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IS31FL3741-QFLS4-TR

IS31FL3741-QFLS4-TR

  • 厂商:

    ISSI(芯成半导体)

  • 封装:

    WFQFN60

  • 描述:

    IC LED DVR 39X9 DOT MATRIX 60QFN

  • 数据手册
  • 价格&库存
IS31FL3741-QFLS4-TR 数据手册
IS31FL3741 39×9 DOTS MATRIX LED DRIVER Preliminary Information September 2017 GENERAL DESCRIPTION FEATURES The IS31FL3741 is a general purpose 39×9 LED Matrix programmed via an I2C compatible interface. Each LED can be dimmed individually with 8-bit PWM data and 8-bit scaling data which allowing 256 steps of linear PWM dimming and 256 steps of DC current adjustable level.              Additionally each LED open and short state can be detected, IS31FL3741 store the open or short information in Open-Short Registers. The Open-Short Registers allowing MCU to read out via I2C compatible interface. Inform MCU whether there are LEDs open or short and the locations of open or short LEDs. The IS31FL3741 operates from 2.7V to 5.5V and features a very low shutdown and operational current. IS31FL3741 is available in QFN-60 (7mm×7mm) package. It operates from 2.7V to 5.5V over the temperature range of -40°C to +125°C. Supply voltage range: 2.7V ~ 5.5V 39 Current Sink × 9 SW matrix size: drive up to 351 LEDs or 117 RGBs Individual 256 PWM control steps Individual 256 DC current steps Global 255 current setting SDB rising edge reset I2C module Programmable H/L logic: 1.4/0.4, 2.4/0.6 29kHz PWM frequency 1MHz I2C-compatible interface interrupt and state lookup registers Individual open and short error detect function De-ghost QFN-60 (7mm×7mm) package APPLICATIONS     Mobile phones and other hand-held devices for LED display Gaming device (Keyboard, Mouse etc.) LED in write goods application Music box   TYPICAL APPLICATION CIRCUIT 5V 15 1 F 25 1 F SW9 SW8 PVCC 1k SW2 0.1 F SW1 17 16 10 Micro Controller CS39 CS38 1k 9 7 11 100k 23 SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 AVCC VIO/MCU 100k 24 0.1 F 14 1 F PVCC 0.1 F SDA CS37 IS31FL3741 8 12 36,55 20 INTB SDB CS39 CS38 10k 20 SCL 0.1 F 13 20 6 5 CS3 CS2 CS1 R_EXT ADDR CS2 CS1 GND 20 20 20 27 26 Figure 1 Typical Application Circuit (Single Color: 39×9) Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 1 IS31FL3741 TYPICAL APPLICATION CIRCUIT (CONTINUED) Figure 2 Typical Application Circuit (RGB Color: 13×9) Note: For the mobile applications the IC should be placed far away from the mobile antenna in order to prevent the EMI. Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 2 IS31FL3741 PIN CONFIGURATION Package Pin Configuration (Top View) QFN-60 PIN DESCRIPTION No. Pin Description 26~35,37~54, CS1~CS39 56~60,1~6 Current sink pin for LED matrix. 7 INTB Interrupt output pin. Register F0h sets the function of the INTB pin and active low when the interrupt event happens. Can be NC (float) if interrupt function no used. 8 ADDR I2C address select pin. 9 SDA I2C compatible serial data. 10 SCL I2C compatible serial clock. 11 SDB Shutdown pin. 12,36,55 GND Power GND (36, 55) and analog GND pin (12). 13 R_EXT IOUT setting register. 14 AVCC Power for analog and digital circuits. 15,25 PVCC Power for current source. 16~24 SW1~SW9 Source/switch pin for LED matrix. Thermal Pad Need to connect to GND pins in PCB. Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 3 IS31FL3741 ORDERING INFORMATION Industrial Range: -40°C to +125°C Order Part No. Package QTY/Reel IS31FL3741-QFLS4-TR QFN-60, Lead-free 2500 Copyright © 2017 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any  time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are  advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.  Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the  product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not  authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:  a.) the risk of injury or damage has been minimized;  b.) the user assume all such risks; and  c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances  Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 4 IS31FL3741 ABSOLUTE MAXIMUM RATINGS Supply voltage, VCC Voltage at any input pin Maximum junction temperature, TJMAX Storage temperature range, TSTG Operating temperature range, TA=TJ Thermal resistance, junction to ambient, θJA ESD (HBM) ESD (CDM) -0.3V ~+6.0V -0.3V ~ VCC+0.3V 150°C -65°C ~+150°C -40°C ~ +125°C 33.08°C/W ±2kV ±1kV Note: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other condition beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS The following specifications apply for VCC= 3.6V, TA= 25°C, unless otherwise noted. Symbol Parameter VCC Supply voltage ICC Quiescent power supply current Conditions Min. Typ. Max. Unit 5.5 V 4.5 6 mA VSDB=0V 2 5 5 2.7 VSDB=VCC, all LEDs off ISD Shutdown current VSDB= VCC, Configuration Register written “0000 0000 2 IOUT Maximum constant current of CS1~CS39 REXT=10kΩ, GCC=0xFF, SL=0xFF 38 mA ILED Average current on each LED ILED = IOUT/10.125 REXT=10kΩ, GCC=0xFF, SL=0xFF 3.75 mA VHR Current switch headroom voltage ISWITCH=1A (Note 1, 2) SW1~SW9 400 Current sink headroom voltage CS1~CS39 300 μA mV ISINK=38mA (Note 1) tSCAN Period of scanning 32 µs tNOL1 Non-overlap blanking time during scan, the SWx and CSy are all off during this time 2 µs tNOL2 Delay total time for CS1 to CS39, during this time, the SWx is on but CSx is not all turned on 2 µs Logic Electrical Characteristics (SDA, SCL, ADDR, SDB) VIL Logic “0” input voltage VIH Logic “1” input voltage VHYS Input schmitt trigger hysteresis VCC=2.7V, LGC=0 0.4 VCC=2.7V, LGC=1 0.6 VCC=5.5V, LGC=0 1.4 VCC=5.5V, LGC=1 2.4 V V VCC=3.6V, LGC=0 0.2 VCC=3.6V, LGC=1 0.2 V IIL Logic “0” input current VINPUT= L (Note 4) nA IIH Logic “1” input current VINPUT= H (Note 4) nA Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 5 IS31FL3741 DIGITAL INPUT SWITCHING CHARACTERISTICS (NOTE 3) Fast Mode Symbol Fast Mode Plus Parameter Units Min. fSCL Serial-clock frequency tBUF Typ. Max. Min. Typ. Max. - 400 - 1000 kHz Bus free time between a STOP and a START condition 1.3 - 0.5 - μs tHD, STA Hold time (repeated) START condition 0.6 - 0.26 - μs tSU, STA Repeated START condition setup time 0.6 - 0.26 - μs tSU, STO STOP condition setup time 0.6 - 0.26 - μs tHD, DAT Data hold time - - - - μs tSU, DAT Data setup time 100 - 50 - ns tLOW SCL clock low period 1.3 - 0.5 - μs tHIGH SCL clock high period 0.7 - 0.26 - μs tR Rise time of both SDA and SCL signals, receiving - 300 - 120 ns tF Fall time of both SDA and SCL signals, receiving - 300 - 120 ns Note 1: Global Current Control Register (GCC, PG4, 01h) written “1111 1111”, SL written “1111 1111”, REXT=10kΩ. Note 2: All LEDs PWM=“1111 1111”, GCC = “0xFF”. Note 3: Guaranteed by design. Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 6 IS31FL3741 DETAILED DESCRIPTION   Following acknowledge of IS31FL3741, the register address byte is sent, most significant bit first. IS31FL3741 must generate another acknowledge indicating that the register address has been received. I2C INTERFACE The IS31FL3741 uses a serial bus, which conforms to the I2C protocol, to control the chip’s functions with two wires: SCL and SDA. The IS31FL3741 has a 7-bit slave address (A7:A1), followed by the R/W bit, A0. Set A0 to “0” for a write command and set A0 to “1” for a read command. The value of bits A1 and A2 are decided by the connection of the ADDR pin. Then 8-bit of data byte are sent next, most significant bit first. Each data bit should be valid while the SCL level is stable high. After the data byte is sent, the IS31FL3741 must generate another acknowledge to indicate that the data was received. Table 1 Slave Address Bit A7:A3 A2:A1 A0 Value 01100 ADDR ADDR connects to GND, ADDR= 00; ADDR connects to VCC, ADDR= 11; ADDR connects to SCL, ADDR= 01; ADDR connects to SDA, ADDR= 10; 0/1 The “STOP” signal ends the transfer. To signal “STOP”, the SDA signal goes high while the SCL signal is high. ADDRESS AUTO INCREMENT To write multiple bytes of data into IS31FL3741, load the address of the data register that the first data byte is intended for. During the IS31FL3741 acknowledge of receiving the data byte, the internal address pointer will increment by one. The next data byte sent to IS31FL3741 will be placed in the new address, and so on. The auto increment of the address will continue as long as data continues to be written to IS31FL3741 (Figure 6). The SCL line is uni-directional. The SDA line is bidirectional (open-collector) with a pull-up resistor (typically 400kHz IIC with 4.7kΩ, 1MHz IIC with 1kΩ). The maximum clock frequency specified by the I2C standard is 1MHz. In this discussion, the master is the microcontroller and the slave is the IS31FL3741. The timing diagram for the I2C is shown in Figure 3. The SDA is latched in on the stable high level of the SCL. When there is no interface activity, the SDA line should be held high. READING OPERATION Most of the registers can be read. To read the FCh, FEh, F0h and F1h, after I2C start condition, the bus master must send the IS31FL3741 The “START” signal is generated by lowering the SDA signal while the SCL signal is high. The start signal will alert all devices attached to the I2C bus to check the incoming address against their own chip address. ____ device address with the R/W bit set to “0”, followed by the register address (FEh or F1h) which determines which register is accessed. Then restart I2C, the bus master should send the IS31FL3741 device address The 8-bit chip address is sent next, most significant bit first. Each address bit must be stable while the SCL level is high. ____ with the R/W bit set to “1”. Data from the register defined by the command byte is then sent from the IS31FL3741 to the master (Figure 7). After the last bit of the chip address is sent, the master checks for the IS31FL3741’s acknowledge. The master releases the SDA line high (through a pull-up resistor). Then the master sends an SCL pulse. If the IS31FL3741 has received the address correctly, then it holds the SDA line low during the SCL pulse. If the SDA line is not low, then the master should send a “STOP” signal (discussed later) and abort the transfer. To read the registers of Page 0 thru Page 5, the FDh should write with 00h before follow the Figure 7 sequence to read the data. That means, when you want to read register of Page 0, the FDh should point to Page 0 first and you can read the Page 0 data. SDA tSU,DAT tLOW SCL tHD,DAT S tHIGH tSU,STA tHD,STA R tSU,STO tBUF P tHD,STA tR tF Restart Condition Start Condition Stop Condition Start Condition Figure 3 Interface Timing Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 7 IS31FL3742 Figure 4 Bit Transfer Figure 5 Writing to IS31FL3741 (Typical) Figure 6 Writing to IS31FL3741 (Automatic address increment) Figure 7 Reading