IS127

ISOCOM COMPONENTS IS127 DESCRIPTION The IS127 is an optically coupled isolator consisting of an infrared light emitting diodeand a high voltage NPN silicon photo darlington which has an integral baseemitter resistor to optimise switching speed and elevated temperature characteristics in a space efficient Mini Flat package. Part No 4 3 1 2 FPH1 IYWW Date Code FEATURES • • • • • • • Low Profile Package AC Isolation Voltage 3750VRMS CTR Minimum 1000% High Collector-Emitter Voltage VCEO 300V Wide Operating Temperature Range -55°C to +110°C Lead Free and RoHS Compliant UL File E91231 Package Code “FPH1” APPLICATIONS ABSOLUTE MAXIMUM RATINGS • • • • Input Diode Computer Terminals Industrial System Controllers Measuring Instruments Signal Transmission between Systems of Different Potentials and Impedances Forward Current Reverse Voltage Power dissipation 50mA 6V 70mW Output Transistor ORDER INFORMATION • Available in Tape and Reel with 750 pieces per reel Collector to Emitter Voltage BVCEO Emitter to Collector Voltage BVECO Collector Current Power Dissipation 300V 0.1V 150mA 150mW Total Package Operating Temperature Storage Temperature Total Power Dissipation Lead Soldering Temperature (for 10s) ISOCOM COMPONENTS 2004 LTD Unit 25B, Park View Road West, Park View Industrial Estate Hartlepool, Cleveland, TS25 1UD, United Kingdom Tel: +44 (0)1429 863 609 Fax : +44 (0)1429 863 581 e-mail: sales@isocom.co.uk http://www.isocom.com 1 11/11/2013 -55 to +110 °C -55 to +150 °C 170mW 260°C ISOCOM COMPONENTS ASIA LTD Hong Kong Office, Block A, 8/F, Wah Hing Industrial mansion, 36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong. Tel: +852 2995 9217 Fax : +852 8161 6292 e-mail sales@isocom.com.hk DB92863 ISOCOM COMPONENTS IS127 ELECTRICAL CHARACTERISTICS (Ambient Temperature = 25°C unless otherwise specified) INPUT Parameter Symbol Test Condition Min Typ. Max Unit Forward Voltage VF IF = 10mA 1.2 1.4 V Reverse Leakage IR VR = 4V 10 µA Terminal Capacitance Ct V = 0V, f = 1KHz 30 250 pF Symbol Test Condition Min Typ. Max Unit Collector-Emitter breakdown Voltage BVCEO IC = 0.1mA, IF = 0mA 300 V Emitter-Collector breakdown Voltage BVECO IE = 10µA, IF = 0mA 0.1 V ICEO VCE = 200V, IF = 0mA Symbol Test Condition Min CTR IF = 1mA, VCE = 2V 1000 VCE(sat) IF = 20mA, IC = 100mA Input to Output Isolation Voltage VISO See note 1 3750 VRMS Input to Output Isolation Resistance RISO VIO= 500V See note 1 5x1010 Ω Output Rise Time tr VCE = 2V, Ic = 20mA, RL = 100Ω 100 300 µs Output Fall Time tf VCE = 2V, Ic = 20mA, RL = 100Ω 20 100 µs OUTPUT Parameter Collector-Emitter Dark Current 200 nA Max Unit COUPLED Parameter Current transfer ratio Collector-Emitter Saturation Voltage Typ. % 1.2 Note 1 : Measure with input leads shorted together and output leads shorted together. 2 11/11/2013 DB92863 V ISOCOM COMPONENTS IS127 Fig 1 Forward Current vs TA Fig 2 Collector Power Dissipation vs TA Fig 3 Collector-emitter Saturation Voltage vs Forward Current Fig 4 Forward Current vs Forward Voltage Fig 5 Current Transfer Ratio vs Forward Current Fig 6 Collector Current vs Collector-Emitter Voltage 3 11/11/2013 DB92863 ISOCOM COMPONENTS IS127 Fig 7 Relative CTR vs TA Fig 8 Collector-Emitter Saturation Voltage vs TA Fig 9 Collector Dark Current vs TA Fig 10 Frequency Response Fig 11 Response Time vs Load Resistance Response Time Test Circuit 4 11/11/2013 DB92863 ISOCOM COMPONENTS IS127 STANDARD PACKING QUANTITY IS127 After PN None PN IS127 Description Surface Mount Tape & Reel Packing quantity 750 pcs per reel DEVICE MARKING FPH1 I YWW FPH1 I Y WW 5 11/11/2013 denotes Device Part Number where “#” is internal control number denotes Isocom denotes 1 digit Year code denotes 2 digit Week code DB92863 ISOCOM COMPONENTS IS127 PACKAGE DIMENSIONS (mm) RECOMMENDED SOLDER PAD LAYOUT (mm) 6 11/11/2013 DB92863 ISOCOM COMPONENTS IS127 IR REFLOW SOLDERING TEMPERATURE PROFILE (One Time Reflow Soldering is Recommended) TP 260°C TP - 5°C tP Max Ramp Down Rate 6°C/s Max Ramp Up Rate 3°C/s TL 217°C TEMP (°C) tL Tsmax Tsmin 200°C 150°C ts Preheat 60s – 120s 25°C Time 25°C to Peak Temperature TIME (s) Profile Details Conditions Preheat - Min Temperature (TSMIN) - Max Temperature (TSMAX) - Time TSMIN to TSMAX (ts) 150°C 200°C 60s - 120s Soldering Zone - Peak Temperature (TP) - Liquidous Temperature (TL) - Time within 5°C of Actual Peak Temperature (TP ̶ 5°C) - Time maintained above TL (tL) - Ramp Up Rate (TL to TP) - Ramp Down Rate (TP to TL) 260°C 217°C 20s 60s 3°C/s max 3 - 6°C/s Average Ramp Up Rate (Tsmax to TP) 3°C/s max Time 25°C to Peak Temperature 8 minutes max 7 11/11/2013 DB92863 ISOCOM COMPONENTS IS127 TAPE AND REEL PACKAGING (mm) 8 11/11/2013 DB92863 ISOCOM COMPONENTS IS127 NOTES : - Isocom is continually improving the quality, reliability, function or design and Isocom reserves the right to make changes without further notices. - The products shown in this publication are designed for the general use in electronic applications such as office automation equipment, communications devices, audio/visual equipment, electrical application and instrumentation. - For equipment/application where high reliability or safety is required, such as space applications, nuclear power control equipment, medical equipment, etc., please contact our sales representatives. - When requiring a device for any ”specific” application, please contact our sales for advice. - The contents described herein are subject to change without prior notice. - Do not immerse device body in solder paste. 9 11/11/2013 DB92863