TLP621-1GR

TLP621, TLP621-2, TLP621-4 DESCRIPTION The TLP621, TLP621-2 and TLP621-4 series of optically coupled isolator consist of an infrared light emitting diode and an NPN silicon photo transistor in a space efficient Dual In Line Plastic Package. TLP621 FEATURES • • • • • • AC Isolation Voltage 5300VRMS CTR Selections Available Wide Operating Temperature Range -30°C to +100°C Lead Free and RoHS Compliant UL File E91231 Package Code “EE” VDE Approval Certificate No. 40028086 TLP621-2 TLP621-4 APPLICATIONS • • • • Computer Terminals Industrial System Controllers Measuring Instruments Signal Transmission between Systems of Different Potentials and Impedances ORDER INFORMATION • • • • • Add X after PN for VDE Approval Add G after PN for 10mm lead spacing Add SM after PN for Surface Mount Add SMT&R after PN for Surface Mount Tape & Reel (Available for TLP621SM and TLP621-2SM) Optional Order Part No. TLP621-1 for TLP621 ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Stresses exceeding the absolute maximum ratings can cause permanent damage to the device. Exposure to absolute maximum ratings for long periods of time can adversely affect reliability. Input Forward Current Reverse Voltage Power dissipation 50mA 6V 70mW Output Collector to Emitter Voltage BVCEO Emitter to Collector Voltage BVECO Collector Current Power Dissipation 55V 6V 50mA 150mW Total Package Isolation Voltage Total Power Dissipation Operating Temperature Storage Temperature Lead Soldering Temperature (10s) ISOCOM COMPONENTS 2004 LTD Unit 25B, Park View Road West, Park View Industrial Estate Hartlepool, Cleveland, TS25 1PE, United Kingdom Tel : +44 (0)1429 863 609 Fax : +44 (0)1429 863 581 e-mail : sales@isocom.co.uk http://www.isocom.com 1 06/06/2023 5300VRMS 200mW -30 to 100 °C -55 to 125 °C 260°C ISOCOM COMPONENTS ASIA LTD Hong Kong Office Block A, 8/F, Wah Hing Industrial Mansion 36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong Tel : +852 2995 9217 Fax : +852 8161 6292 e-mail : sales@isocom.com.hk DE93308 TLP621, TLP621-2, TLP621-4 ELECTRICAL CHARACTERISTICS (Ambient Temperature = 25°C unless otherwise specified) INPUT Parameter Symbol Test Condition Min Typ. Max Unit Forward Voltage VF IF = 10mA 1.0 1.15 1.3 V Reverse Voltage VR IR = 10μA 5.0 Reverse Leakage IR VR = 5V Terminal Capacitance Ct V = 0V, f = 1KHz Symbol Test Condition Min Collector—Emitter breakdown Voltage BVCEO IC = 0.5mA, IF = 0mA 55 V Emitter—Collector breakdown Voltage BVECO IE = 100µA, IF = 0mA 6 V ICEO VCE = 24V, IF = 0mA V 10 µA 30 250 pF Typ. Max Unit OUTPUT Parameter Collector-Emitter Dark Current 2 06/06/2023 100 nA DE93308 TLP621, TLP621-2, TLP621-4 ELECTRICAL CHARACTERISTICS (Ambient Temperature = 25°C unless otherwise specified) COUPLED Parameter Current Transfer Ratio Symbol CTR Test Condition Min Typ. Max Unit % IF = 5mA, VCE = 5V 50 600 Optional CTR Grades GR BL GB GB (IF = 1mA, VCE = 0.4V) 100 200 100 30 300 600 600 Collector—Emitter Saturation Voltage VCE(sat) IF = 8mA, IC = 2.4mA GB (IF = 1mA, IC = 0.2mA) 0.4 0.4 Output Rise Time tr Output Fall Time tf VCE = 10V, Ic = 2mA, RL = 100Ω Turn-on Time ton 3 Turn-off Time toff 3 2 V µs 3 ISOLATION Parameter Symbol Test Condition Min Typ. Max Unit Input to Output Isolation Voltage VISO AC 1 minute, RH = 40 to 60% Note 1 5300 VRMS Input to Output Isolation Resistance RISO VIO= 500V Note 1 5x1010 Ω Note 1 : Measure with input leads shorted together and output leads shorted together. 