from IS31FL3741 Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 8 IS31FL3742 Table 2 Register Definition-1 Address Name Function Table R/W Default 0000 0000 FDh Command Register Available Page 0 to Page 4 registers 3 W FEh Command Register Write Lock To lock/unlock Command Register 4 R/W F0h Interrupt Mask Register Configure the interrupt function 5 W F1h Interrupt Status Register Show the interrupt status 6 R FCh ID Register For read the product ID only - R 0000 0000 Slave Address REGISTER CONTROL Table 3 FDh Command Register (Write Only) Data Function 0000 0000 Point to Page 0 (PG0, PWM Register 1 is available) 0000 0001 Point to Page 1 (PG1, PWM Register 2 is available) 0000 0010 Point to Page 2 (PG2, Scaling Register 1 is available) 0000 0011 Point to Page 3 (PG3, Scaling Register 2 is available) 0000 0100 Point to Page 4 (PG4, Function Register is available) Others Not allowed Note: FDh is locked when power up, need to unlock this register before write command to it. See Table 4 for detail. The Command Register should be configured first after writing in the slave address to choose the available register. Then write data in the choosing register. Power up default state is “0000 0000”. For example, when write “0000 0010” in the Command Register (FDh), the data which writing after will be stored in the page 2 Registers. Write new data can configure other frame position. Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 9 IS31FL3741 Table 4 FEh Command Register Write Lock (Read/Write) Bit D7:D0 Name CRWL Default 0000 0000 Table 6 F1h Interrupt Status Register (Read Only) D7:D2 D1 D0 Name - SB OB Default 0000 00 0 0 Show the interrupt status for IC. To select the PG0~PG4, need to unlock this register first, with the purpose to avoid mis-operation of this register. When FEh is written with “1100 0101”, FDh is allowed to modify once, after the FDh is modified the FEh will reset to be “0000 0000” at once. Command Register Write Lock FDh write disable FDh write enable once CRWL 0000 0000 1100 0101 Bit SB 0 1 Short Bit No short Short happens OB 0 1 Open Bit No open Open happens   Table 5 F0h Interrupt Mask Register (Write Only) Bit D7:D5 D4 D3:D2 D1 D0 Name - IAC - IS IO Default 000 0 00 0 0 FCh ID Register ID register is read only and read result is the device slave address. For example, if ADDR pin connects to GND, read result is 0x60.   Configure the interrupt function for IC. IAC Auto Clear Interrupt Bit 0 Interrupt could not auto clear 1 Interrupt auto clear when INTB stay low exceeds 8ms IS 0 1 Dot Short Interrupt Bit Disable dot short interrupt Enable dot short interrupt IO 0 1 Dot Open Interrupt Bit Disable dot open interrupt Enable dot open interrupt Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 10 IS31FL3741 Table 7 Register Definition-2 Address Name Function Table R/W Default Set PWM for each LED 8 R/W 0000 0000 Set PWM for each LED 8 R/W 0000 0000 Set Scaling for each LED 9 R/W 0000 0000 Set Scaling for each LED 9 R/W 0000 0000 PG0 (0x00): PWM Register 1 00h~B3h PWM Register PG1 (0x01): PWM Register 2 00h~AAh PWM Register PG2 (0x02): LED Scaling 1 00h~B3h Scaling Register PG3 (0x03): LED Scaling 2 00h~AAh Scaling Register PG4 (0x04): Function Register 00h Configuration Register Configure the operation mode 11 R/W 0000 0000 01h Global Current Control Register Set the global current 12 R/W 0000 0000 02h Pull Down/Up Resistor Selection Register Set the pull down resistor for SWx and pull up resistor for CSy 13 R/W 0101 0101 Open/Short Register Store the open or short information 14 R 0000 0000 Reset Register