MOC3061SM

MOC306x DESCRIPTION The MOC306x Series are optically coupled isolators consisting of a Gallium Arsenide infrared emitting diode coupled with a monolithic silicon detector performing the functions of a zero crossing bilateral triac mounted in a standard 6 pin dual-in-line package. 1 Anode 2 Cathode 3 NC FEATURES 4 Main Terminal 1 • • • • 5 Substrate, (Do not Connect) 6 Main Terminal 2 • • • • Zero Voltage Crossing Triac Driver Output High VDRM minimum 600V High Critical Rate of Rise of Off-State Voltage dv/dt minimum 600V/μs Isolation Voltage 5000VRMS RoHS Compliant UL File No. E91231 Package System “TT” VDE File No. 40028086 APPLICATIONS • • • • • • Solenoid / Valve Controls Light Controls AC Motor Drivers Temperature Controls AC Motor Starters Solid State Relays ORDER INFORMATION • • • • Add Suffix “X” for VDE Approval Add G after PN for 10mm lead spacing Add SM after PN for Surface Mount Add SMT&R after PN for Surface Mount Tape & Reel ABSOLUTE MAXIMUM RATINGS TA = 25°C unless otherwise specified. Stresses exceeding the absolute maximum ratings can cause permanent damage to the device. Exposure to absolute maximum ratings for long periods of time can adversely affect reliability. Input Forward Current Reverse Voltage Juntion Temperature Power dissipation 50mA 6V 125°C 120mW Output Off State Output Terminal Voltage On State RMS Current Peak Repetitive Surge Current 600V 100mARMS 1.0A (Pulse Width 100μs, 120pps) Junction Temperature Power Dissipation 125°C 150mW Total Package Isolation Voltage Total Power Dissipation Operating Temperature Storage Temperature Lead Soldering Temperature (10s) ISOCOM COMPONENTS 2004 LTD Unit 25B, Park View Road West, Park View Industrial Estate Hartlepool, Cleveland, TS25 1PE, United Kingdom Tel: +44 (0)1429 863 609 Fax : +44 (0)1429 863 581 e-mail: sales@isocom.co.uk http://www.isocom.com 1 05/02/2018 5000VRMS 250mW -40 to 100°C -55 to 150°C 260°C ISOCOM COMPONENTS ASIA LTD Hong Kong Office, Block A, 8/F, Wah Hing Industrial mansion, 36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong. Tel: +852 2995 9217 Fax : +852 8161 6292 e-mail sales@isocom.com.hk DD93230 MOC306x ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) INPUT Parameter Symbol Test Condition Forward Voltage VF Reverse Current Min Typ. Max Unit IF = 20mA 1.2 1.4 V IR VR = 6V 0.05 10 μA Symbol Test Condition Typ. Max Unit IDRM VDRM = 600V IF = 0mA 500 nA OUTPUT Parameter Peak Off-state Current Either Direction Min Note 1 Peak Blocking Voltage Either Direction VDRM IDRM = 500nA On-state Voltage Either Direction VTM ITM = 100mA (peak) Critical Rate of Rise of Off-state Voltage (Static dv/dt) dv/dt IF = 0mA, Vin = 240VRMS 1000 Symbol Test Condition Min IFT VTM = 3V 600 V 3.0 V V/μs COUPLED Parameter Input Trigger Current Either Direction Holding Current Either Direction 2 05/02/2018 Typ. Max Unit mA Note 2 IH MOC3060 30 MOC3061 15 MOC3062 10 MOC3063 5 400 μA DD93230 MOC306x ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) ZERO CROSSING CHARACTERISTICS Parameter Symbol Test Condition Min Inhibit Voltage VINH IF = Rated IFT, MT1-MT2 Voltage above which device will not trigger Leakage Current at Inhibit State IDRM2 IF = Rated IFT, VDRM = 600V, Off-state Symbol Test Condition Min VISO RH = 40 to 60%, t = 1 min 5000 Typ. Max Unit 5 20 V 500 μA Max Unit ISOLATION Parameter Isolation Voltage Input-Output Typ. VRMS Note 3 Note 1 : Test Voltage must be applied within dv/dt rating. Note 2 : Guaranteed to trigger at an IF value less than or equal to max IFT, recommended IF lies between Rated IFT to Absolute Max IF. Note 3 : Measured with input leads shorted together and output leads shorted together. 