ISOCOM
COMPONENTS
TLP521, TLP521-2, TLP521-4
DESCRIPTION
The TLP521, TLP521-2 and TLP521-4 series of
optically coupled isolator consist of an infrared light
emitting diode and an NPN silicon photo transistor in
a space efficient Dual In Line Plastic Package.
TLP521
FEATURES
•
•
•
•
•
•
AC Isolation Voltage 5300VRMS
CTR Selections Available
Wide Operating Temperature Range
-30°C to +100°C
Lead Free and RoHS Compliant
UL File E91231 Package Code “EE”
VDE Approval Certificate No. 40028086
APPLICATIONS
•
•
•
•
Computer Terminals
Industrial System Controllers
Measuring Instruments
Signal Transmission between Systems of
Different Potentials and Impedances
ORDER INFORMATION
•
•
•
•
•
•
Add X after PN for VDE Approval
Add G after PN for 10mm lead spacing
Add SM after PN for Surface Mount
Add SMT&R after PN for Surface Mount
Tape & Reel
(Available for TLP521SM and TLP521-2SM)
Optional Order Part No. TLP521-1 for TLP521
Consult Factory for Tape and Reel version of
TLP521-4SM
TLP521-2
TLP521-4
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Stresses exceeding the absolute maximum ratings can cause
permanent damage to the device.
Exposure to absolute maximum ratings for long periods of time
can adversely affect reliability.
Input
Forward Current
Reverse Voltage
Power dissipation
50mA
6V
70mW
Output
Collector to Emitter Voltage BVCEO
Emitter to Collector Voltage BVECO
Collector Current
Power Dissipation
55V
6V
50mA
150mW
Total Package
Isolation Voltage
Total Power Dissipation
Operating Temperature
Storage Temperature
Lead Soldering Temperature
(10s)
ISOCOM COMPONENTS 2004 LTD
Unit 25B, Park View Road West, Park View Industrial Estate
Hartlepool, Cleveland, TS25 1PE, United Kingdom
Tel : +44 (0)1429 863 609 Fax : +44 (0)1429 863 581
e-mail : sales@isocom.co.uk
http://www.isocom.com
1 24/08/2017
5300VRMS
200mW
-30 to 100 °C
-55 to 125 °C
260°C
ISOCOM COMPONENTS ASIA LTD
Hong Kong Office
Block A, 8/F, Wah Hing Industrial Mansion
36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong
Tel : +852 2995 9217 Fax : +852 8161 6292
e-mail : sales@isocom.com.hk
DD93208
ISOCOM
COMPONENTS
TLP521, TLP521-2, TLP521-4
ELECTRICAL CHARACTERISTICS (Ambient Temperature = 25°C unless otherwise specified)
INPUT
Parameter
Symbol
Test Condition
Min
Typ.
Max
Unit
Forward Voltage
VF
IF = 10mA
1.0
1.15
1.3
V
Reverse Voltage
VR
IR = 10μA
6.0
Reverse Leakage
IR
VR = 4V
Terminal Capacitance
Ct
V = 0V, f = 1KHz
Symbol
Test Condition
Min
Collector—Emitter
breakdown Voltage
BVCEO
IC = 0.5mA, IF = 0mA
55
V
Emitter—Collector
breakdown Voltage
BVECO
IE = 100µA, IF = 0mA
6
V
ICEO
VCE = 20V, IF = 0mA
V
10
µA
30
250
pF
Typ.
Max
Unit
OUTPUT
Parameter
Collector-Emitter Dark
Current
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100
nA
DD93208
ISOCOM
COMPONENTS
TLP521, TLP521-2, TLP521-4
ELECTRICAL CHARACTERISTICS (Ambient Temperature = 25°C unless otherwise specified)
COUPLED
Parameter
Current Transfer Ratio
Symbol
CTR
Test Condition
Min
Typ.