Reset all register to POR state - W 0000 0000 03h~2Fh 3Fh   Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 11 IS31FL3741 Page 0/1 (PG0/PG1, FDh= 0x00/0x01): PWM Register 1/2 PWM PWM PWM PWM PWM PWM PWM PWM PWM Figure 8 PWM Register Table 8 PG0: 00h ~ B3h PWM Register PG1: 00h ~ AAh PWM Register Duty  D7:D0 Name PWM Default 0000 0000 IOUT(PEAK)  Each dot has a byte to modulate the PWM duty in 256 steps. The value of the PWM Registers decides the average current of each LED noted ILED. ILED computed by Formula (1): PWM  I OUT ( PEAK )  Duty 256 PWM  7  D[n ]  2 (2) IOUT is the output current of CSy (y=1~39), Bit I LED  32s 1 1   32s  2s  2s 9 10.125 n (1) 383 GCC SL   REXT 256 256 (3) GCC is the Global Current Control register (PG4, 01h) value, SL is the Scaling Register value as Table 9 and REXT is the external resistor of R_EXT pin. D[n] stands for the individual bit value, 1 or 0, in location n. For example: if D7:D0=1011 0101 (0xB5, 181), GCC=1111 1111, REXT=10kΩ, SL=1111 1111: I LED  383 255 255 1 181      2 .54 mA 10 k  256 256 10 .125 256 n 0 Where Duty is the duty cycle of SWx, Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 12 IS31FL3741 Page 2/3 (PG2/PG3, FDh= 0x02/0x03): Scaling Register 1/2 PWM PWM PWM PWM PWM PWM PWM PWM PWM Figure 9 Scaling Register IOUT is the output current of CSy (y=1~39), GCC is the Global Current Control Register (PG4, 01h) value and REXT is the external resistor of R_EXT pin. D[n] stands for the individual bit value, 1 or 0, in location n. Table 9 PG2: 00h ~ B3h Scaling Register PG3: 00h ~ AAh Scaling Register Bit D7:D0 Name SL Default 0000 0000 For example: if REXT=10kΩ, GCC=1111 1111, SL=0111 1111: Scaling register control the DC output current of each dot. Each dot has a byte to modulate the scaling in 256 steps. The value of the Scaling Register decides the peak current of each LED noted IOUT. IOUT computed by Formula (3): IOUT(PEAK)  383 GCC SL   REXT 256 256 SL  SL  7  D[ n ]  2 n  127 n0 I OUT  383 255 127    18 .93 mA 10 k  256 256 I LED  18 .93 mA  1 PWM  10 .125 256 (3) 7  D[ n ]  2 n n0   Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 13 IS31FL3741 Table 10 Page 4 (PG4, FDh= 0x04): Function Register Register Name Function Table R/W Default 00h Configuration Register Configure the operation mode 11 R/W 0000 0000 01h Global Current Control Register Set the global current 12 R/W 0000 0000 02h Pull Down/Up Resistor Selection Register Set the pull down resistor for SWx and pull up resistor for CSy 13 R/W 0101 0101 Open/Short Register Store the open or short information 14 R 0000 0000 Reset Register Reset all register to POR state - W 0000 0000 03h~2Fh 3Fh Table 11 00h Configuration Register Bit D7:D4 D3 D2:D1 D0 Name SWS LGC OSDE SSD Default 0000 0 00 0 SWS control the duty cycle of the SW, default mode is 1/9. Table 12 01h Global Current Control Register The Configuration Register sets operating mode of IS31FL3741. SSD 0 1 Software Shutdown Control Software shutdown Normal operation OSDE 00 01/11 10 Open Short Detection Enable Disable open/short detection Enable open detection Enable short detection LGC 0 1 H/L Logic 1.4V/0.4V 2.4V/0.6V SWS 0000 0001 0010 0011 0100 0101 0110 0111 1000 Others SWx Setting SW1~SW9, 1/9 SW1~SW8, 1/8, SW9 no-active SW1~SW7, 1/7, SW8~SW9 no-active SW1~SW6, 1/6, SW7~SW9 no-active SW1~SW5, 1/5, SW6~SW9 no-active SW1~SW4, 1/4, SW5~SW9 no-active SW1~SW3, 1/3, SW4~SW9 no-active SW1~SW2, 1/2, SW3~SW9 no-active All CSx work as current sinks only, no scan 1/9 When OSDE set to “01”, open detection will be trigger once, the user could trigger open detection again by set OSDE from “00” to “01”. When OSDE set “10”, short detection will be trigger once, the user could trigger short detection again by set OSDE from “00” to “10”. When SSD is “0”, IS31FL3741 works in software shutdown mode and to normal operate the SSD bit should set to “1”. Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 Bit D7:D0 Name GCC Default 0000 0000 The Global Current Control Register modulates all CSy (x=1~39) DC current which is noted as IOUT in 256 steps. IOUT is computed by the Formula (3): IOUT(PEAK)  383 GCC SL   REXT 256 256 GCC  (3) 7  D[ n ]  2 n n0 Where D[n] stands for the individual bit value, 1 or 0, in location n. Table 13 02h Pull Down/Up Resistor Selection Register Bit D7 D6:D4 D3 D2:D0 Name - PDR - PUR Default 0 101 0 101 Set pull down resistor for SWx and pull up resistor for CSy. PUR 000 001 010 011 100 101 110 111 SWx Pull Up Resistor Selection Bit No pull down resistor 0.5kΩ 1.0kΩ 2.0kΩ 4.0kΩ 8.0kΩ 16kΩ 32kΩ   14 IS31FL3741 PDR 000 001 010 011 100 101 110 111 CSy Pull Down Resistor Selection Bit No pull up resistor 0.5kΩ 1.0kΩ 2.0kΩ 4.0kΩ 8.0kΩ 16kΩ 32kΩ When OSDE (PG4, 00h) is set to “01”, open detection will be trigger once, and the open information will be stored at 03h~2Fh. When OSDE (PG4, 00h) set to “10”, short detection will be trigger once, and the short information will be stored at 03h~2Fh. Before set OSDE, the GCC should set to 0x01. Table 14-1 Open/Short Register (Read Only) 03h~06h Open/Short Information 08h~0Bh Open/Short Information 0Dh~10h Open/Short Information 12h~15h Open/Short Information 17h~1Ah Open/Short Information 1Ch~1Fh Open/Short Information 21h~24h Open/Short Information 26h~29h Open/Short Information 2Bh~2Eh Open/Short Information Bit Name Default D7:D0 CS8:CS1;CS16:CS9;CS24:CS17;CS32:C S25 (MSB:LSB) 0000 0000 07h Open/Short Information 0Ch Open/Short Information 11h Open/Short Information 16h Open/Short Information 1Bh Open/Short Information 20h Open/Short Information 25h Open/Short Information 2Ah Open/Short Information 2Fh Open/Short Information Figure 10 Open/Short Register Table 14-2 Open/Short Register (Read Only)   Bit D7 D6:D0 Name - CS39:CS33 Default 0 0000 000 3Fh Reset Register Once user writes the Reset Register with 0xAE, IS31FL3741 will reset all the IS31FL3741 registers to their default value. On initial power-up, the IS31FL3741 registers are reset to their default values for a blank display.   Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 15 IS31FL3741 APPLICATION INFORMATION I OUT ( PEAK )  38 3 GCC SL   R EXT 256 256 Figure 11 Scanning Timing I LED  38 mA  SCANING TIMING As shown in Figure 11, the SW1~SW9 is turned on by serial, LED is driven 9 by 9 within the SWx (x=1~9) on time (SWx, x=1~9) is sink and pull low when LED on) , including the non-overlap blanking time during scan, the duty cycle of SWx (active low, x=1~9) is: Duty  32s 1 1   32s  2s  2s 9 10.125 (2) Where 32μs is tSCAN, the period of scanning and 2μs is tNOL1 and tNOL2, the non-overlap time and CSx delay time. PWM CONTROL After setting the IOUT and GCC, the brightness of each LEDs (LED average current (ILED)) can be modulated with 256 steps by PWM Register, as described in Formula (1). I LED  PWM  I OUT ( PEAK )  Duty (1) 256 1 PWM  10.125 256 Writing new data continuously to the registers can modulate the brightness of the LEDs to achieve a breathing effect. GAMMA CORRECTION In order to perform a better visual LED breathing effect we recommend using a gamma corrected PWM value to set the LED intensity. This results in a reduced number of steps for