IS31FL3742-QFLS4-TR

IS31FL3742 30×6 DOTS MATRIX LED DRIVER December 2017 GENERAL DESCRIPTION FEATURES The IS31FL3742 is a general purpose 30×6 LED Matrix programmed via an I2C compatible interface. Each LED can be dimmed individually with 8-bit PWM data and 8-bit scaling data which allowing 256 steps of linear PWM dimming and 256 steps of DC current adjustable level.   Additionally each LED open and short state can be detected, IS31FL3742 store the open or short information in Open-Short Registers. The Open-Short Registers allowing MCU to read out via I2C compatible interface. Inform MCU whether there are LEDs open or short and the locations of open or short LEDs. The IS31FL3742 operates from 2.7V to 5.5V and features a very low shutdown and operational current. IS31FL3742 is available in QFN-48 (6mm×6mm) package. It operates from 2.7V to 5.5V over the temperature range of -40°C to +125°C. Supply voltage range: 2.7V to 5.5V 30 Current Sink × 6 SW matrix size: drive up to 180 LEDs or 60 RGBs Individual 256 PWM control steps Individual 256 DC current steps Global 256 current setting SDB rising edge reset I2C module Programmable H/L logic: 1.4V/0.4V, 2.4V/0.6V 29kHz PWM frequency 1MHz I2C-compatible interface interrupt and state lookup registers Individual open and short error detect function De-ghost QFN-48 (6mm×6mm) package            APPLICATIONS  Mobile phones and other hand-held devices for LED display Gaming device (Keyboard, mouse etc.) LED in write goods application Music box    TYPICAL APPLICATION CIRCUIT 5V 12 1 F 19 1 F SW6 SW5 PVCC 1k SW2 0.1 F SW1 14 13 7 Micro Controller CS30 CS29 1k 6 4 8 100k 17 SW1 SW2 SW3 SW4 SW5 SW6 AVCC VIO/MCU 100k 18 0.1 F 11 1 F PVCC 0.1 F SDA CS28 IS31FL3742 5 1 9,30 20 INTB SDB CS30 CS29 10k 20 SCL 0.1 F 10 20 3 2 CS3 CS2 CS1 R_EXT ADDR GND CS2 CS1 20 20 20 21 20 Figure 1 Typical Application Circuit (Single Color: 30x6) Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 1 IS31FL3742 TYPICAL APPLICATION CIRCUIT (CONTINUED) 5V 12 1 F SW5 PVCC 1k SW2 0.1 F SW1 14 13 7 Micro Controller CS30 CS29 1k 6 4 8 100k 17 SW1 SW2 SW3 SW4 SW5 SW6 AVCC VIO/MCU 100k 18 0.1 F 11 1 F SW6 0.1 F 19 1 F PVCC SDA CS28 IS31FL3742 5 1 9,30 20R INTB SDB CS30 CS29 10k 20R SCL 0.1 F 10 51R 3 2 CS3 CS2 CS1 R_EXT ADDR GND CS2 CS1 51R 20R 20R 21 20 Figure 2 Typical Application Circuit (RGB Color: 10x6) Note: For the mobile applications the IC should be placed far away from the mobile antenna in order to prevent the EMI. Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 2 IS31FL3742 PIN CONFIGURATION Package Pin Configuration (Top View) QFN-48 PIN DESCRIPTION No. Pin Description 1, 9, 30 GND Power GND (1, 30) and analog GND (9). 20~29, 31~48, 2, 3 CS1~CS30 Current sink pin for LED matrix. 4 INTB Interrupt output pin. Register F0h sets the function of the INTB pin and active low when the interrupt event happens. Can be NC (float) if interrupt function no used. 5 ADDR I2C address select pin. 6 SDA I2C compatible serial data. 7 SCL I2C compatible serial clock. 8 SDB Shutdown pin. 10 R_EXT IOUT setting register. 11 AVCC Power for analog and digital circuits. 12,19 PVCC Power for current source. 13~18 SW1~SW6 Source/switch pin for LED matrix. Thermal Pad Need to connect to GND pins in PCB. Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 3 IS31FL3742 ORDERING INFORMATION Industrial Range: -40°C to +125°C Order Part No. Package QTY/Reel IS31FL3742-QFLS4-TR QFN-48, Lead-free 2500 Copyright © 2017 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any  time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are  advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.  Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the  product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not  authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:  a.) the risk of injury or damage has been minimized;  b.) the user assume all such risks; and  c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances  Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 4 IS31FL3742 ABSOLUTE MAXIMUM RATINGS Supply voltage, VCC Voltage at any input pin Maximum junction temperature, TJMAX Storage temperature range, TSTG Operating temperature range, TA=TJ Package thermal resistance, junction to ambient (4 layer standard test PCB based on JEDEC standard), θJA ESD (HBM) for SWx pins ESD (HBM) for other pins ESD (CDM) -0.3V ~+6.0V -0.3V ~ VCC+0.3V +150°C -65°C ~+150°C -40°C ~ +125°C 37.84°C/W ±2kV ±5kV ±1kV Note: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other condition beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS The following specifications apply for VCC = 3.6V, TA = 25°C, unless otherwise noted. Symbol VCC Supply voltage ICC Quiescent power supply current ISD IOUT(PEAK) ∆IMATCH ILED VHR     Parameter Conditions Min. Typ. 2.7 Shutdown current Maximum constant current of CS1~CS30 VSDB=VCC, all LEDs off 3.8 VSDB=0V 1.2 VSDB= VCC, Configuration Register written “0000 0000” 1.2 Max. Unit 5.5 V mA μA REXT=10kΩ, GCC=0xFF, SL=0xFF 35.34 38 40.66 mA REXT=16.5kΩ, GCC=0xFF, SL=0xFF 21.39 23 24.61 mA 6 % Output peak current mismatch between channels REXT=10kΩ, GCC=0xFF, SL=0xFF (Note 1) Average current on each LED ILED = IOUT(PEAK)/6.75 REXT=10kΩ, GCC=0xFF, SL=0xFF 5.63 Current switch headroom voltage SW1~SW6 ISWITCH=800mA (Note 2,3) 400 Current sink headroom voltage CS1~CS30 ISINK=38mA (Note 2) 300 -6 mA mV tSCAN Period of SWx scanning 32 µs tNOL1 Non-overlap blanking time 1 during scan, the SWx are all off during this time 2 µs tNOL2 Delay total time for CS1 to CS 30, during this time, the SWx is on but CSx is not all turned on 2 µs   Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 5 IS31FL3742 ELECTRICAL CHARACTERISTICS (CONTINUE) The following specifications apply for VCC = 3.6V, TA = 25°C, unless otherwise noted.  Symbol Parameter Conditions Min. Typ. Max. Unit Logic Electrical Characteristics (SDA, SCL, ADDR, SDB) VIL Logic “0” input voltage VIH Logic “1” input voltage VHYS Input schmitt trigger hysteresis VCC=2.7V, LGC=0 0.4 VCC=2.7V, LGC=1 0.6 VCC=5.5V, LGC=0 1.4 VCC=5.5V, LGC=1 2.4 V V VCC=3.6V, LGC=0 0.2 VCC=3.6V, LGC=1 0.2 V IIL Logic “0” input current VINPUT= L (Note 4) 5 nA IIH Logic “1” input current VINPUT= H (Note 4) 5 nA   DIGITAL INPUT SWITCHING CHARACTERISTICS (NOTE 4) Symbol Parameter fSCL Serial-clock frequency tBUF Fast Mode Min. Typ. Fast Mode Plus Max. Min. Typ. Max. Units - 400 - 1000 kHz Bus free time between a STOP and a START condition 1.3 - 0.5 - μs tHD, STA Hold time (repeated) START condition 0.6 - 0.26 - μs tSU, STA Repeated START condition setup time 0.6 - 0.26 - μs tSU, STO STOP condition setup time 0.6 - 0.26 - μs tHD, DAT Data hold time - - - - μs tSU, DAT Data setup time 100 - 50 - ns tLOW SCL clock low period 1.3 - 0.5 - μs tHIGH SCL clock high period 0.7 - 0.26 - μs tR Rise time of both SDA and SCL signals, receiving - 300 - 120 ns tF Fall time of both SDA and SCL signals, receiving - 300 - 120 ns Note 1: ∆IMATCH= (IOUT(PEAK)- IAVG(PEAK))/IAVG(PEAK)×100%. IAVG(PEAK)= (IOUT(PEAK)1+IOUT(PEAK)2+…IOUT(PEAK)30)/30 Note 2: Global Current Control Register (GCC, PG4, 01h) written “1111 1111”, SL written “1111 1111”, REXT=10kΩ. Note 3: All LEDs are on and PWM=“1111 1111”, GCC = “0xFF”. Note 4: Guaranteed by design.   Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 6 IS31FL3742 DETAILED DESCRIPTION  I2C INTERFACE Following acknowledge of IS31FL3742, the register address byte is sent, most significant bit first. IS31FL3742 must generate another acknowledge indicating that the register address has been received. The IS31FL3742 uses a serial bus, which conforms to the I2C protocol, to control the chip’s functions with two wires: SCL and SDA. The IS31FL3742 has a 7-bit slave address (A7:A1), followed by the R/W bit, A0. Set A0 to “0” for a write command and set A0 to “1” for a read command. The value of bits A1 and A2 are decided by the connection of the ADDR pin. Then 8-bit of data byte are sent next, most significant bit first. Each data bit should be valid while the SCL level is stable high. After the data byte is sent, the IS31FL3742 must generate another acknowledge to indicate that the data was received. Table 1 Slave Address: Bit A7:A3 A2:A1 A0 Value 01100 ADDR ADDR connects to GND, ADDR= 00; ADDR connects to VCC, ADDR= 11; ADDR connects to SCL, ADDR= 01; ADDR connects to SDA, ADDR= 10; 0/1 The “STOP” signal ends the transfer. To signal “STOP”, the SDA signal goes high while the SCL signal is high. ADDRESS AUTO INCREMENT To write multiple bytes of data into IS31FL3742, load the address of the data register that the first data byte is intended for. During the IS31FL3742 acknowledge of receiving the data byte, the internal address pointer will increment by one. The next data byte sent to IS31FL3742 will be placed in the new address, and so on. The auto increment of the address will continue as long as data continues to be written to IS31FL3742 (Figure 7). The SCL line is uni-directional. The SDA line is bidirectional (open-collector) with a pull -up resistor (typically 400kHz IIC with 4.7kΩ, 1MHz IIC with 1kΩ). The maximum clock frequency specified by the I2C standard is 1MHz. In this discussion, the master is the microcontroller and the slave is the IS31FL3742. The timing diagram for the I2C is shown in Figure 4. The SDA is latched in on the stable high level of the SCL. When there is no interface activity, the SDA line should be held high. READING OPERATION Most of the registers can be read. To read the FCh, FEh F0h and F1h, after I2C start condition, the bus master must send the IS31FL3742 The “START” signal is generated by lowering the SDA signal while the SCL signal is high. The start signal will alert all devices attached to the I2C bus to check the incoming address against their own chip address. ____ device address with the R/W bit set to “0”, followed by the register address (FEh or F1h) which determines which register is accessed. Then restart I2C, the bus master should send the IS31FL3742 device address The 8-bit chip address is sent next, most significant bit first. Each address bit must be stable while the SCL level is high. ____ with the R/W bit set to “1”. Data from the register defined by the command byte is then sent from the IS31FL3742 to the master (Figure 8). After the last bit of the chip address is sent, the master checks for the IS31FL3742’s acknowledge. The master releases the SDA line high (through a pull-up resistor). Then the master sends an SCL pulse. If the IS31FL3742 has received the address correctly, then it holds the SDA line low during the SCL pulse. If the SDA line is not low, then the master should send a “STOP” signal (discussed later) and abort the transfer. To read the registers of Page 0 thru Page 5, the FDh should write with 00h before