ISOCOM
COMPONENTS
PS2501-1, PS2501-2, PS2501-4
DESCRIPTION
The PS2501-1, PS2501-2 and PS2501-4 series of
optically coupled isolator consist of an infrared light
emitting diode and an NPN silicon photo transistor in
a space efficient Dual In Line Plastic Package.
PS2501-1
FEATURES
•
•
•
•
•
•
AC Isolation Voltage 5300VRMS
CTR Selections Available
Wide Operating Temperature Range
-30°C to +100°C
Lead Free and RoHS Compliant
UL File E91231 Package Code “EE”
VDE Approval Certificate No. 40028086
PS2501-2
PS2501-4
APPLICATIONS
•
•
•
•
Computer Terminals
Industrial System Controllers
Measuring Instruments
Signal Transmission between Systems of
Different Potentials and Impedances
ABSOLUTE MAXIMUM RATINGS
Stresses exceeding the absolute maximum ratings can cause
permanent damage to the device.
Exposure to absolute maximum ratings for long periods of time
can adversely affect reliability.
Input
ORDER INFORMATION
•
•
•
•
Add X after PN for VDE Approval
Add G after PN for 10mm lead spacing
Add SM after PN for Surface Mount
Add SMT&R after PN for Surface Mount
Tape & Reel
(Available for PS2501-1SM and PS2501-2SM)
Forward Current
Reverse Voltage
Power dissipation
50mA
6V
70mW
Output
Collector to Emitter Voltage BVCEO
Emitter to Collector Voltage BVECO
Collector Current
Power Dissipation
80V
6V
50mA
150mW
Total Package
Operating Temperature
Storage Temperature
Total Power Dissipation
(derate linearly 2.67mW/°C at >25°C)
Lead Soldering Temperature (10s)
ISOCOM COMPONENTS 2004 LTD
Unit 25B, Park View Road West, Park View Industrial Estate
Hartlepool, Cleveland, TS25 1PE, United Kingdom
Tel : +44 (0)1429 863 609 Fax : +44 (0)1429 863 581
e-mail : sales@isocom.co.uk
http://www.isocom.com
1 15/12/2016
-30 to +100 °C
-55 to +125 °C
200mW
260°C
ISOCOM COMPONENTS ASIA LTD
Hong Kong Office
Block A, 8/F, Wah Hing Industrial Mansion
36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong
Tel : +852 2995 9217 Fax : +852 8161 6292
e-mail : sales@isocom.com.hk
DD93204
ISOCOM
COMPONENTS
PS2501-1, PS2501-2, PS2501-4
ELECTRICAL CHARACTERISTICS (Ambient Temperature = 25°C unless otherwise specified)
INPUT
Parameter
Symbol
Test Condition
Min
Typ.
Max
Unit
Forward Voltage
VF
IF = 20mA
1.2
1.4
V
Reverse Voltage
VR
IR = 10μA
Reverse Leakage
IR
VR = 4V
Terminal Capacitance
Ct
V = 0V, f = 1KHz
Symbol
Test Condition
Min
Collector—Emitter
Breakdown Voltage
BVCEO
IC = 1mA, IF = 0mA
80
V
Emitter—Collector
Breakdown Voltage
BVECO
IE = 100µA, IF = 0mA
6
V
ICEO
VCE = 20V, IF = 0mA
Symbol
Test Condition
6.0
V
10
µA
30
250
pF
Typ.
Max
Unit
OUTPUT
Parameter
Collector-Emitter
Dark Current
100
nA
Max
Unit
%
COUPLED
Parameter
Current transfer ratio
CTR
Min
Typ.
IF = 5mA, VCE = 5V
80
600
Optional CTR Grades
GR
L (PS2501-1 only)
100
200
300
400
VCE(sat)
IF = 10mA, IC = 2mA
Input to Output
Isolation Voltage
VISO
AC 1 minute, RH = 40 to 60%
Note 1
5300
VRMS
Input to Output
Isolation Resistance
RISO
VIO= 500V
Note 1
5x1010
Ω
Output Rise Time
tr
VCE = 2V, Ic = 2mA, RL = 100Ω
4
18
µs
Output Fall Time
tf
VCE = 2V, Ic = 2mA, RL = 100Ω
3
18
µs
Collector—Emitter
Saturation Voltage
0.3
V
Note 1 : Measure with input leads shorted together and output leads shorted together.