3 06/06/2023 DE93308 TLP621, TLP621-2, TLP621-4 Fig 1 Forward Current vs TA Fig 2 Collector Power Dissipation vs TA Fig 3 Collector-emitter Saturation Voltage vs Forward Current Fig 4 Collector Current vs Collector-emitter Voltage Fig 5 Current Transfer Ratio vs Forward Current Fig 6 Forward Current vs Forward Voltage 4 06/06/2023 DE93308 TLP621, TLP621-2, TLP621-4 Fig 7 Relative CTR vs TA Fig 8 Frequency Response Fig 9 Response Time vs Load Resistance Response Time Test Circuit 5 06/06/2023 DE93308 TLP621, TLP621-2, TLP621-4 ORDER INFORMATION TLP621, TLP621-1 (UL Approval) After PN PN Description Packing quantity None TLP621, TLP621-1 TLP621GR, TLP621-1GR TLP621BL, TLP621-1BL TLP621GB, TLP621-1GB Standard DIP4 100 pcs per tube G TLP621G, TLP621-1G TLP621GRG, TLP621-1GRG TLP621BLG, TLP621-1BLG TLP621GBG, TLP621-1GBG 10mm Lead Spacing 100 pcs per tube SM TLP621SM, TLP621-1SM TLP621GRSM, TLP621-1GRSM TLP621BLSM, TLP621-1BLSM TLP621GBSM, TLP621-1GBSM Surface Mount 100 pcs per tube SMT&R TLP621SMT&R TLP621-1SMT&R TLP621GRSMT&R TLP621-1GRSMT&R TLP621BLSMT&R TLP621-1BLSMT&R TLP621GBSMT&R TLP621-1GBSMT&R Surface Mount Tape & Reel 1000 pcs per reel Note : Optional Order Part No. TLP621-1 for TLP621. Devices with suffix “X” (UL and VDE approvals) may be supplied when ordering the above Part Numbers (UL approval only). 6 06/06/2023 DE93308 TLP621, TLP621-2, TLP621-4 ORDER INFORMATION TLP621-2 (UL Approval) After PN PN Description Packing quantity None TLP621-2, TLP621-2GR, TLP621-2BL, TLP621-2GB Standard DIP8 50 pcs per tube G TLP621-2G, TLP621-2GRG, TLP621-2BLG, TLP621-2GBG 10mm Lead Spacing 50 pcs per tube SM TLP621-2SM, TLP621-2GRSM, TLP621-2BLSM, TLP621-2GBSM Surface Mount 50 pcs per tube SMT&R TLP621-2SMT&R, TLP621-2GRSMT&R, TLP621-2BLSMT&R, TLP621-2GBSMT&R Surface Mount Tape & Reel 1000 pcs per reel TLP621-4 (UL Approval) After PN PN Description Packing quantity None TLP621-4,TLP621-4GR, TLP621-4BL, TLP621-4GB Standard DIP16 25 pcs per tube G TLP621-4G, TLP621-4GRG, TLP621-4BLG, TLP621-4GBG 10mm Lead Spacing 25 pcs per tube SM TLP621-4SM, TLP621-4GRSM, TLP621-4BLSM, TLP621-4GBSM Surface Mount 25 pcs per tube 7 06/06/2023 DE93308 TLP621, TLP621-2, TLP621-4 ORDER INFORMATION TLP621X, TLP621-1X (UL and VDE Approvals) After PN PN Description Packing quantity None TLP621X, TLP621-1X TLP621XGR, TLP621-1XGR TLP621XBL, TLP621-1XBL TLP621XGB, TLP621-1XGB Standard DIP4 100 pcs per tube G TLP621XG, TLP621-1XG TLP621XGRG, TLP621-1XGRG TLP621XBLG, TLP621-1XBLG TLP621XGBG, TLP621-1XGBG 10mm Lead Spacing 100 pcs per tube SM TLP621XSM, TLP621-1XSM TLP621XGRSM TLP621-1XGRSM TLP621XBLSM TLP621-1XBLSM TLP621XGBSM TLP621-1XGBSM Surface Mount 100 pcs per tube SMT&R TLP621XSMT&R TLP621-1XSMT&R TLP621XGRSMT&R TLP621-1XGRSMT&R TLP621XBLSMT&R TLP621-1XBLSMT&R TLP621XGBXSMT&R TLP621-1XGBXSMT&R Surface Mount Tape & Reel 1000 pcs per reel Note : Optional Order Part No. TLP621-1X for TLP621X. Devices with suffix “X” (UL and VDE approvals) may be supplied when ordering the above Part Numbers (UL approval only). 