Max
Unit
%
IF = 5mA, VCE = 5V
50
600
Optional CTR Grades
GR
BL
GB
GB (IF = 1mA, VCE = 0.4V)
100
200
100
30
300
600
600
Collector—Emitter
Saturation Voltage
VCE(sat)
IF = 8mA, IC = 2.4mA
GB (IF = 1mA, IC = 0.2mA)
Output Rise Time
tr
Output Fall Time
tf
VCE = 2V,
Ic = 2mA,
RL = 100Ω
Turn-on Time
ton
3
Turn-off Time
toff
3
Turn-on Time
tON
Turn-off Time
tOFF
VCC= 5V,
IF = 16mA,
RL = 1.9kΩ
Symbol
Test Condition
Min
Input to Output
Isolation Voltage
VISO
AC 1 minute, RH = 40 to 60%
Note 1
5300
VRMS
Input to Output
Isolation Resistance
RISO
VIO= 500V
Note 1
5x1010
Ω
0.4
0.4
4
V
µs
3
2
µs
25
ISOLATION
Parameter
Typ.
Max
Unit
Note 1 : Measure with input leads shorted together and output leads shorted together.
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DD93208
ISOCOM
COMPONENTS
TLP521, TLP521-2, TLP521-4
Fig 1 Forward Current vs TA
Fig 2 Collector Power Dissipation vs TA
Fig 3 Forward Current vs Forward Voltage
Fig 4 Collector Current vs
Collector-Emitter Voltage
Fig 5 Normalized Current Transfer Ratio vs
Forward Current
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Fig 6 Normalized Current Transfer Ratio vs
Ambient Temperature
DD93208
ISOCOM
COMPONENTS
TLP521, TLP521-2, TLP521-4
Fig 7 Collector-Emitter Voltage vs Forward Current
Fig 8 Collector-Emitter Voltage vs
Ambient Temperature
Fig 9 Collector Dark Current vs
Ambient Temperture
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DD93208
ISOCOM
COMPONENTS
TLP521, TLP521-2, TLP521-4
Fig 7 Response Time vs Load Resistance
Fig 9 Frequency Response
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Response Time Test Circuit
Frequency Response Test Circuit
DD93208
ISOCOM
COMPONENTS
TLP521, TLP521-2, TLP521-4
ORDER INFORMATION
TLP521, TLP521-1 (UL Approval)
After PN
PN
Description
Packing quantity
None
TLP521, TLP521-1
TLP521GR, TLP521-1GR
TLP521BL, TLP521-1BL,
TLP521GB, TLP521-1GB
Standard DIP4
100 pcs per tube
G
TLP521G, TLP521-1G,
TLP521GRG, TLP521-1GRG,
TLP521BLG, TLP521-1BLG
TLP521GBG, TLP521-1GBG
10mm Lead Spacing
100 pcs per tube
SM
Surface Mount
TLP521SM, TLP521-1SM,
TLP521GRSM, TLP521-1GRSM,
TLP521BLSM, TLP521-1BLSM,
TLP521GBSM, TLP521-1GBSM
100 pcs per tube
SMT&R
TLP521SMT&R,
TLP521-1SMT&R
TLP521GRSMT&R,
TLP521-1GRSMT&R,
TLP521BLSMT&R,
TLP521-1BLSMT&R,
TLP521GBSMT&R,
TLP521-1GBSMT&R
1000 pcs per reel
Surface Mount Tape & Reel
Note : Optional Order Part No. TLP521-1 for TLP521.