2 15/12/2016
DD93204
ISOCOM
COMPONENTS
PS2501-1, PS2501-2, PS2501-4
Fig 1 Forward Current vs TA
Fig 2 Collector Power Dissipation vs TA
Fig 3 Collector-emitter Saturation Voltage vs
Forward Current
Fig 4 Collector Current vs
Collector-emitter Voltage
Fig 5 Current Transfer Ratio vs Forward Current
Fig 6 Forward Current vs Forward Voltage
3 15/12/2016
DD93204
ISOCOM
COMPONENTS
PS2501-1, PS2501-2, PS2501-4
Fig 7 Relative CTR vs TA
Fig 8 Frequency Response
Fig 9 Response Time vs Load Resistance
Response Time Test Circuit
4 15/12/2016
DD93204
ISOCOM
COMPONENTS
PS2501-1, PS2501-2, PS2501-4
ORDER INFORMATION
PS2501-1 (UL Approval)
After PN
Description
PN
Packing quantity
None
PS2501-1, PS2501-1GR,
PS2501-1L
Standard DIP4
100 pcs per tube
G
PS2501-1G, PS2501-1GRG,
PS2501-1LG
10mm Lead Spacing
100 pcs per tube
SM
PS2501-1SM, PS2501-1GRSM,
PS2501-1LSM
Surface Mount
100 pcs per tube
SMT&R
PS2501-1SMT&R,
PS2501-1GRSMT&R,
PS2501-1LSMT&R
Surface Mount Tape & Reel
1000 pcs per reel
PS2501-2 (UL Approval)
After PN
Description
PN
Packing quantity
None
PS2501-2, PS2501-2GR
Standard DIP8
50 pcs per tube
G
PS2501-2G, PS2501-2GRG
10mm Lead Spacing
50 pcs per tube
SM
PS2501-2SM, PS2501-2GRSM
Surface Mount
50 pcs per tube
SMT&R
PS2501-2SMT&R,
PS2501-2GRSMT&R,
Surface Mount Tape & Reel
1000 pcs per reel
PS2501-4 (UL Approval)
After PN
PN
Description
Packing quantity
None
PS2501-4, PS2501-4GR
Standard DIP16
25 pcs per tube
G
PS2501-4G, PS2501-4GRG
10mm Lead Spacing
25 pcs per tube
SM
PS2501-4SM, PS2501-4GRSM
Surface Mount
25 pcs per tube
CTR grade “L” available only for PS2501-1.
5 15/12/2016
DD93204
ISOCOM
COMPONENTS
PS2501-1, PS2501-2, PS2501-4
ORDER INFORMATION
PS2501-1X (UL and VDE Approvals)
After PN
Description
PN
Packing quantity
None
PS2501-1X, PS2501-1XGR,
PS2501-1XL
Standard DIP4
100 pcs per tube
G
PS2501-1XG, PS2501-1XGRG,
PS2501-1XLG
10mm Lead Spacing
100 pcs per tube
SM
PS2501-1XSM,
PS2501-1XGRSM,
PS2501-1XLSM
Surface Mount
100 pcs per tube
SMT&R
PS2501-1XSMT&R,
PS2501-1XGRSMT&R,
PS2501-1XLSMT&R
Surface Mount Tape & Reel
1000 pcs per reel
PS2501-2X (UL and VDE Approvals)
After PN
Description
PN
Packing quantity
None
PS2501-2X, PS2501-2XGR
Standard DIP8
50 pcs per tube
G
PS2501-2XG, PS2501-2XGRG
10mm Lead Spacing
50 pcs per tube
SM
PS2501-2XSM,
PS2501-2XGRSM,
Surface Mount
50 pcs per tube
SMT&R
PS2501-2XSMT&R,
PS2501-2XGRSMT&R
Surface Mount Tape & Reel
1000 pcs per reel
PS2501-4X (UL and VDE Approvals)
After PN
PN
Description
Packing quantity
None
PS2501-4X, PS2501-4XGR,
Standard DIP16
25 pcs per tube
G
PS2501-4XG, PS2501-4XGRG
10mm Lead Spacing
25 pcs per tube
SM
PS2501-4XSM,
PS2501-4XGRSM
Surface Mount
25 pcs per tube
CTR grade “L” available only for PS2501-1.
