spacing Add SM after PN for Surface Mount Add SMT&R after PN for Surface Mount Tape & Reel ISOCOM COMPONENTS 2004 LTD Unit 25B, Park View Road West, Park View Industrial Estate Hartlepool, Cleveland, TS25 1PE, United Kingdom Tel : +44 (0)1429 863 609 Fax : +44 (0)1429 863 581 e-mail : sales@isocom.co.uk http://www.isocom.com 1 13/06/2018 NC Anode Cathode NC GND (VEE) VO VO VCC ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Stresses exceeding the absolute maximum ratings can cause permanent damage to the device. Exposure to absolute maximum ratings for long periods of time can adversely affect reliability. Input Forward Current Forward Peak Current 20mA 1A (Pulse Width ≤ 1μs, 300pps) Forward Current Rise / Fall Time Reverse Voltage Power dissipation 500ns 5V 45mW Output Peak Output Current ±2.5A (Exponential waveform, Pulse Width ≤ 0.3μs, f ≤ = 15kHz) Operating Frequency (Exponential waveform, IO(Peak) ≤ l2.5Al, Pulse Width ≤ 0.3μs) 50kHz Supply Voltage (VCC ‒ VEE) Output Voltage Power Dissipation 0V to 35V 0V to VCC 250mW Total Package Isolation Voltage Total Power Dissipation Operating Temperature Storage Temperature Junction Temperature Lead Soldering Temperature (10s) 5000VRMS 295mW -40 to 105 °C -55 to 125 °C 125 °C Max 260°C ISOCOM COMPONENTS ASIA LTD Hong Kong Office, Block A, 8/F, Wah Hing Industrial mansion, 36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong. Tel : +852 2995 9217 Fax : +852 8161 6292 e-mail : sales@isocom.com.hk DD93213 ICPL3120 Truth Table LED VCC ̶ VEE (Turn ON, +ve going) VCC ̶ VEE (Turn OFF –ve going) VO OFF 0 ̶ 30V 0 ̶ 30V LOW ON 0 ̶ 11.0V 0 ̶ 9.5V LOW ON 11.0 ̶ 13.5V 9.5 ̶ 12.0V TRANSITION ON 13.5 ̶ 30V 12 ̶ 30V HIGH Recommended Operating Conditions Parameter Symbol Min Max Unit TA - 40 105 °C VCC ̶ VEE 15 30 V Input Current (ON) IF(ON) 7 16 mA Input Voltage (OFF) VF(OFF) 0 0.8 V Operating Temperature Supply Voltage 2 13/06/2018 DD93213 ICPL3120 ELECTRICAL CHARACTERISTICS (Typical Values at VCC ̶ VEE = 30V and TA = 25°C, Minimum and Maximum Values at Recommended Operating Conditions, unless otherwise specified) INPUT Parameter Symbol Test Condition Min Typ. Max Unit Forward Voltage VF IF = 10mA 1.2 1.37 1.8 V Forward Voltage Temperature Coefficient ΔVF/ΔT IF = 10mA Reverse Voltage VR IR = 10μA Input Threshold Current (Low to High) IFLH VCC = 30V VO > 5V Input Threshold Voltage (High to Low) VFHL VCC = 30V VO < 5V CIN VF = 0V, f = 1MHz Symbol Test Condition High Level Supply Current ICCH Low Level Supply Current High Level Output Current Input Capacitance ̶ 1.237 mV/°C 5 V 1.8 5 0.8 mA V 33 pF OUTPUT Parameter Low Level Output Current Typ. Max Unit IF = 10mA, VCC = 30V VO = Open 2.4 3.5 mA ICCL IF = 0mA, VCC = 30V VO = Open 2.5 3.5 mA IOH Maximum Pulse Width = 50μs VO = VCC – 1.5V -1.0 A Maximum Pulse Width = 10μs VO = VCC – 4V -2.5 IOL Min Maximum Pulse Width = 50μs VO = VEE + 1.5V 1.0 Maximum Pulse Width = 10μs VO = VEE + 4V 2.5 High Level Output Voltage VOH IF = 10mA, IO = -100mA Low Level Output Voltage VOL IF = 0mA, IO = 100mA VUVLO+ VO > 5V, IF = 10mA 11.0 12.7 13.5 V VUVLO- VO < 5V, IF = 10mA 9.5 11.2 12.0 V UVLO Threshold UVLO Hysteresis 3 13/06/2018 UVLOHYS VCC ̶ 0.3 A VCC ̶ 0.1 V VEE +0.1 VEE +0.25 V 1.5 V DD93213 ICPL3120 ELECTRICAL CHARACTERISTICS (Typical Values at VCC ̶ VEE = 30V and TA = 25°C, Minimum and Maximum Values at Recommended Operating Conditions, unless otherwise specified) SWITCHING Parameter Symbol Test Condition Min Typ. Max Unit Propagation Delay Time to High Output Level tPLH 50 130 500 ns Propagation Delay Time to Low Output Level tPHL 50 130 500 Pulse Width Distortion |tPHL - tPLH| for any given device PWD IF = 7 to 16mA, VCC = 15 to 30V, VEE = 0V, Rg = 10Ω, Cg = 25nF, f = 10kHz, Duty Cycle = 50% 5 70 Propagation Delay Difference (tPHL - tPLH) between any two Devices PDD -100 100 Output Rise Time (10% to 90%) tr 35 Output Fall Time (90% to 10%) tf 35 UVLO Turn On Delay tUVLO ON IF = 10mA, VO > 5V 1.6 μs UVLO Turn Off Delay tUVLO OFF IF = 10mA, VO < 5V 0.4 μs Common Mode Transient Immunity at High Output Level CMH IF = 10 to 16mA, VCC = 30V, VCM = 1500V, TA = 25°C 35 50 kV/μs Common Mode Transient Immunity at Low Output Level CML VF = 0V, VCC = 30V, VCM = 1500V, TA = 25°C 35 50 kV/μs 4 13/06/2018 DD93213 ICPL3120 ELECTRICAL CHARACTERISTICS (Typical Values at VCC ̶ VEE = 30V and TA = 25°C, Minimum and Maximum Values at Recommended Operating Conditions, unless otherwise specified) ISOLATION Parameter Symbol Test Condition Min Typ. Max Unit Insulation Voltage VISO R.H. = 40% - 60%, TA = 25°C t = 1 min, 5000 Input - Output Resistance RI-O VI-O = 500VDC 1012 Ω Input - Output Capacitance CI-O f = 1MHz 0.92 pF V Note : 1. A 0.1uF or bigger bypass capacitor must be connected across pin 8 and pin 5. 