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DD93208
ISOCOM
COMPONENTS
TLP521, TLP521-2, TLP521-4
ORDER INFORMATION
TLP521-2 (UL Approval)
After PN
Description
PN
Packing quantity
None
TLP521-2, TLP521-2GR,
TLP521-2BL, TLP521-2GB
Standard DIP8
50 pcs per tube
G
TLP521-2G, TLP521-2GRG,
TLP521-2BLG, TLP521-2GBG
10mm Lead Spacing
50 pcs per tube
SM
TLP521-2SM, TLP521-2GRSM,
TLP521-2BLSM,
TLP521-2GBSM
Surface Mount
50 pcs per tube
SMT&R
TLP521-2SMT&R,
TLP521-2GRSMT&R,
TLP521-2BLSMT&R,
TLP521-2GBSMT&R
Surface Mount Tape & Reel
1000 pcs per reel
TLP521-4 (UL Approval)
After PN
PN
Description
Packing quantity
None
TLP521-4, TLP521-4GR,
TLP521-4BL, TLP521-4GB
Standard DIP16
25 pcs per tube
G
TLP521-4G, TLP521-4GRG,
TLP521-4BLG, TLP521-4GBG
10mm Lead Spacing
25 pcs per tube
SM
TLP521-4SM, TLP521-4GRSM,
TLP521-4BLSM,
TLP521-4GBSM
Surface Mount
25 pcs per tube
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DD93208
ISOCOM
COMPONENTS
TLP521, TLP521-2, TLP521-4
ORDER INFORMATION
TLP521X, TLP521-1X (UL and VDE Approvals)
After PN
PN
Description
Packing quantity
None
TLP521X, TLP521-1X
TLP521XGR, TLP521-1XGR
TLP521XBL, TLP521-1XBL,
TLP521XGB, TLP521-1XGB
Standard DIP4
100 pcs per tube
G
TLP521XG, TLP521-1XG,
TLP521XGRG, TLP521-1XGRG,
TLP521XBLG, TLP521-1XBLG
TLP521XGBG, TLP521-1XGBG
10mm Lead Spacing
100 pcs per tube
SM
TLP521XSM, TLP521-1XSM,
TLP521XGRSM,
TLP521-1XGRSM,
TLP521XBLSM,
TLP521-1XBLSM,
TLP521XGBSM,
TLP521-1XGBSM
Surface Mount
100 pcs per tube
SMT&R
TLP521XSMT&R,
TLP521-1XSMT&R
TLP521XGRSMT&R,
TLP521-1XGRSMT&R,
TLP521XBLSMT&R,
TLP521-1XBLSMT&R,
TLP521XGBSMT&R,
TLP521-1XGBSMT&R
Surface Mount Tape & Reel
1000 pcs per reel
Note : Optional Order Part No. TLP521-1 for TLP521.
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DD93208
ISOCOM
COMPONENTS
TLP521, TLP521-2, TLP521-4
ORDER INFORMATION
TLP521-2X (UL and VDE Approvals)
After PN
Description
PN
Standard DIP8
Packing quantity
None
TLP521-2X, TLP521-2XGR,
TLP521-2XBL, TLP521-2XGB
50 pcs per tube
G
10mm Lead Spacing
TLP521-2XG, TLP521-2XGRG
TLP521-2XBLG, TLP521-2XGBG
50 pcs per tube
SM
TLP521-2XSM,
TLP521-2XGRSM,
TLP521-2XBLSM,
TLP521-2XGBSM
Surface Mount
50 pcs per tube
SMT&R
TLP521-2XSMT&R,
TLP521-2XGRSMT&R,
TLP521-2XBLSMT&R,
TLP521-2XGBSMT&R
Surface Mount Tape & Reel
1000 pcs per reel
TLP521-4X (UL and VDE Approvals)
After PN
PN
Description
None
TLP521-4X, TLP521-4XGR,
TLP521-4XBL, TLP521-4XGB
G
TLP521-4XG, TLP521-4XGRG,
10mm Lead Spacing
TLP521-4XBLG, TLP521-4XGBG
25 pcs per tube
SM
TLP521-4XSM,
TLP521-4XGRSM,
TLP521-4XBLSM,
TLP521-4XGBSM
25 pcs per tube
10 24/08/2017
Standard DIP16
Packing quantity
Surface Mount
25 pcs per tube
DD93208
ISOCOM
COMPONENTS
TLP521, TLP521-2, TLP521-4
PACKAGE DIMENSIONS in mm (inch)
DIP
TLP521
TLP521-2
TLP521-4
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DD93208
ISOCOM
COMPONENTS
TLP521, TLP521-2, TLP521-4
PACKAGE DIMENSIONS in mm (inch)
G Form
TLP521G
TLP521-2G
TLP521-4G
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DD93208
ISOCOM
COMPONENTS
TLP521, TLP521-2, TLP521-4
PACKAGE DIMENSIONS in mm (inch)
SMD
TLP521SM
TLP521-2SM
TLP521-4SM
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DD93208
ISOCOM
COMPONENTS
TLP521, TLP521-2, TLP521-4
RECOMMENDED PAD LAYOUT FOR SMD (mm)
TLP521SM
TLP521-2SM
TLP521-4SM
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DD93208
ISOCOM
COMPONENTS
TLP521, TLP521-2, TLP521-4
TAPE AND REEL PACKAGING
TLP521SMT&R
TLP521-2SMT&R
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DD93208
ISOCOM
COMPONENTS
TLP521, TLP521-2, TLP521-4
IR REFLOW SOLDERING TEMPERATURE PROFILE FOR SMD
(One Time Reflow Soldering is Recommended)
TP
260°C
TP - 5°C
Max Ramp Up Rate
3°C/s
TEMP (°C)
TL
Tsmax
Tsmin
tP
Max Ramp Down Rate
6°C/s
217°C
TL
200°C
150°C
ts Preheat
60s – 120s
25°C
TIME (s)
Time 25°C to Peak Temperature
Profile Details