the LED intensity setting, but causes the change in intensity to appear more linear to the human eye. Gamma correction, also known as gamma compression or encoding, is used to encode linear luminance to match the non-linear characteristics of display. Since the IS31FL3741 can modulate the brightness of the LEDs with 256 steps, a gamma correction function can be applied when computing each subsequent LED intensity setting such that the changes in brightness matches the human eye's brightness curve. Where PWM is PWM Registers (PG0, 00h~B3h /PG1, 00h~AAh) data showing in Table 8. For example, in Figure 1, if REXT= 10kΩ, PWM= 255, and GCC= 255, Scaling= 255, then I OUT ( PEAK )  383 255 255    38 mA 10 k 256 256 Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 16 IS31FL3741 256 Table 21 32 Gamma Steps with 256 PWM Steps C(1) C(2) C(3) C(4) C(5) C(6) C(7) 0 1 2 4 6 10 13 18 C(8) C(9) C(10) C(11) C(12) C(13) C(14) C(15) 22 28 33 39 46 53 61 69 C(16) C(17) C(18) C(19) C(20) C(21) C(22) C(23) 78 86 96 106 116 126 138 149 C(24) C(25) C(26) C(27) C(28) C(29) C(30) C(31) 161 173 186 199 212 226 240 255 256 224 192 PWM Data C(0) 160 128 96 64 32 224 0 0 8 16 PWM Data 192 32 40 48 56 64 Intensity Steps 160 Figure 13 Gamma Correction (64 Steps) Note: The data of 32 gamma steps is the standard value and the data of 64 gamma steps is the recommended value. 128 96 OPERATING MODE 64 PWM Mode 32 IS31FL3741can only operate in PWM Mode. The brightness of each LED can be modulated with 256 steps by PWM registers. For example, if the data in PWM Register is “0000 0100”, then the PWM is the fourth step. 0 0 4 8 12 16 20 24 28 32 Intensity Steps Figure 12 Gamma Correction (32 Steps) Choosing more gamma steps provides for a more continuous looking breathing effect. This is useful for very long breathing cycles. The recommended configuration is defined by the breath cycle T. When T=1s, choose 32 gamma steps, when T=2s, choose 64 gamma steps. The user must decide the final number of gamma steps not only by the LED itself, but also based on the visual performance of the finished product. Table 22 64 Gamma Steps with 256 PWM Steps C(0) 24 C(1) C(2) C(3) C(4) C(5) C(6) C(7) 0 1 2 3 4 5 6 7 C(8) C(9) C(10) C(11) C(12) C(13) C(14) C(15) 8 10 12 14 16 18 20 22 C(16) C(17) C(18) C(19) C(20) C(21) C(22) C(23) 24 26 29 32 35 38 41 44 C(24) C(25) C(26) C(27) C(28) C(29) C(30) C(31) 47 50 53 57 61 65 69 73 C(32) C(33) C(34) C(35) C(36) C(37) C(38) C(39) 77 81 85 89 94 99 104 109 C(40) C(41) C(42) C(43) C(44) C(45) C(46) C(47) 114 119 124 129 134 140 146 152 C(48) C(49) C(50) C(51) C(52) C(53) C(54) C(55) 158 164 170 176 182 188 195 202 C(56) C(57) C(58) C(59) C(60) C(61) C(62) C(63) 209 216 223 230 237 244 251 255 Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 Writing new data continuously to the registers can modulate the brightness of the LEDs to achieve a breathing effect. De-Ghost Function The “ghost” term is used to describe the behavior of an LED that should be OFF but instead glows dimly when another LED is turned ON. A ghosting effect typically can occur when multiplexing LEDs. In matrix architecture any parasitic capacitance found in the constant-current outputs or the PCB traces to the LEDs may provide sufficient current to dimly light an LED to create a ghosting effect. To prevent this LED ghost effect, the IS31FL3741 has integrated Pull down resistors for each SWx (x=1~9) and Pull up resistors for each CSy (y=1~39). Select the right SWx Pull down resistor (PG4, 02h) and CSy Pull up resistor (PG4, 02h) which eliminates the ghost LED for a