ISP06SM

ISOCOM COMPONENTS ISP06, ISP25, ISP40, ISP60 DESCRIPTION The ISP06, ISP25, ISP40 and ISP60 are Single Channel Solid State Relays (Photo MOSFET) each consists of an infrared emitting diode optically coupled to a high voltage output detector. The detector consists of a Photo Voltaic Diode Array and high voltage output MOSFETs. This Single Channel Output configuration is equivalent to 1 Form A of Electro-mechanical Relay. FEATURES • • • • • • • • • ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Normally Open Single Pole Single Throw Relay High Output Voltages 60V to 600V Low ON Resistance Low Operating Current High AC Isolation Voltage 5000VRMS Wide Operating Temperature Range -40°C to 85°C Pb Free and RoHS Compliant Safety Approvals Pending APPLICATIONS • • • • • • Industrial Controls Telephone/Exchange Equipment Measurement Equipment FA/OA Equipment Security System Reed Relay Replacement ORDER INFORMATION • • • Add G after PN for 10mm lead spacing Add SM after PN for Surface Mount, Add SMT&R after PN for Surface Mount Tape & Reel ISOCOM COMPONENTS 2004 LTD Unit 25B, Park View Road West, Park View Industrial Estate Hartlepool, Cleveland, TS25 1UD, United Kingdom Tel: +44 (0)1429 863 609 Fax : +44 (0)1429 863 581 e-mail: sales@isocom.co.uk http://www.isocom.com 1 11/09/2015 Input Diode Forward Current Reverse Voltage Forward Peak Current (f=100Hz, Duty Cycle = 0.1%) Power dissipation 50mA 5V 1A 75mW Output ISP06 Output 60 Breakdown Voltage VL (V) Load Current IL Continuous (mA) 550 Pulse (A) 1.2 (100ms, 1 shot, VL = DC) Power Dissipation ISP25 250 ISP40 400 ISP60 600 180 0.5 120 0.3 50 0.15 500mW Total Package Isolation Voltage (R.H. = 40% - 60%, 1 min) Total Power Dissipation Operating Temperature Storage Temperature Lead Soldering Temperature (10s) 5000VRMS 550mW -40 to 85 °C -40 to 125 °C 260°C ISOCOM COMPONENTS ASIA LTD Hong Kong Office, Block A, 8/F, Wah Hing Industrial mansion, 36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong. Tel: +852 2995 9217 Fax : +852 8161 6292 e-mail sales@isocom.com.hk DC93188 ISOCOM COMPONENTS ISP06, ISP25, ISP40, ISP60 Truth Table Input Output ON CLOSE OFF OPEN ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) INPUT Parameter Symbol Test Condition Forward Voltage VF IF = 10mA Reverse Current IR VR = 5V Symbol Test Condition Ileak IF = 0mA, VL = Max Rd(ON) IF = 10mA, IL = Max, t = 1s Min Typ. Max Unit 1.18 1.5 V 1 µA Max Unit 1 μA OUTPUT Parameter Off State Leakage Current On Resistance Output Capacitance 2 11/09/2015 Cout Min Typ. Ω ISP06 0.7 2.5 ISP25 6.5 15 ISP40 20 30 ISP60 40 70 VL = 0V, f = 1MHz pF ISP06 85 ISP25 60 ISP40 45 ISP60 30 DC93188 ISOCOM COMPONENTS ISP06, ISP25, ISP40, ISP60 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) COUPLED Parameter Symbol Test Condition LED Turn On Current IF(on) IL = Max LED Turn Off Current IF(off) IL = Max Ton IF = 10mA, IL = Max, RL = 200Ω Turn On Time Turn Off Time Toff Min 0.4 Typ. Max Unit 2.5 5 mA 2.5 mA ms ISP06 1.4 3 ISP25 1.2 3 ISP40 0.4 3 ISP60 1.4 3 IF = 10mA, IL = Max, RL = 200Ω ms ISP06 0.05 0.5 ISP25 0.05 0.5 ISP40 0.05 0.5 ISP60 0.05 0.5 Isolation Resistance RI-O VI-O = 500VDC Isolation Capacitance CI-O V = 0V, f = 1MHz 5 x 1010 Ω 1.5 pF Turn on / Turn off Time 3 11/09/2015 DC93188 ISOCOM COMPONENTS ISP06, ISP25, ISP40, ISP60 ISP06 ISP25 ISP40 ISP60 Fig 1a Load Current vs Ambient Temperature Fig 1b Load Current vs Ambient Temperature ISP60 ISP06 ISP40 ISP25 Fig 2a On Resistance vs Ambient Temperature ISP06 ISP40 ISP25 Fig 3a Load Current vs Load Voltage 4 11/09/2015 Fig 2b On Resistance vs Ambient Temperature ISP60 Fig 3b Load Current vs Load Voltage DC93188 ISOCOM COMPONENTS ISP06, ISP25, ISP40, ISP60 Fig 5 LED Turn Off Current vs TA Fig 4 LED Turn On Current vs TA ISP06 ISP25 ISP60 ISP40 Fig 6a Turn On Time vs LED Forward Current Fig 6b Turn On Time vs LED Forward Current ISP40 ISP25 ISP06 ISP06 ISP60 ISP25 ISP60 ISP40 Fig 7 Turn Off Time vs LED Forward Current 5 11/09/2015 Fig 8 Switching Time vs Ambient Temperature DC93188 ISOCOM COMPONENTS ISP06, ISP25, ISP40, ISP60 ISP25 ISP40 ISP60 Fig 9 