2. PDD is the difference of tPHL and tPLH between any two ICPL3120 under same test conditions. 3. Common Mode Transient Immunity in High stage is the maximum tolerable negative dVCM/dt on the trailing edge of the common mode impulse signal, VCM, to assure that the output will remain high (VO > 15V). 4. Common Mode Transient Immunity in Low stage is the maximum tolerable positive dVCM/dt on the leading edge of the common mode impulse signal, VCM, to assure that the output will remain low (VO < 1V). 5 13/06/2018 DD93213 ICPL3120 Fig 1 Supply Current vs Supply Voltage Fig 2 Supply Current vs Ambient Temperature Fig 3 Transfer Characteristics Fig 4 Output Low Voltage vs Ambient Temperature Fig 5 Output High Voltage vs Ambient Temperature Fig 6 Output High Voltage Drop vs Ambient Temperature 6 13/06/2018 DD93213 ICPL3120 Fig 7 Input Threshold Current vs Ambient Temperature Fig 9 Propagation Delay vs Forward Current Fig 11 Propagation Delay vs Series Load Resistance 7 13/06/2018 Fig 8 Propagation Delay vs Ambient Temperature Fig 10 Propagation Delay vs Supply Voltage Fig 12 Propagation Delay vs Series Load Capacitance DD93213 ICPL3120 Fig 13 Forward Current vs Forward Voltage 8 13/06/2018 VOH Test Circuit VOL Test Circuit IOH Test Circuit IOL Test Circuit DD93213 ICPL3120 IFLH Test Circuit UVLO Test Circuit tr, tf, tPLH and tPHL Test Circuit CMR Test Circuit 9 13/06/2018 DD93213 ICPL3120 ORDER INFORMATION ICPL3120 After PN Description PN Packing quantity None ICPL3120 Standard DIP8 50 pcs per tube G ICPL3120G 10mm Lead Spacing 50 pcs per tube SM ICPL3120SM Surface Mount 50 pcs per tube SMT&R ICPL3120SMT&R Surface Mount Tape & Reel 1000 pcs per reel DEVICE MARKING ICPL3120 IYWW ICPL3120 denotes Device Part Number I denotes Isocom Y denotes 1 digit Year code WW denotes 2 digit Week code 10 13/06/2018 DD93213 ICPL3120 PACKAGE DIMENSIONS in mm (inch) DIP G Form SMD 11 13/06/2018 DD93213 ICPL3120 RECOMMENDED SOLDER PAD LAYOUT (mm) TAPE AND REEL PACKAGING Description Symbol Dimension mm (inch) Tape Width W 16 ± 0.3 (0.63) Pitch of Sprocket Holes P0 4 ± 0.1 (0.15) F 7.5 ± 0.1 (0.295) P2 2 ± 0.1 (0.079) P1 12 ± 0.1 (0.47) Distance of Compartment to Sprocket Holes Distance of Compartment to Compartment 12 13/06/2018 DD93213 ICPL3120 IR REFLOW SOLDERING TEMPERATURE PROFILE Note : One Time Reflow Soldering is Recommended. Do Not Immerse Device Body in Solder Paste. TP 260°C TP - 5°C Max Ramp Up Rate 3°C/s TEMP (°C) TL Tsmax Tsmin tP Max Ramp Down Rate 6°C/s 217°C TL 200°C 150°C ts Preheat 60s – 120s 25°C TIME (s) Time 25°C to Peak Temperature Profile Details Conditions Preheat - Min Temperature (TSMIN) - Max Temperature (TSMAX) - Time TSMIN to TSMAX (ts) 150°C 200°C 60s - 120s Soldering Zone - Peak Temperature (TP) - Time at Peak Temperature - Liquidous Temperature (TL) - Time within 5°C of Actual Peak Temperature (TP ̶ 5°C) - Time maintained above TL (tL) - Ramp Up Rate (TL to TP) - Ramp Down Rate (TP to TL) 260°C 10s max 217°C 30s max 60s - 100s 3°C/s max 6°C/s max Average Ramp Up Rate (Tsmax to TP) 3°C/s max Time 25°C to Peak Temperature 8 minutes max 13 13/06/2018 DD93213 DISCLAIMER Isocom Components is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing Isocom Components products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such Isocom Components products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that Isocom Components products are used within specified operating ranges as set forth in the most recent Isocom Components products specifications. The Isocom Components products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These Isocom Components products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation Instruments, traffic signal instruments, combustion control instruments, medical Instruments, all types of safety devices, etc... Unintended Usage of Isocom Components products listed in this document shall be made at the customer’s own risk. Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage. The products described in this document are subject to the foreign exchange and foreign trade laws. The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by Isocom Components for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of Isocom Components or others. The information contained herein is subject to change without notice. 14 13/06/2018 DD93213