particular matrix layout configuration. Typically, selecting the 32kΩ will be sufficient to eliminate the LED ghost phenomenon. The SWx Pull down resistors and CSy Pull up resistors are active only when the CSy/SWx output working the OFF state and therefore no power is lost through these resistors. SHUTDOWN MODE Shutdown mode can be used as a means of reducing power consumption. During shutdown mode all registers retain their data. 17 IS31FL3741 Software Shutdown By setting SSD bit of the Configuration Register (PG4, 00h) to “0”, the IS31FL3741 will operate in software shutdown mode. When the IS31FL3741 is in software shutdown, all current sources are switched off, so that the matrix is blanked. All registers can be operated. Typical current consume is 3μA. Hardware Shutdown The chip enters hardware shutdown when the SDB pin is pulled low. All analog circuits are disabled during hardware shutdown, typical the current consume is 2μA. The chip releases hardware shutdown when the SDB pin is pulled high. During hardware shutdown state Function Register can be operated. If VCC has risk drop below 1.75V but above 0.1V during SDB pulled low, please re-initialize all Function Registers before SDB pulled high. Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 LAYOUT As described in external resistor (REXT), the chip consumes lots of power. Please consider below factors when layout the PCB. 1. The VCC (PVCC, AVCC) capacitors need to close to the chip and the ground side should well connected to the GND of the chip. 2. REXT should be close to the chip and the ground side should well connect to the GND of the chip. 3. The thermal pad should connect to ground pins and the PCB should have the thermal pad too, usually this pad should have 16 or 25 via thru the PCB to other side’s ground area to help radiate the heat. About the thermal pad size, please refer to the land pattern of each package. 4. The CSy pins maximum current is 38mA (REXT=10kΩ), and the SWx pins maximum current is larger, the width of the trace, SWx should have wider trace then CSy. 18 IS31FL3741 CLASSIFICATION REFLOW PROFILES Profile Feature Pb-Free Assembly Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) 150°C 200°C 60-120 seconds Average ramp-up rate (Tsmax to Tp) 3°C/second max. Liquidous temperature (TL) Time at liquidous (tL) 217°C 60-150 seconds Peak package body temperature (Tp)* Max 260°C Time (tp)** within 5°C of the specified classification temperature (Tc) Max 30 seconds Average ramp-down rate (Tp to Tsmax) 6°C/second max. Time 25°C to peak temperature 8 minutes max.     Figure 14 Classification Profile   Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 19 IS31FL3741 PACKAGE INFORMATION QFN-60         Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 20 IS31FL3741 RECOMMENDED LAND PATTERN QFN-60 Note: 1. Land pattern complies to IPC-7351. 2. All dimensions in MM. 3. This document (including dimensions, notes & specs) is a recommendation based on typical circuit board manufacturing parameters. Since land pattern design depends on many factors unknown (eg. user’s board manufacturing specs), user must determine suitability for use.   Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 21 IS31FL3741 REVISION HISTORY Revision 0A 0B Detail Information Initial release 1. Update the ILED formula 2. Update Land Pattern and θJA 3. Update Logic Electrical Characteristics Table 4. Update Figure 1 and Figure 2 Integrated Silicon Solution, Inc. – www.issi.com Rev. 0B, 09/06/2017 Date 2017.06.02 2017.09.06 22
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