®
IS61LP6436A
IS61LP6432A
64K x 32, 64K x 36 SYNCHRONOUS
PIPELINED STATIC RAM
FEATURES
• Internal self-timed write cycle
• Individual Byte Write Control and Global Write
• Clock controlled, registered address, data and
control
• Pentium™ or linear burst sequence control using MODE input
• Three chip enables for simple depth expansion
and address pipelining
• Common data inputs and data outputs
• JEDEC 100-Pin TQFP package
• Power-down snooze mode
• Power Supply:
+3.3V Vdd
+3.3V or 2.5V Vddq (I/O)
• Lead-free available
Long-term Support
World Class Quality
MAY 2017
DESCRIPTION
The ISSI IS61LP6432A/36A is a high-speed synchronous
static RAM designed to provide a burstable, high-performance memory for high speed networking and communication applications. The IS61LP6432A is organized as 64K
words by 32 bits and the IS61LP6436A is organized as 64K
words by 36 bits. Fabricated with ISSI's advanced CMOS
technology, the device integrates a 2-bit burst counter,
high-speed SRAM core, and high-drive capability outputs
into a single monolithic circuit. All synchronous inputs pass
through registers controlled by a positive-edge-triggered
single clock input.
Write cycles are internally self-timed and are initiated by the
rising edge of the clock input. Write cycles can be from one
to four bytes wide as controlled by the write control inputs.
Separate byte enables allow individual bytes to be written. BW1 controls DQa, BW2 controls DQb, BW3 controls
DQc, BW4 controls DQd, conditioned by BWE being LOW.
A LOW on GW input would cause all bytes to be written.
Bursts can be initiated with either ADSP (Address Status
Processor) or ADSC (Address Status Cache Controller)
input pins. Subsequent burst addresses can be generated internally and controlled by the ADV (burst address
advance) input pin.
The mode pin is used to select the burst sequence order,
Linear burst is achieved when this pin is tied LOW. Interleave
burst is achieved when this pin is tied HIGH or left floating.
FAST ACCESS TIME
Symbol Parameter
tkq
Clock Access Time
tkc
Cycle Time
Frequency
-166
3.5
6
166
-133
4
7.5
133
Units
ns
ns
MHz
Copyright © 2017 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no
liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on
any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon
Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. 1
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IS61LP6432A
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BLOCK DIAGRAM
MODE
Q0
CLK
CLK
A0'
A0
BINARY
COUNTER
ADSC
ADSP
A15-A0
Q1
CE
ADV
A1'
A1
64K x 32
64K x 36
MEMORY ARRAY
CLR
16
D
Q
14
16
ADDRESS
REGISTER
CE
CLK
GW
BWE
BW4
D
x32/x36
x32/x36
Q
DQd
BYTE WRITE
REGISTERS
CLK
BW3
D
DQc Q
BYTE WRITE
REGISTERS
CLK
D
BW2
Q
DQb
BYTE WRITE
REGISTERS
CLK
BW1
D
DQa Q
BYTE WRITE
REGISTERS
CLK
CE
CE2
CE2
4
D
Q
ENABLE
REGISTER
INPUT
REGISTERS
CLK
OUTPUT
REGISTERS
CLK
x32/x36
OE
DQ[31:0]
DQ[35:0]
CE
CLK
D
Q
ENABLE
DELAY
REGISTER
CLK
OE
2
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PIN CONFIGURATION
A6
A7
CE
CE2
BW4
BW3
BW2
BW1
CE2
VDD
VSS
CLK
GW
BWE
OE
ADSC
ADSP
ADV
A8
A9
100-Pin TQFP
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
1
80
2
79
3
78
4
77
5
76
6
75
7
74
8
73
9
72
10
71
11
70
12
69
13
68
14
67
15
66
16
65
17
64
18
63
19
62
20
61
21
60
22
59
23
58
24
57
25
56
26
55
27
54
28
53
29
52
30
51
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
DQPb
DQb8
DQb7
VDDQ
VSS
DQb6
DQb5
DQb4
DQb3
VSS
VDDQ
DQb2
DQb1
VSS
NC
VDD
ZZ
DQa8
DQa7
VDDQ
VSS
DQa6
DQa5
DQa4
DQa3
VSS
VDDQ
DQa2
DQa1
DQPa
MODE
A5
A4
A3
A2
A1
A0
NC
NC
VSS
VDD
NC
NC
A10
A11
A12
A13
A14
A15
NC
DQPc
DQc1
DQc2
VDDQ
VSS
DQc3
DQc4
DQc5
DQc6
VSS
VDDQ
DQc7
DQc8
NC
VDD
NC
VSS
DQd1
DQd2
VDDQ
VSS
DQd3
DQd4
DQd5
DQd6
VSS
VDDQ
DQd7
DQd8
DQPd
64K x 36
PIN DESCRIPTIONS
A0, A1
A2-A15
CLK
ADSP
ADSC
ADV
BW1-BW4
BWE
Synchronous Address Inputs. These
pins must tied to the two LSBs of the
address bus.