6 15/12/2016
DD93204
ISOCOM
COMPONENTS
PS2501-1, PS2501-2, PS2501-4
PACKAGE DIMENSIONS in mm (inch)
DIP
PS2501-1
PS2501-2
PS2501-4
7 15/12/2016
DD93204
ISOCOM
COMPONENTS
PS2501-1, PS2501-2, PS2501-4
PACKAGE DIMENSIONS in mm (inch)
G Form
PS2501-1G
PS2501-2G
PS2501-4G
8 15/12/2016
DD93204
ISOCOM
COMPONENTS
PS2501-1, PS2501-2, PS2501-4
PACKAGE DIMENSIONS in mm (inch)
SMD
PS2501-1SM
PS2501-2SM
PS2501-4SM
9 15/12/2016
DD93204
ISOCOM
COMPONENTS
PS2501-1, PS2501-2, PS2501-4
RECOMMENDED PAD LAYOUT FOR SMD (mm)
PS2501-1SM
PS2501-2SM
PS2501-4SM
10 15/12/2016
DD93204
ISOCOM
COMPONENTS
PS2501-1, PS2501-2, PS2501-4
TAPE AND REEL PACKAGING
PS2501-1SMT&R
PS2501-2SMT&R
11 15/12/2016
DD93204
ISOCOM
COMPONENTS
PS2501-1, PS2501-2, PS2501-4
IR REFLOW SOLDERING TEMPERATURE PROFILE FOR SMD
(One Time Reflow Soldering is Recommended)
TP
260°C
TP - 5°C
Max Ramp Up Rate
3°C/s
TEMP (°C)
TL
Tsmax
Tsmin
tP
Max Ramp Down Rate
6°C/s
217°C
TL
200°C
150°C
ts Preheat
60s – 120s
25°C
TIME (s)
Time 25°C to Peak Temperature
Profile Details
Conditions
Preheat
- Min Temperature (TSMIN)
- Max Temperature (TSMAX)
- Time TSMIN to TSMAX (ts)
150°C
200°C
60s - 120s
Soldering Zone
- Peak Temperature (TP)
- Time at Peak Temperature
- Liquidous Temperature (TL)
- Time within 5°C of Actual Peak Temperature (TP ̶ 5°C)
- Time maintained above TL (tL)
- Ramp Up Rate (TL to TP)
- Ramp Down Rate (TP to TL)
260°C
10s max
217°C
30s max
60s - 100s
3°C/s max
6°C/s max
Average Ramp Up Rate (Tsmax to TP)
3°C/s max
Time 25°C to Peak Temperature
8 minutes max
12 15/12/2016
DD93204
ISOCOM
COMPONENTS
PS2501-1, PS2501-2, PS2501-4
NOTES :
- Isocom is continually improving the quality, reliability, function or design and Isocom reserves
the right to make changes without further notices.
- The products shown in this publication are designed for the general use in electronic
applications such as office automation equipment, communications devices, audio/visual
equipment, electrical application and instrumentation.
- For equipment/application where high reliability or safety is required, such as space
applications, nuclear power control equipment, medical equipment, etc., please contact our
sales representatives.
- When requiring a device for any ”specific” application, please contact our sales for advice.
- The contents described herein are subject to change without prior notice.
- Do not immerse device body in solder paste.
13 15/12/2016
DD93204
ISOCOM
COMPONENTS
DISCLAIMER
__ ISOCOM is continually working to improve the quality and reliability of its products.
Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent
electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer,
when utilizing ISOCOM products, to comply with the standards of safety in making a safe
design for the entire system, and to avoid situations in which a malfunction or failure of such
ISOCOM products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that ISOCOM products are used within specified
operating ranges as set forth in the most recent ISOCOM products specifications.
__ The ISOCOM products listed in this document are intended for usage in general
electronics applications (computer, personal equipment, office equipment, measuring
equipment, industrial robotics, domestic appliances, etc.). These ISOCOM products are
neither intended nor warranted for usage in equipment that requires extraordinarily high quality
and/or reliability or a malfunction or failure of which may cause loss of human life or bodily
injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments,
airplane or spaceship instruments, transportation Instruments, traffic signal instruments,
combustion control instruments, medical Instruments, all types of safety devices, etc..
Unintended Usage of ISOCOM products listed in this document shall be made at the
customer’s own risk.
__ Gallium arsenide (GaAs) is a substance used in the products described in this document.
GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to
dissolve them. When disposing of the products, follow the appropriate regulations. Do not
dispose of the products with other industrial waste or with domestic garbage.
__ The products described in this document are subject to the foreign exchange and foreign
trade laws.
__ The information contained herein is presented only as a guide for the applications of our
products. No responsibility is assumed by ISOCOM Components for any infringements of
intellectual property or other rights of the third parties which may result from its use. No license
is granted by implication or otherwise under any intellectual property or other rights of
ISOCOM Components or others.
__ The information contained herein is subject to change without notice.
14 15/12/2016
DD93204