Conditions
Preheat
- Min Temperature (TSMIN)
- Max Temperature (TSMAX)
- Time TSMIN to TSMAX (ts)
150°C
200°C
60s - 120s
Soldering Zone
- Peak Temperature (TP)
- Time at Peak Temperature
- Liquidous Temperature (TL)
- Time within 5°C of Actual Peak Temperature (TP ̶ 5°C)
- Time maintained above TL (tL)
- Ramp Up Rate (TL to TP)
- Ramp Down Rate (TP to TL)
260°C
10s max
217°C
30s max
60s - 100s
3°C/s max
6°C/s max
Average Ramp Up Rate (Tsmax to TP)
3°C/s max
Time 25°C to Peak Temperature
8 minutes max
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ISOCOM
COMPONENTS
TLP521, TLP521-2, TLP521-4
NOTES :
- Isocom is continually improving the quality, reliability, function or design and Isocom reserves
the right to make changes without further notices.
- The products shown in this publication are designed for the general use in electronic
applications such as office automation equipment, communications devices, audio/visual
equipment, electrical application and instrumentation.
- For equipment/application where high reliability or safety is required, such as space
applications, nuclear power control equipment, medical equipment, etc., please contact our
sales representatives.
- When requiring a device for any ”specific” application, please contact our sales for advice.
- The contents described herein are subject to change without prior notice.
- Do not immerse device body in solder paste.
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ISOCOM
COMPONENTS
DISCLAIMER
__ ISOCOM is continually working to improve the quality and reliability of its products.
Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent
electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer,
when utilizing ISOCOM products, to comply with the standards of safety in making a safe
design for the entire system, and to avoid situations in which a malfunction or failure of such
ISOCOM products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that ISOCOM products are used within specified
operating ranges as set forth in the most recent ISOCOM products specifications.
__ The ISOCOM products listed in this document are intended for usage in general
electronics applications (computer, personal equipment, office equipment, measuring
equipment, industrial robotics, domestic appliances, etc.). These ISOCOM products are
neither intended nor warranted for usage in equipment that requires extraordinarily high quality
and/or reliability or a malfunction or failure of which may cause loss of human life or bodily
injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments,
airplane or spaceship instruments, transportation Instruments, traffic signal instruments,
combustion control instruments, medical Instruments, all types of safety devices, etc..
Unintended Usage of ISOCOM products listed in this document shall be made at the
customer’s own risk.
__ Gallium arsenide (GaAs) is a substance used in the products described in this document.
GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to
dissolve them. When disposing of the products, follow the appropriate regulations. Do not
dispose of the products with other industrial waste or with domestic garbage.
__ The products described in this document are subject to the foreign exchange and foreign
trade laws.
__ The information contained herein is presented only as a guide for the applications of our
products. No responsibility is assumed by ISOCOM Components for any infringements of
intellectual property or other rights of the third parties which may result from its use. No license
is granted by implication or otherwise under any intellectual property or other rights of
ISOCOM Components or others.
__ The information contained herein is subject to change without notice.
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