Synchronous Address Inputs
Synchronous Clock
Synchronous Processor Address
Status
Synchronous Controller Address
Status
Synchronous Burst Address Advance
Individual Byte Write Enable
Synchronous Byte Write Enable
GW
Synchronous Global Write Enable
CE, CE2, CE2 Synchronous Chip Enable
OE
Output Enable
DQa-DQd
Synchronous Data Input/Output
MODE Burst Sequence Mode Selection
Vdd
+3.3V Power Supply
Vss
Ground
Vddq
Isolated Output Buffer Supply: +3.3V/2.5V
ZZ
Snooze Enable
DQPa-DQPd Parity Data I/O
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PIN CONFIGURATION
A6
A7
CE
CE2
BW4
BW3
BW2
BW1
CE2
VDD
VSS
CLK
GW
BWE
OE
ADSC
ADSP
ADV
A8
A9
100-Pin TQFP
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
1
80
2
79
3
78
4
77
5
76
6
75
7
74
8
73
9
72
10
71
11
70
12
69
13
68
14
67
15
66
16
65
17
64
18
63
19
62
20
61
21
60
22
59
23
58
24
57
25
56
26
55
27
54
28
53
29
52
30
51
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
NC
DQb8
DQb7
VDDQ
VSS
DQb6
DQb5
DQb4
DQb3
VSS
VDDQ
DQb2
DQb1
VSS
NC
VDD
ZZ
DQa8
DQa7
VDDQ
VSS
DQa6
DQa5
DQa4
DQa3
VSS
VDDQ
DQa2
DQa1
NC
MODE
A5
A4
A3
A2
A1
A0
NC
NC
VSS
VDD
NC
NC
A10
A11
A12
A13
A14
A15
NC
NC
DQc1
DQc2
VDDQ
VSS
DQc3
DQc4
DQc5
DQc6
VSS
VDDQ
DQc7
DQc8
NC
VDD
NC
VSS
DQd1
DQd2
VDDQ
VSS
DQd3
DQd4
DQd5
DQd6
VSS
VDDQ
DQd7
DQd8
NC
64K x 32
PIN DESCRIPTIONS
A0, A1
A2-A15
CLK
ADSP
ADSC
ADV
BW1-BW4
BWE
4
Synchronous Address Inputs. These
pins must tied to the two LSBs of the
address bus.
Synchronous Address Inputs
Synchronous Clock
Synchronous Processor Address
Status
Synchronous Controller Address
Status
Synchronous Burst Address Advance
Individual Byte Write Enable
Synchronous Byte Write Enable
GW
Synchronous Global Write Enable
CE, CE2, CE2 Synchronous Chip Enable
OE
Output Enable
DQa-DQd
Synchronous Data Input/Output
MODE Burst Sequence Mode Selection
Vdd
+3.3V Power Supply
Vss
Ground
Vddq
Isolated Output Buffer Supply: +3.3V/2.5V
ZZ
Snooze Enable
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TRUTH TABLE(1-8)
OPERATION ADDRESS
CE CE2 CE2 ZZ ADSP ADSC ADV
Deselect Cycle, Power-Down
None
H
X
X
L
X
L
X
Deselect Cycle, Power-Down
None
L
X
L
L
L
X
X
Deselect Cycle, Power-Down
None
L
H
X
L
L
X
X
Deselect Cycle, Power-Down
None
L
X
L
L
H
L
X
Deselect Cycle, Power-Down
None
L
H
X
L
H
L
X
Snooze Mode, Power-Down
None
X
X
X
H
X
X
X
Read Cycle, Begin Burst
External
L
L
H
L
L
X
X
Read Cycle, Begin Burst
External
L
L
H
L
L
X
X
Write Cycle, Begin Burst
External
L
L
H
L
H
L
X
Read Cycle, Begin Burst
External
L
L
H
L
H
L
X
Read Cycle, Begin Burst
External
L
L
H
L
H
L
X
Read Cycle, Continue Burst
Next
X
X
X
L
H
H
L
Read Cycle, Continue Burst
Next
X
X
X
L
H
H
L
Read Cycle, Continue Burst
Next
H
X
X
L
X
H
L
Read Cycle, Continue Burst
Next
H
X
X
L
X
H
L
Write Cycle, Continue Burst
Next
X
X
X
L
H
H
L
Write Cycle, Continue Burst
Next
H
X
X
L
X
H
L
Read Cycle, Suspend Burst