LED Dropout Voltage vs TA Fig 10 Off State Leakage Current vs Load Voltage ISP06 ISP25 ISP60 ISP40 Fig 11 Output Capacitance vs Applied Voltage 6 11/09/2015 DC93188 ISOCOM COMPONENTS ISP06, ISP25, ISP40, ISP60 ORDER INFORMATION ISP06, ISP25, ISP40, ISP60 After PN PN Description Packing quantity None ISP06, ISP25, ISP40, ISP60 Standard DIP4 100 pcs per tube G ISP06G, ISP25G, ISP40G, ISP60G 10mm Lead Spacing 100 pcs per tube SM ISP06SM, ISP25SM, ISP40SM, ISP60SM Surface Mount 100 pcs per tube SMT&R ISP06SMT&R, ISP25SMT&R, ISP40SMT&R, ISP60SMT&R Surface Mount Tape & Reel 1000 pcs per reel DEVICE MARKING ISP 06 IYWW ISP06 I Y WW 7 11/09/2015 denotes Device Part Number (ISP06 is used as example) denotes Isocom denotes 1 digit Year code denotes 2 digit Week code DC93188 ISOCOM COMPONENTS ISP06, ISP25, ISP40, ISP60 PACKAGE DIMENSIONS (mm) DIP G Form SMD 8 11/09/2015 DC93188 ISOCOM COMPONENTS ISP06, ISP25, ISP40, ISP60 RECOMMENDED PAD LAYOUT FOR SMD (mm) TAPE AND REEL PACKAGING Direction of feed from reel Dimension No. A B Do D1 E F Dimension (mm) 10.4±0.1 4.55±0.1 1.5±0.1 1.5±0.05 1.75±0.1 7.5±0.1 Dimension No. Po P1 P2 t W K Dimension (mm) 4.0±0.1 12.0±0.1 2.0±0.1 0.33±0.1 16.0+0.3/ -0.1 4.55±0.1 9 11/09/2015 DC93188 ISOCOM COMPONENTS ISP06, ISP25, ISP40, ISP60 IR REFLOW SOLDERING TEMPERATURE PROFILE (One Time Reflow Soldering is Recommended) TP 260°C TP - 5°C Max Ramp Up Rate 3°C/s TEMP (°C) TL Tsmax Tsmin tP Max Ramp Down Rate 6°C/s 217°C TL 200°C 150°C ts Preheat 60s – 120s 25°C TIME (s) Time 25°C to Peak Temperature Profile Details Conditions Preheat - Min Temperature (TSMIN) - Max Temperature (TSMAX) - Time TSMIN to TSMAX (ts) 150°C 200°C 60s - 120s Soldering Zone - Peak Temperature (TP) - Liquidous Temperature (TL) - Time within 5°C of Actual Peak Temperature (TP ̶ 5°C) - Time maintained above TL (tL) - Ramp Up Rate (TL to TP) - Ramp Down Rate (TP to TL) 260°C 217°C 30s 60s - 100s 3°C/s max 6°C/s max Average Ramp Up Rate (Tsmax to TP) 3°C/s max Time 25°C to Peak Temperature 8 minutes max 10 11/09/2015 DC93188 ISOCOM COMPONENTS ISP06, ISP25, ISP40, ISP60 NOTES : - Isocom is continually improving the quality, reliability, function or design and Isocom reserves the right to make changes without further notices. - The products shown in this publication are designed for the general use in electronic applications such as office automation equipment, communications devices, audio/visual equipment, electrical application and instrumentation. - For equipment/application where high reliability or safety is required, such as space applications, nuclear power control equipment, medical equipment, etc., please contact our sales representatives. - When requiring a device for any ”specific” application, please contact our sales for advice. - The contents described herein are subject to change without prior notice. - Do not immerse device body in solder paste. 11 11/09/2015 DC93188 ISOCOM COMPONENTS DISCLAIMER ISOCOM is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing ISOCOM products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such ISOCOM products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that ISOCOM products are used within specified operating ranges as set forth in the most recent ISOCOM products specifications. __ The ISOCOM products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These ISOCOM products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation Instruments, traffic signal instruments, combustion control instruments, medical Instruments, all types of safety devices, etc.. Unintended Usage of ISOCOM products listed in this document shall be made at the customer’s own risk. __ Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage. __ The products described in this document are subject to the foreign exchange and foreign trade laws. __ The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by ISOCOM Components for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of ISOCOM Components or others. __ The information contained herein is subject to change without notice. 12 21/07/2015 Dxxxxxx