follow the Figure 8 sequence to read the data. That means, when you want to read register of Page 0, the FDh should point to Page 0 first and you can read the Page 0 data. SDA tSU,DAT tLOW SCL tHD,DAT S tHIGH tSU,STA tHD,STA R tSU,STO tBUF P tHD,STA tR tF Restart Condition Start Condition Stop Condition Start Condition Figure 4 Interface Timing Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 7 IS31FL3742 Figure 5 Bit Transfer Figure 6 Writing to IS31FL3742 (Typical) Figure 7 Writing to IS31FL3742 (Automatic Address Increment) Figure 8 Reading from IS31FL3742 Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 8 IS31FL3742 Table 2 Register Definition-1 Address Name Function Table R/W Default 0000 0000 FDh Command Register Available Page 0, Page 2 and Page 4 Registers 3 W FEh Command Register Write Lock To lock/unlock Command Register 4 R/W F0h Interrupt Mask Register Configure the interrupt function 5 W F1h Interrupt Status Register Show the interrupt status 6 R FCh ID Register For read the product ID only - R 0000 0000 Slave address REGISTER CONTROL Table 3 FDh Command Register (Write Only) Data Function 0000 0000 Point to Page 0 (PG0, PWM Register is available) 0000 0010 Point to Page 2 (PG2, Scaling (SL) Register is available) 0000 0100 Point to Page 4 (PG4, Function Register is available) Others Not allowed Note: FDh is locked when power up, need to unlock this register before write command to it. See Table 4 for detail. The Command Register should be configured first after writing in the slave address to choose the available register. Then write data in the choosing register. Power up default state is “0000 0000”. For example, when write “0000 0010” in the Command Register (FDh), the data which writing after will be stored in the page 2 Registers. Write new data can configure other frame position. Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 9 IS31FL3742 Table 4 FEh Command Register Write Lock (Read/Write) Bit D7:D0 Name CRWL Default 0000 0000 Table 6 F1h Interrupt Status Register (Read Only) D7:D2 D1 D0 Name - SB OB Default 0000 00 0 0 Show the interrupt status for IC. To select the PG0, PG2 and PG4, need to unlock this register first, with the purpose to avoid misoperation of this register. When FEh is written with 0xC5, FDh is allowed to modify once, after the FDh is modified the FEh will reset to be 0x00 at once. Command Register Write Lock FDh write disable FDh write enable once CRWL 0000 0000 1100 0101 Bit Table 5 F0h Interrupt Mask Register Bit D7:D5 D4 D3:D2 D1 D0 Name - IAC - IS IO Default 000 0 00 0 0 SB 0 1 Short Bit No short Short happens OB 0 1 Open Bit No open Open happens FCh ID Register ID register is read only and read result is the device slave address. For example, if ADDR pin connects to GND, read result is 0x60. Configure the interrupt function for IC. IAC Auto Clear Interrupt Bit 0 Interrupt could not auto clear 1 Interrupt auto clear when INTB stay low exceeds 8ms IS 0 1 Dot Short Interrupt Bit Disable dot short interrupt Enable dot short interrupt IO 0 1 Dot Open Interrupt Bit Disable dot open interrupt Enable dot open interrupt Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 10 IS31FL3742 Table 7 Register Definition-2 Address Name Function Table R/W Default 8 R/W 0000 0000 Set Scaling for each LED 9 R/W 0000 0000 PG0 (0x00): PWM Register 00h~B3h PWM Register Set PWM for each LED PG2 (0x02): LED Scaling (IOUT(PEAK) DC current adjust) 00h~B3h Scaling Register PG4 (0x04): Function Register 00h Configuration Register Configure the operation mode 11 R/W 0000 0000 01h Global Current Control Register