Current
X
X
X
L
H
H
H
Read Cycle, Suspend Burst
Current
X
X
X
L
H
H
H
Read Cycle, Suspend Burst
Current
H
X
X
L
X
H
H
Read Cycle, Suspend Burst
Current
H
X
X
L
X
H
H
Write Cycle, Suspend Burst
Current
X
X
X
L
H
H
H
Write Cycle, Suspend Burst
Current
H
X
X
L
X
H
H
WRITE OE CLK DQ
X
X
L-H
High-Z
X
X
L-H
High-Z
X
X
L-H
High-Z
X
X
L-H
High-Z
X
X
L-H
High-Z
X
X
X
High-Z
X
L
L-H
Q
X
H
L-H
High-Z
L
X
L-H
D
H
L
L-H
Q
H
H
L-H
High-Z
H
L
L-H
Q
H
H
L-H
High-Z
H
L
L-H
Q
H
H
L-H
High-Z
L
X
L-H
D
L
X
L-H
D
H
L
L-H
Q
H
H
L-H
High-Z
H
L
L-H
Q
H
H
L-H
High-Z
L
X
L-H
D
L
X
L-H
D
NOTE:
1. X means “Don’t Care.” H means logic HIGH. L means logic LOW.
2. For WRITE, L means one or more byte write enable signals (BWa-d) and BWE are LOW or GW is LOW. WRITE = H for all
BWx, BWE, GW HIGH.
3. BWa enables WRITEs to DQa’s and DQPa. BWb enables WRITEs to DQb’s and DQPb. BWc enables WRITEs to DQc’s and
DQPc. BWd enables WRITEs to DQd’s and DQPd. DQPa and DQPb are available on the x18 version. DQPa-DQPd are available on the x36 version.
4. All inputs except OE and ZZ must meet setup and hold times around the rising edge (LOW to HIGH) of CLK.
5. Wait states are inserted by suspending burst.
6. For a WRITE operation following a READ operation, OE must be HIGH before the input data setup time and held HIGH during
the input data hold time.
7. This device contains circuitry that will ensure the outputs will be in High-Z during power-up.
8. ADSP LOW always initiates an internal READ at the L-H edge of CLK. A WRITE is performed by setting one or more byte write
enable signals and BWE LOW or GW LOW for the subsequent L-H edge of CLK. See WRITE timing diagram for clarification.
PARTIAL TRUTH TABLE
Function
Read
Read
Write Byte 1
Write All Bytes
Write All Bytes
GW BWE BWa BWb BWc BWd
H H X X X X
H
L
H
H
H
H
H
L
L
H
H
H
H
L
L
L
L
L
L
X
X
X
X
X
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INTERLEAVED BURST ADDRESS TABLE (MODE = Vdd or No Connect)
External Address
1st Burst Address
2nd Burst Address
3rd Burst Address
A1 A0
A1 A0
A1 A0
A1 A0
00 01 10 11
01 00 11 10
10 11 00 01
11 10 01 00
LINEAR BURST ADDRESS TABLE (MODE = Vss)
0,0
A1', A0' = 1,1
0,1
1,0
ABSOLUTE MAXIMUM RATINGS(1)
Symbol Parameter
Tstg
Storage Temperature
Pd
Power Dissipation
Iout
Output Current (per I/O)
Vin, Vout Voltage Relative to Vss for I/O Pins
Vin
Voltage Relative to Vss for
for Address and Control Inputs
Vdd
Voltage on Vdd Supply Relative to Vss
Value
Unit
–55 to +150
°C
1.6
W
100
mA
–0.5 to Vddq + 0.3 V
–0.5 to Vdd + 0.5
V
–0.5 to 4.6
V
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent
damage to the device. This is a stress rating only and functional operation of the device at these
or any other conditions above those indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating conditions for extended periods may affect
reliability.