3 05/02/2018 DD93230 MOC306x Fig 1 Forward Current vs Ambient Temperature Fig 2 On-State Current vs Ambient Temperature Fig 3 Forward Current vs Forward Voltage Fig 4 On-state Current vs On-State Voltage Fig 5 Minimum Trigger Current vs Ambient Temperature Fig 6 On-State Voltage vs Ambient Temperature 4 05/02/2018 DD93230 MOC306x Fig 7 Repetitive Peak Off-State Current vs Ambient Temperature 5 05/02/2018 Fig 8 Holding Current vs Ambient Temperature DD93230 MOC306x ORDER INFORMATION MOC306x (UL Approval) After PN PN Description Packing quantity None MOC3060, MOC3061, MOC3062, MOC3063 Standard DIP6 65 pcs per tube G MOC3060G, MOC3061G, MOC3062G, MOC3063G 10mm Lead Spacing 65 pcs per tube SM MOC3060SM, MOC3061SM, MOC3062SM, MOC3063SM Surface Mount 65 pcs per tube SMT&R MOC3060SMT&R, MOC3061SMT&R, MOC3062SMT&R, MOC3063SMT&R Surface Mount Tape & Reel 1000 pcs per reel MOC306x (UL and VDE Approvals) After PN PN Description Packing quantity None MOC3060X, MOC3061X, MOC3062X, MOC3063X Standard DIP6 65 pcs per tube G MOC3060XG, MOC3061XG, MOC3062XG, MOC3063XG 10mm Lead Spacing 65 pcs per tube SM MOC3060XSM, MOC3061XSM, MOC3062XSM, MOC3063XSM Surface Mount 65 pcs per tube SMT&R MOC3060XSMT&R, MOC3061XSMT&R, MOC3062XSMT&R, MOC3063XSMT&R Surface Mount Tape & Reel 1000 pcs per reel 6 05/02/2018 DD93230 MOC306x DEVICE MARKING Example : MOC3063X MOC3063X I YWW TT MOC3063X Denotes Device Part Number I denotes Isocom Y denotes 2 digit Year code WW denotes 2 digit Week code TT UL Package System Code 7 05/02/2018 DD93230 MOC306x PACKAGE DIMENSIONS in mm (inch) DIP G Form SMD 8 05/02/2018 DD93230 MOC306x TAPE AND REEL PACKAGING Description Symbol Dimension mm (inch) Tape Width W 16 ± 0.3 (0.63) Pitch of Sprocket Holes P0 4 ± 0.1 (0.15) F 7.5 ± 0.1 (0.295) P2 2 ± 0.1 (0.079) P1 12 ± 0.1 (0.47) Distance of Compartment to Sprocket Holes Distance of Compartment to Compartment RECOMMENDED PAD LAYOUT for SMD (mm) 9 05/02/2018 DD93230 MOC306x IR REFLOW SOLDERING TEMPERATURE PROFILE One Time Reflow Soldering is Recommended. Do not immerse device body in solder paste. TP 260°C TP - 5°C Max Ramp Up Rate 3°C/s TEMP (°C) TL Tsmax Tsmin tP Max Ramp Down Rate 6°C/s 217°C TL 200°C 150°C ts Preheat 60s – 120s 25°C TIME (s) Time 25°C to Peak Temperature Profile Details Conditions Preheat - Min Temperature (TSMIN) - Max Temperature (TSMAX) - Time TSMIN to TSMAX (ts) 150°C 200°C 60s - 120s Soldering Zone - Peak Temperature (TP) - Time at Peak Temperature - Liquidous Temperature (TL) - Time within 5°C of Actual Peak Temperature (TP ̶ 5°C) - Time maintained above TL (tL) - Ramp Up Rate (TL to TP) - Ramp Down Rate (TP to TL) 260°C 10s max 217°C 30s max 60s - 100s 3°C/s max 6°C/s max Average Ramp Up Rate (Tsmax to TP) 3°C/s max Time 25°C to Peak Temperature 8 minutes max 10 05/02/2018 DD93230 DISCLAIMER Isocom Components is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing Isocom Components products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such Isocom Components products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that Isocom Components products are used within specified operating ranges as set forth in the most recent Isocom Components products specifications. The Isocom Components products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These Isocom Components products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation Instruments, traffic signal instruments, combustion control instruments, medical Instruments, all types of safety devices, etc... Unintended Usage of Isocom Components products listed in this document shall be made at the customer’s own risk. Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage. The products described in this document are subject to the foreign exchange and foreign trade laws. The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by Isocom Components for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of Isocom Components or others. The information contained herein is subject to change without notice. 11 05/02/2018 DD93230