Set the global current 12 R/W 0000 0000 02h Pull Down/Up Resistor Selection Register Set the pull down resistor for SWx and the pull up resistor for CSy 13 R/W 0101 0101 Open/Short storage Store the open or short information 14 R 0000 0000 Reset Register Reset all register to POR state - W 0000 0000 03h~1Fh 3Fh Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 11 IS31FL3742 Page 0 (PG0, FDh=0x00): PWM Register Figure 9 PWM Register Table 8 00h ~ B3h PWM Register Duty  Bit D7:D0 Name PWM Default 0000 0000 IOUT is the output current of CSy (y=1~30), Each dot has a byte to modulate the PWM duty in 256 steps. The value of the PWM Registers decides the average current of each LED noted ILED. ILED computed by Formula (1): I LED  PWM  I OUT ( PEAK )  Duty (1) 256 PWM  7  D[n ]  2 32s 1 1   (2) 32s  2s  2s 6 6.75 n n 0 IOUT( PEAK)  383 GCC SL   REXT 256 256 (3) GCC is the Global Current Control Register (PG4, 01h) value, SL is the Scaling Register value and REXT is the external resistor of R_EXT pin. D[n] stands for the individual bit value, 1 or 0, in location n. For example: if D7:D0=1011 0101 (0xB5, 181), GCC=0xFF, REXT=10kΩ, SL=0xFF I LED  383 255 255 1 181      3.98 mA 10 k 256 256 6.75 256 Where Duty is the duty cycle of SWx, Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 12 IS31FL3742 Page 2 (PG2, FDh= 0x02): Scaling Register Figure 10 Scaling Register Table 9 00h ~ B3h Scaling Register Bit D7:D0 Name SL Default 0000 0000 n n0 Scaling register control the DC output current of each dot. Each dot has a byte to modulate the scaling in 256 steps. The value of the Scaling Registers decides the peak current of each LED noted IOUT. IOUT computed by Formula (3): 383 GCC SL   IOUT(PEAK)  REXT 256 256 7  D[ n ]  2 SL  IOUT is the output current of CSy (y=1~30), GCC is the Global Current Control Register (PG4, 01h) value and REXT is the external resistor of R_EXT pin. D[n] stands for the individual bit value, 1 or 0, in location n. For example: if REXT=10kΩ, GCC=0xFF, SL=0x7F, SL  n  127 n0 383 255 127    18 .78 mA 10 k 256 256 1 PWM PWM  18 .78 mA    2.95 mA  6.75 256 256 I OUT ( PEAK )  (3) Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 7  D[ n ]  2 I LED 13 IS31FL3742 Table 10 Page 4 (PG4, 0x04): Function Register Register Name Function 00h Configuration Register 01h 02h 03h~1Fh 3Fh Table Configure the operation mode R/W Default 11 R/W 0000 0000 Global Current Control Register Set the global current 12 R/W 0000 0000 Pull Down/Up Resistor Selection Register Set the pull down resistor for SWx and the pull up resistor for CSy 13 R/W 0101 0101 Open/Short storage Store the open or short information 14 R 0000 0000 Reset Register Reset all register to POR state - W 0000 0000 Table 11 00h Configuration Register Bit D7:D4 D3 D2:D1 D0 Name SWS LGC OSDE SSD Default 0000 0 00 0 SWS control the duty cycle of the SW, for 1/6 duty cycle, the SWS must set to “0011”. Table 12 01h Global Current Control Register The Configuration Register sets operating mode of IS31FL3742. SSD 0 1 Software Shutdown Control Software shutdown Normal operation OSDE 00/11 01 10 Open Short Detection Enable Disable open/short detection Enable open detection Enable short detection LGC 0 1 H/L logic 1.4V/0.4V 2.4V/0.6V SWS 0000 0001 0010 0011 0100 0101 0110 0111 1000 Others SWx Setting SW1~SW6, 1/9 SW1~SW6, 1/8 SW1~SW6, 1/7 SW1~SW6, 1/6 SW1~SW5, 1/5, SW6 no-active SW1~SW4, 1/4, SW5~SW6 no-active SW1~SW3, 1/3, SW4~SW6 no-active SW1~SW2, 1/2, SW3~SW6 no-active All CSx work as current sinks only, no scan 1/9 When OSDE set to “01”, open detection will be trigger once, the user could trigger open detection again by set OSDE from “00” to “01”. When OSDE set “10”, short detection will be trigger once, the user could trigger short detection again by set OSDE from “00” to “10”. When SSD is “0”, IS31FL3742 works in software shutdown mode and to normal operate the SSD bit should set to “1”. Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 Bit D7:D0 Name GCCx Default 0000 0000 The Global Current Control Register modulates all CSy (x=1~30) DC current which is noted as IOUT in 256 steps. IOUT is computed by the Formula (3): IOUT(PEAK)  383 GCC SL   REXT 256 256 GCC  (3) 7  D[ n ]  2 n n0 Where D[n] stands for the individual bit value, 1 or 0, in location n. Table 13 02h Pull Down/Up Resistor Selection Register Bit D7 D6:D4 D3 D2:D0 Name - PDR - PUR Default 0 101 0 101 Set pull down resistor for SWx and pull up resistor for CSy. PUR 000 001 010 011 100 101 110 111 CSy Pull Up Resistor Selection Bit No pull up resistor 0.5kΩ 1.0kΩ 2.0kΩ 4.0kΩ 8.0kΩ 16kΩ 32kΩ   14 IS31FL3742 PDR 000 001 010 011 100 101 110 111 SWx Pull Down Resistor Selection Bit No pull down resistor 0.5kΩ 1.0kΩ 2.0kΩ 4.0kΩ 8.0kΩ 16kΩ 32kΩ Table 14-1 Open/Short Register 03h~05h Open/Short Information 08h~0Ah Open/Short Information 0Dh~0Fh Open/Short Information 12h~14h Open/Short Information 17h~19h Open/Short Information 1Ch~1Eh Open/Short Information Bit Name Default D7:D0 CS8:CS1; CS16:CS09;CS24:CS17(MSB:LSB) 0000 0000 06h Open/Short Information 0Bh Open/Short Information 10h Open/Short Information 15h Open/Short Information 1Ah Open/Short Information 1Fh Open/Short Information Figure 11 Open/Short Register 3Fh Reset Register Once user writes the Reset Register with 0xAE, IS31FL3742 will reset all the IS31FL3742 registers to their default value. On initial power-up, the IS31FL3742 registers are reset to their default values for a blank display. Table 14-2 Open/Short Register Bit D7:D6 D5:D0 Name - CS30:CS25 Default 00 00 0000 When OSDE (PG4, 00h) set to”01”, open detection will be trigger once, and the open information will be store at 03h~1Fh When OSDE (PG4, 00h) set to “10”, short detection will be trigger once, and the short information will be store at 03h~1Fh Before set OSDE, the GCC should set to 0x01. Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 15 IS31FL3742 APPLICATION INFORMATION SW01 SW02 SW03 SW04 SW05 SW06 CS30 CS1 tSCAN=32µs tNOL1=2µs tNOL2=2µs Scanning cycle T=216us((32+2+2)×6) De-Ghost time 383 GCC SL I    PWM Duty is variable from 0/256~255/256 OUT ( PEAK ) R 256 256 EXT Figure 12 Scanning Timing SCANING TIMING As shown in Figure 12, the SW1~SW6 is turned on by serial, LED is driven 6 by 6 within the SWx (x=1~6) on time (SWx, x=1~6) is sink and pull low when LED on) , including the non-overlap blanking time during scan, the duty cycle of SWx (active low, x=1~6) is: 32s 1 1 Duty    32s  2s  2s 6 6.75 (2) Where 32μs is tSCAN, the period of scanning and 2μs is tNOL1 and tNOL2, the non-overlap time and CSx delay time. PWM CONTROL After setting the IOUT and GCC, the brightness of each LEDs (LED average current (ILED)) can be modulated with 256 steps by PWM Register, as described in Formula (1). I LED  PWM  I OUT ( PEAK )  Duty (1) 256 I LED  38 mA  1 PWM  6.75 256 Writing new data continuously to the registers can modulate the brightness of the LEDs to achieve a breathing effect. GAMMA CORRECTION In order to perform a better visual LED breathing effect we recommend using a gamma corrected PWM value to set the LED intensity. This results in a reduced number of steps for the LED intensity setting, but causes the change in intensity to appear