2. This device contains circuitry to protect the inputs against damage due to high static voltages
or electric fields; however, precautions may be taken to avoid application of any voltage higher
than maximum rated voltages to this high-impedance circuit.
3. This device contains circuitry that will ensure the output devices are in High-Z at power up.
6
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OPERATING RANGE
Range
Ambient Temperature
Vdd
Vddq
Commercial
0°C to +70°C
3.3V + 5%
3.3V + 5%
2.5V + 5%
Industrial
–40°C to +85°C
3.3V + 5%
3.3V + 5%
2.5V + 5%
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol
Parameter
Voh
Output HIGH Voltage
Vol
Output LOW Voltage
Vih
Input HIGH Voltage
Vil
Input LOW Voltage
Ili
Input Leakage Current
Ilo
Output Leakage Current
2.5V (I/O)
3.3V (I/O)
Test Conditions
Min. Max. Min. Max.
Ioh = –4.0 mA (3.3V)
2.0
—
2.4
—
Ioh = 1.0 mA (2.5V)
Iol = 8.0 mA (3.3V)
—
0.4
—
0.4
Iol = 1.0 mA (2.5V)
1.7
Vdd + 0.3 2.0
Vdd + 0.3
–0.3
0.7
–0.3
0.8
(1)
Vss ≤ Vin ≤ Vdd
–5
5
–5
5
Vss ≤ Vout ≤ Vddq, OE = Vi
–5
5
–5
5
Unit
V
V
V
V
µA
µA
POWER SUPPLY CHARACTERISTICS (Over Operating Range)
Symbol
Parameter
Test Conditions
Icc
AC Operating
Device Selected,
Com.
Supply Current
All Inputs = Vil or Vih
Ind.
OE = Vih, Vdd = Max.
Cycle Time ≥ tkc min.
Isb1
Standby Current
Device Deselected,
Com.
Vdd = Max.,
Ind.
All Inputs = Vih or Vil
CLK Cycle Time ≥ tkc min.
Izz
Power-down Mode
ZZ = Vdd Com.
Current
Clock Running
Ind.
All Inputs ≤ Vss + 0.2V
or ≥ Vdd – 0.2V
-166
-133
Max. Max.
190
180
200 190
Unit
mA
mA
70
80
70
80
mA
mA
35
40
35
mA
40
mA
Notes:
1. The MODE pin has an internal pullup. This pin may be a No Connect, tied to Vss, or tied to Vdd.
2. The MODE pin should be tied to Vdd or Vss. It exhibits ±10 µA maximum leakage current when tied to ≤ Vss + 0.2V
or ≥ Vdd – 0.2V.
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CAPACITANCE(1,2)
Symbol
Cin
Cout
Parameter
Input Capacitance
Input/Output Capacitance
Conditions
Vin = 0V
Vout = 0V
Max.
6
8
Unit
pF
pF
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: Ta = 25°C, f = 1 MHz, Vdd = 3.3V.
3.3V I/O AC TEST CONDITIONS
Parameter
Input Pulse Level
Input Rise and Fall Times
Input and Output Timing
and Reference Level
Output Load
Unit
0V to 3.0V
1ns
1.5V
See Figures 1 and 2
3.3V I/O OUTPUT LOAD EQUIVALENT
317 Ω
ZO = 50Ω
+3.3V
OUTPUT
OUTPUT
50Ω
351 Ω
5 pF
Including
jig and
scope
1.5V
Figure 1
8
Figure 2
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2.5V I/O AC TEST CONDITIONS
Parameter
Input Pulse Level
Input Rise and Fall Times
Input and Output Timing
and Reference Level
Output Load
Unit
0V to 2.5V
1 ns
1.25V
See Figures 3 and 4
2.5V I/O OUTPUT LOAD EQUIVALENT
1,667 Ω
+2.5V
ZO = 50Ω
OUTPUT
OUTPUT
50Ω
1,538 Ω
5 pF
Including
jig and
scope
1.25V
Figure 3
Figure 4
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READ/WRITE CYCLE SWITCHING CHARACTERISTICS (Over Operating Range)
Symbol Parameter
fmax(3)
Clock Frequency
tkc(3)
Cycle Time
tkh
Clock High Time
(3)
tkl
Clock Low Time
(3)
tkq
Clock Access Time
tkqx(1)
Clock High to Output Invalid
tkqlz(1,2)
Clock High to Output Low-Z
(1,2)
tkqhz
Clock High to Output High-Z
(3)
toeq
Output Enable to Output Valid
toeqx(1)
Output Disable to Output Invalid
toelz(1,2)
Output Enable to Output Low-Z
toehz
tas(3)
tss(3)
tws(3)
tces(3)
tavs(3)
tah(3)
tsh(3)
twh(3)
tceh(3)
tavh(3)
(1,2)
-166
-133
Min. Max. Min. Max.