8 06/06/2023 DE93308 TLP621, TLP621-2, TLP621-4 ORDER INFORMATION TLP621-2X (UL and VDE Approvals) After PN PN Description Standard DIP8 Packing quantity None TLP621-2X, TLP621-2XGR, TLP621-2XBL, TLP621-2XGB 50 pcs per tube G TLP621-2XG, TLP621-2XGRG, 10mm Lead Spacing TLP621-2XBLG, TLP621-2XGBG 50 pcs per tube SM TLP621-2XSM, TLP621-2XGRSM, TLP621-2XBLSM, TLP621-2XGBSM Surface Mount 50 pcs per tube SMT&R TLP621-2XSMT&R, TLP621-2XGRSMT&R, TLP621-2XBLSMT&R, TLP621-2XGBSMT&R Surface Mount Tape & Reel 1000 pcs per reel TLP621-4X (UL and VDE Approvals) After PN PN Description None TLP621-4X, TLP621-4XGR, TLP621-4XBL, TLP621-4XGB G TLP621-4XG, TLP621-4XGRG, 10mm Lead Spacing TLP621-4XBLG, TLP621-4XGBG 25 pcs per tube SM TLP621-4XSM, TLP621-4XGRSM, TLP621-4XBLSM, TLP621-4XGBSM 25 pcs per tube 9 06/06/2023 Standard DIP16 Packing quantity Surface Mount 25 pcs per tube DE93308 TLP621, TLP621-2, TLP621-4 PACKAGE DIMENSIONS in mm (inch) DIP TLP621 TLP621-2 TLP621-4 10 06/06/2023 DE93308 TLP621, TLP621-2, TLP621-4 PACKAGE DIMENSIONS in mm (inch) G Form TLP621G TLP621-2G TLP621-4G 11 06/06/2023 DE93308 TLP621, TLP621-2, TLP621-4 PACKAGE DIMENSIONS in mm (inch) SMD TLP621SM TLP621-2SM TLP621-4SM 12 06/06/2023 DE93308 TLP621, TLP621-2, TLP621-4 RECOMMENDED PAD LAYOUT FOR SMD (mm) TLP621SM TLP621-2SM TLP621-4SM 13 06/06/2023 DE93308 TLP621, TLP621-2, TLP621-4 TAPE AND REEL PACKAGING TLP621SMT&R TLP621-2SMT&R 14 06/06/2023 DE93308 TLP621, TLP621-2, TLP621-4 IR REFLOW SOLDERING TEMPERATURE PROFILE FOR SMD (One Time Reflow Soldering is Recommended) TP 260°C TP - 5°C Max Ramp Up Rate 3°C/s TEMP (°C) TL Tsmax Tsmin tP Max Ramp Down Rate 6°C/s 217°C TL 200°C 150°C ts Preheat 60s – 120s 25°C TIME (s) Time 25°C to Peak Temperature Profile Details Conditions Preheat - Min Temperature (TSMIN) - Max Temperature (TSMAX) - Time TSMIN to TSMAX (ts) 150°C 200°C 60s - 120s Soldering Zone - Peak Temperature (TP) - Time at Peak Temperature - Liquidous Temperature (TL) - Time within 5°C of Actual Peak Temperature (TP ̶ 5°C) - Time maintained above TL (tL) - Ramp Up Rate (TL to TP) - Ramp Down Rate (TP to TL) 260°C 10s max 217°C 30s max 60s - 100s 3°C/s max 6°C/s max Average Ramp Up Rate (Tsmax to TP) 3°C/s max Time 25°C to Peak Temperature 8 minutes max 15 06/06/2023 DE93308 DISCLAIMER Isocom Components is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing Isocom Components products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such Isocom Components products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that Isocom Components products are used within specified operating ranges as set forth in the most recent Isocom Components products specifications. The Isocom Components products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These Isocom Components products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation Instruments, traffic signal instruments, combustion control instruments, medical Instruments, all types of safety devices, etc... Unintended Usage of Isocom Components products listed in this document shall be made at the customer’s own risk. Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage. The products described in this document are subject to the foreign exchange and foreign trade laws. The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by Isocom Components for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of Isocom Components or others. The information contained herein is subject to change without notice. 16 06/06/2023 DE93308