more linear to the human eye. Gamma correction, also known as gamma compression or encoding, is used to encode linear luminance to match the non-linear characteristics of display. Since the IS31FL3742 can modulate the brightness of the LEDs with 256 steps, a gamma correction function can be applied when computing each subsequent LED intensity setting such that the changes in brightness matches the human eye's brightness curve. Where PWM is PWM Registers (PG0, 00h~B3h) data showing in Table 8. For example, in Figure 1, if REXT= 10kΩ, PWM= 255, and GCC= 0xFF, Scaling= 0xFF, then I OUT ( PEAK )  383 255 255    38 mA 10 k 256 256 Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 16 IS31FL3742 256 Table 21 32 Gamma Steps with 256 PWM Steps C(1) C(2) C(3) C(4) C(5) C(6) C(7) 0 1 2 4 6 10 13 18 C(8) C(9) C(10) C(11) C(12) C(13) C(14) C(15) 22 28 33 39 46 53 61 69 C(16) C(17) C(18) C(19) C(20) C(21) C(22) C(23) 78 86 96 106 116 126 138 149 C(24) C(25) C(26) C(27) C(28) C(29) C(30) C(31) 161 173 186 199 212 226 240 255 256 224 192 PWM Data C(0) 160 128 96 64 32 224 0 0 8 16 24 PWM Data 192 40 48 56 64 Intensity Steps 160 Figure 14 Gamma Correction (64 Steps) Note: The data of 32 gamma steps is the standard value and the data of 64 gamma steps is the recommended value. 128 96 OPERATING MODE 64 PWM Mode 32 IS31FL3742 can only operate in PWM Mode. The brightness of each LED can be modulated with 256 steps by PWM registers. For example, if the data in PWM Register is “0000 0100”, then the PWM is the fourth step. 0 0 4 8 12 16 20 24 28 32 Intensity Steps Figure 13 Gamma Correction (32 Steps) Choosing more gamma steps provides for a more continuous looking breathing effect. This is useful for very long breathing cycles. The recommended configuration is defined by the breath cycle T. When T=1s, choose 32 gamma steps, when T=2s, choose 64 gamma steps. The user must decide the final number of gamma steps not only by the LED itself, but also based on the visual performance of the finished product. Table 22 64 Gamma Steps with 256 PWM Steps C(0) 32 C(1) C(2) C(3) C(4) C(5) C(6) C(7) 0 1 2 3 4 5 6 7 C(8) C(9) C(10) C(11) C(12) C(13) C(14) C(15) 8 10 12 14 16 18 20 22 C(16) C(17) C(18) C(19) C(20) C(21) C(22) C(23) 24 26 29 32 35 38 41 44 C(24) C(25) C(26) C(27) C(28) C(29) C(30) C(31) 47 50 53 57 61 65 69 73 C(32) C(33) C(34) C(35) C(36) C(37) C(38) C(39) 77 81 85 89 94 99 104 109 C(40) C(41) C(42) C(43) C(44) C(45) C(46) C(47) 114 119 124 129 134 140 146 152 C(48) C(49) C(50) C(51) C(52) C(53) C(54) C(55) 158 164 170 176 182 188 195 202 C(56) C(57) C(58) C(59) C(60) C(61) C(62) C(63) 209 216 223 230 237 244 251 255 Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 Writing new data continuously to the registers can modulate the brightness of the LEDs to achieve a breathing effect. DE-GHOST FUNCTION The “ghost” term is used to describe the behavior of an LED that should be OFF but instead glows dimly when another LED is turned ON. A ghosting effect typically can occur when multiplexing LEDs. In matrix architecture any parasitic capacitance found in the constant-current outputs or the PCB traces to the LEDs may provide sufficient current to dimly light an LED to create a ghosting effect. To prevent this LED ghost effect, the IS31FL3742 has integrated pull down resistors for each SWx (x=1~6) and pull up resistors for each CSy (y=1~30). Select the right SWx pull down resistor (PG4, 02h) and CSy pull up resistor (PG4, 02h) which eliminates the ghost LED for a particular matrix layout configuration. Typically, selecting the 32kΩ will be sufficient to eliminate