—
166
—
133
6
—
7.5
—
2.4
—
2.8
—
2.4
—
2.8
—
—
3.5
—
4
3
—
3
—
0
—
0
—
1.5
3.5
1.5
3.5
—
3.5
—
3.8
0
—
0
—
0
Output Disable to Output High-Z
2
Address Setup Time
2.1
Address Status Setup Time
1.5
Write Setup Time
1.5
Chip Enable Setup Time
1.5
Address Advance Setup Time
1.5
Address Hold Time
1.0
Address Status Hold Time
0.5
Write Hold Time
0.5
Chip Enable Hold Time
0.5
Address Advance Hold Time
0.5
—
4.5
—
—
—
—
—
—
—
—
—
—
0
—
2
5
2.1
—
1.5
—
1.5
—
1.5
—
1.5
—
1.0 —
0.5
—
0.5
—
0.5
—
0.5
—
Unit
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Note:
1. Guaranteed but not 100% tested. This parameter is periodically sampled.
2. Tested with load in Figure 2.
3. Tested with load in Figure 1.
10
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READ/WRITE CYCLE TIMING
tKC
CLK
tSS
tSH
tKH
tKL
ADSP is blocked by CE inactive
ADSP
tSS
tSH
ADSC initiate read
ADSC
tAVH
tAVS
Suspend Burst
ADV
tAS
A15-A0
tAH
RD1
RD2
tWS
tWH
tWS
tWH
RD3
GW
BWE
BW4-BW1
tCES
tCEH
tCES
tCEH
tCES
tCEH
CE Masks ADSP
CE
Unselected with CE2
CE2 and CE2 only sampled with ADSP or ADSC
CE2
CE2
tOEHZ
tOEQ
OE
DATAOUT
tKQX
tOEQX
tOELZ
High-Z
1a
2a
2b
2c
2d
tKQLZ
3a
tKQHZ
tKQ
DATAIN
High-Z
Pipelined Read
Single Read
Burst Read
Unselected
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WRITE CYCLE SWITCHING CHARACTERISTICS (Over Operating Range)
-166
-133
Symbol
Parameter
Min.
Max.
Min.
Max.
Unit
(1)
tkc
Cycle Time
6
—
7.5
—
ns
(1)
tkh
Clock High Time
2.4
—
2.8
—
ns
tkl(1)
Clock Low Time
2.4
—
2.8
—
ns
tas(1)
Address Setup Time
2.1
—
2.1
—
ns
(1)
tss
Address Status Setup Time
1.5
—
1.5
—
ns
(1)
tws
Write Setup Time
1.5
—
1.5
—
ns
tds(1)
Data In Setup Time
1.5
—
1.5
—
ns
tces(1)
Chip Enable Setup Time
1.5
—
1.5
—
ns
(1)
tavs
Address Advance Setup Time
1.5
—
1.5
—
ns
(1)
tah
Address Hold Time
1.0 — 1.0
—
ns
tsh(1)
Address Status Hold Time
0.5
—
0.5
—
ns
tdh(1)
twh(1)
tceh(1)
tavh(1)
Data In Hold Time
Write Hold Time
Chip Enable Hold Time
Address Advance Hold Time
1.0
0.5
0.5
0.5
—
—
—
—
1.0
0.5
0.5
0.5
—
—
—
—
ns
ns
ns
ns
Note:
1. Tested with load in Figure 1.
12
Integrated Silicon Solution, Inc.
Rev. C1
05/22/2017
IS61LP6436A
IS61LP6432A
®
Long-term Support
World Class Quality
WRITE CYCLE TIMING
tKC
CLK
tSS
tSH
tKH
tKL
ADSP is blocked by CE inactive
ADSP
ADSC initiate Write
ADSC
ADV must be inactive for ADSP Write tAVS
tAVH
ADV
tAS
A15-A0
tAH
WR1
WR3
WR2
tWS
tWH
tWS
tWH
tWS
tWH
GW
BWE
WR1
BW4-BW1
tCES
tCEH
tCES
tCEH
tCES
tCEH
tWS
tWH
WR2
WR3
CE Masks ADSP
CE
Unselected with CE2
CE2 and CE2 only sampled with ADSP or ADSC
CE2
CE2
OE
DATAOUT
High-Z
tDS
DATAIN
High-Z
Single Write
tDH
1a
BW4-BW1 only are applied to first cycle of WR2
2a
2b
2c
2d
Burst Write
3a
Write
Unselected
Integrated Silicon Solution, Inc. 13
Rev. C1
05/22/2017
IS61LP6436A
IS61LP6432A
®
Long-term Support
World Class Quality
SNOOZE AND RECOVERY CYCLE SWITCHING CHARACTERISTICS (Over Operating Range)
Symbol Parameter
tkc(3)
Cycle Time
(3)
tkh
Clock High Time
tkl(3)
Clock Low Time
tkq(3)
Clock Access Time
(1)
tkqx
Clock High to Output Invalid
(1,2)
tkqlz
Clock High to Output Low-Z
tkqhz(1,2)
Clock High to Output High-Z
toeq(3)
Output Enable to Output Valid
(1)
toeqx
Output Disable to Output Invalid
(1,2)
toelz
Output Enable to Output Low-Z
toehz(1,2)
Output Disable to Output High-Z
tas
tss(3)
tces(3)
tah(3)
tsh(3)
tceh(3)
tzzs
tzzrec
(3)
Address Setup Time
Address Status Setup Time
Chip Enable Setup Time
Address Hold Time
Address Status Hold Time
Chip Enable Hold Time
ZZ Standby
ZZ Recovery
-166
Min.
Max.
6
—
2.4
—
2.4
—
—
3.5
1.5
—
0
—
1.5
3.5
—
3.5
0
—
0
—
-133
Min. Max. Unit
7.5
—
ns
2.8
—
ns
2.8
—
ns
—
4
ns
1.5
—
ns
0
—
ns
1.5
3.5
ns
—
3.9
ns
0
—
ns
0
—
ns
2
2.1
1.5
1.5
1.0
0.5
0.5
2
2
2
2.1
1.5
1.5
1.0
0.5
0.5
2
2
4.5
—
—
—
—
—
—
—
—
5.0
—
—
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
ns
cyc
cyc
Notes:
1. Guaranteed but not 100% tested. This parameter is periodically sampled.
2. Tested with load in Figure 2.
3. Tested with load in Figure 1.
14
Integrated Silicon Solution, Inc.
Rev. C1
05/22/2017
IS61LP6436A
IS61LP6432A
®
Long-term Support
World Class Quality
SNOOZE AND RECOVERY CYCLE TIMING
tKC
CLK
tSS
tSH
tAS
tAH
tKH
tKL
ADSP
ADSC
ADV
A15-A0
RD2
RD1
GW
BWE
BW4-BW1
tCES
tCEH
tCES
tCEH
tCES
tCEH
CE
CE2
CE2
tOEHZ
tOEQ
OE
tOEQX
tOELZ
DATAOUT
High-Z
1a
tKQLZ
tKQ
DATAIN
tKQX
tKQHZ
High-Z
tZZS
tZZREC
ZZ
Single Read
Snooze with Data Retention
Read
Integrated Silicon Solution, Inc. 15
Rev. C1
05/22/2017
IS61LP6436A
IS61LP6432A
®
Long-term Support
World Class Quality
ORDERING INFORMATION: IS61LP6432A
Industrial Range: –40°C to +85°C
Speed
133 MHz
Order Part Number
IS61LP6432A-133TQLI
Package
TQFP, Lead-free
ORDERING INFORMATION: IS61LP6436A
Industrial Range: –40°C to +85°C
Speed
166 MHz
133 MHz
16
Order Part Number
IS61LP6436A-166TQLI
IS61LP6436A-133TQLI
Package
TQFP, Lead-free
TQFP, Lead-free
Integrated Silicon Solution, Inc.
Rev. C1
05/22/2017
IS61LP6436A
IS61LP6432A
®
Long-term Support
World Class Quality
Integrated Silicon Solution, Inc. 17
Rev. C1
05/22/2017