the LED ghost phenomenon. The SWx pull down resistors and CSy pull up resistors are active only when the CSy/SWx output working the OFF state and therefore no power is lost through these resistors SHUTDOWN MODE Shutdown mode can be used as a means of reducing power consumption. During shutdown mode all registers retain their data. 17 IS31FL3742 Software Shutdown LAYOUT By setting SSD bit of the Configuration Register (PG4, 00h) to “0”, the IS31FL3742 will operate in software shutdown mode. When the IS31FL3742 is in software shutdown, all current sources are switched off, so that the matrix is blanked. All registers can be operated. Typical current consume is 2μA. As described in external resistor (REXT), the chip consumes lots of power. Please consider below factors when layout the PCB. Hardware Shutdown 2. REXT should be close to the chip and the ground side should well connect to the GND of the chip. The chip enters hardware shutdown when the SDB pin is pulled low. All analog circuits are disabled during hardware shutdown, typical the current consume is 2μA. The chip releases hardware shutdown when the SDB pin is pulled high. When set SDB high, the rising edge will reset the I2C module, but the register information retains. During hardware shutdown state Function Register can be operated. If VCC has risk drop below 1.75V but above 0.1V during SDB pulled low, please re-initialize all Function Registers before SDB pulled high. Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 1. The VCC (PVCC, AVCC) capacitors need to close to the chip and the ground side should well connect to the GND of the chip. 3. The thermal pad should connect to ground pins and the PCB should have the thermal pad too, usually this pad should have 16 or 25 via thru the PCB to other side’s ground area to help radiate the heat. About the thermal pad size, please refer to the land pattern of each package. 4. The CSy pins maximum current is 38mA (REXT=10kΩ), and the SWx pins maximum current is larger, the width of the trace, SWx should have wider trace then CSy. 18 IS31FL3742 CLASSIFICATION REFLOW PROFILES Profile Feature Pb-Free Assembly Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) 150°C 200°C 60-120 seconds Average ramp-up rate (Tsmax to Tp) 3°C/second max. Liquidous temperature (TL) Time at liquidous (tL) 217°C 60-150 seconds Peak package body temperature (Tp)* Max 260°C Time (tp)** within 5°C of the specified classification temperature (Tc) Max 30 seconds Average ramp-down rate (Tp to Tsmax) 6°C/second max. Time 25°C to peak temperature 8 minutes max. Figure 19 Classification Profile Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 19 IS31FL3742 PACKAGE INFORMATION QFN-48 Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 20 IS31FL3742 RECOMMENDED LAND PATTERN  QFN-48 Note: 1. Land pattern complies to IPC-7351. 2. All dimensions in MM. 3. This document (including dimensions, notes & specs) is a recommendation based on typical circuit board manufacturing parameters. Since land pattern design depends on many factors unknown (eg. user’s board manufacturing specs), user must determine suitability for use. Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 21 IS31FL3742 REVISION HISTORY Revision Detail Information Date 0A Initial release. 2017.06.03 0B 1. Update the ILED formula 2. Update Land Pattern and θJA 2017.07.17 0C 1. Update Logic Electrical Characteristics Table 2017.09.06 0D 1. Update ESD value 2. Add SDB reset function description 2017.10.20 A Release to mass production 2017.12.13 Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 12/13/2017 22