IS61LV25616AL-10TI

IS61LV25616AL 256K x 16 HIGH SPEED ASYNCHRONOUS CMOS STATIC RAM WITH 3.3V SUPPLY DECEMBER 2011 DESCRIPTION The ISSI IS61LV25616AL is a high-speed, 4,194,304-bit FEATURES • High-speed access time: — 10, 12 ns • CMOS low power operation • Low stand-by power: — Less than 5 mA (typ.) CMOS stand-by • TTL compatible interface levels • Single 3.3V power supply • Fully static operation: no clock or refresh required • Three state outputs • Data control for upper and lower bytes • Industrial temperature available • Lead-free available static RAM organized as 262,144 words by 16 bits. It is fabricated using ISSI's high-performance CMOS technology. This highly reliable process coupled with innovative circuit design techniques, yields high-performance and low power consumption devices. When CE is HIGH (deselected), the device assumes a standby mode at which the power dissipation can be reduced down with CMOS input levels. Easy memory expansion is provided by using Chip Enable and Output Enable inputs, CE and OE. The active LOW Write Enable (WE) controls both writing and reading of the memory. A data byte allows Upper Byte (UB) and Lower Byte (LB) access. The IS61LV25616AL is packaged in the JEDEC standard 44-pin 400-mil SOJ, 44-pin TSOP Type II, 44-pin LQFP and 48-pin Mini BGA (8mm x 10mm). FUNCTIONAL BLOCK DIAGRAM A0-A17 DECODER 256K x 16 MEMORY ARRAY I/O DATA CIRCUIT COLUMN I/O VDD GND I/O0-I/O7 Lower Byte I/O8-I/O15 Upper Byte CE OE WE UB LB CONTROL CIRCUIT Copyright © 2011 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 12/15/2011 1 IS61LV25616AL TRUTH TABLE Mode Not Selected Output Disabled Read Write WE X H X H H H L L L CE H L L L L L L L L OE X H X L L L X X X LB X X H L H L L H L PIN CONFIGURATIONS 44-Pin TSOP (Type II) and SOJ A0 A1 A2 A3 A4 CE I/O0 I/O1 I/O2 I/O3 VDD GND I/O4 I/O5 I/O6 I/O7 WE A5 A6 A7 A8 A9 2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 UB X X H H L L H L L I/O PIN I/O0-I/O7 I/O8-I/O15 High-Z High-Z High-Z High-Z High-Z High-Z Dout High-Z High-Z Dout Dout Dout Din High-Z High-Z Din Din Din Vdd Current Isb1, Isb2 Icc Icc Icc PIN DESCRIPTIONS 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 A17 A16 A15 OE UB LB I/O15 I/O14 I/O13 I/O12 GND VDD I/O11 I/O10 I/O9 I/O8 NC A14 A13 A12 A11 A10 A0-A17 I/O0-I/O15 CE OE WE LB UB NC Vdd GND Address Inputs Data Inputs/Outputs Chip Enable Input Output Enable Input Write Enable Input Lower-byte Control (I/O0-I/O7) Upper-byte Control (I/O8-I/O15) No Connection Power Ground Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 12/15/2011 IS61LV25616AL PIN CONFIGURATIONS 44-Pin LQFP 48-Pin mini BGA 2 3 4 5 6 A LB OE A0 A1 A2 N/C B I/O8 UB A3 A4 CE I/O0 C I/O9 I/O10 A5 A6 I/O1 I/O2 D GND I/O11 A17 A7 I/O3 VDD E VDD I/O12 NC A16 I/O4 GND F I/O14 I/O13 A14 A15 I/O5 I/O6 G I/O15 NC A12 A13 WE I/O7 H NC A8 A9 A10 A11 NC A17 A16 A15 A14 A13 A12 A11 A10 OE UB LB 1 44 43 42 41 40 39 38 37 36 35 34 33 1 32 2 31 3 30 4 29 5 TOP VIEW 28 6 27 7 26 8 25 9 24 10 23 11 12 13 14 15 16 17 18 19 20 21 22 I/O15 I/O14 I/O13 I/O12 GND VDD I/O11 I/O10 I/O9 I/O8 NC WE A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 CE I/O0 I/O1 I/O2 I/O3 VDD GND I/O4 I/O5 I/O6 I/O7 PIN DESCRIPTIONS A0-A17 I/O0-I/O15 CE OE WE LB UB NC Vdd GND Address Inputs Data Inputs/Outputs Chip Enable Input Output Enable Input Write Enable Input Lower-byte Control (I/O0-I/O7) Upper-byte Control (I/O8-I/O15) No Connection Power Ground Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 12/15/2011 3 IS61LV25616AL ABSOLUTE MAXIMUM RATINGS(1) Symbol Vterm Tstg Pt Parameter Terminal Voltage with Respect to GND Storage Temperature Power Dissipation Value –0.5 to Vdd+0.5 –65 to +150 1.0 Unit V °C W Note: 1.  Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. OPERATING RANGE Range Commercial Industrial Ambient Temperature 0°C to +70°C –40°C to +85°C Vdd 10ns 3.3V +10%, -5% 3.3V +10%, -5% 12ns 3.3V + 10% 3.3V + 10% DC ELECTRICAL CHARACTERISTICS (Over Operating Range) Symbol Voh Vol Vih Vil Ili Ilo Parameter Output HIGH Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage(1) Input Leakage Output Leakage Test Conditions Vdd = Min., Ioh = –4.0 mA Vdd = Min., Iol = 8.0 mA GND ≤ Vin ≤ Vdd GND ≤ Vout ≤ Vdd Outputs Disabled Com. Ind. Com. Ind. Min. 2.4 — 2.0 –0.3 –2 –5 –2 –5 Max. — 0.4 Vdd + 0.3 0.8 2 5 2 5 Unit V V V V µA µA Notes: 1.  Vil (min.) = –2.0V for pulse width less than 10 ns. 4 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 12/15/2011 IS61LV25616AL POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range) Symbol Parameter Test Conditions Icc Vdd Dynamic Operating Vdd = Max., Com. Supply Current Iout = 0 mA, f = fmax Ind. Isb TTL Standby Current Vdd = Max., Com. (TTL Inputs) Vin = Vih or Vil Ind. CE ≥ Vih, f = fmax. Isb1 TTL Standby Current Vdd = Max., Com. (TTL Inputs) Vin = Vih or Vil Ind. CE ≥ Vih, f = 0 Isb2 CMOS Standby Vdd = Max., Com. Current (CMOS Inputs) CE ≥ Vdd – 0.2V, Ind. Vin ≥ Vdd – 0.2V, or Vin ≤ 0.2V, f = 0 -10 Min. Max. — 100 — 110 — 50 — 55 -12 Min. Max. — 90 — 100 — 45 — 50 Unit mA mA — — 20 25 — — 20 25 mA — — 15 20 — — 15 20 mA Note: 1. At f = fmax, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change. Shaded area product in development CAPACITANCE(1) Symbol Cin Cout Parameter Input Capacitance Input/Output Capacitance Conditions Vin = 0V Vout = 0V Max. 6 8 Unit pF pF Note: 1.  Tested initially and after any design or process changes that may affect these parameters. Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 12/15/2011 5 IS61LV25616AL READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range) Symbol Parameter trc Read Cycle Time taa Address Access Time toha Output Hold Time tace CE Access Time tdoe OE Access Time thzoe(2) OE to High-Z Output tlzoe(2) OE to Low-Z Output thzce(2 CE to High-Z Output tlzce(2) CE to Low-Z Output tba LB, UB Access Time thzb(2) LB, UB to High-Z Output tlzb(2) LB, UB to Low-Z Output tpu Power Up Time tpd Power Down Time -10 Min. Max. 10 — — 10 2 — — 10 — 4 — 4 0 — 0 4 3 — — 4 0 3 0 — 0 — — 10 -12 Min. Max. 12 — — 12 2 — — 12 — 5 — 5 0 — 0 6 3 — — 5 0 4 0 — 0 — — 12 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns Notes: 1.  Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0V to 3.0V and output loading specified in Figure 1. 2.  Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. AC TEST LOADS 319 Ω 319 Ω 3.3V 3.3V OUTPUT OUTPUT 30 pF Including jig and scope 5 pF Including jig and scope 353 Ω Figure 1 353 Ω Figure 2 AC TEST CONDITIONS 6 Parameter Input Pulse Level Input Rise and Fall Times Input and Output Timing and Reference Level Output Load Unit 0V to 3.0V 3 ns 1.5V See Figures 1 and 2 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 12/15/2011 IS61LV25616AL AC WAVEFORMS READ CYCLE NO. 1(1,2) (Address Controlled) (CE = OE = Vil, UB or LB = Vil) t RC ADDRESS t OHA DOUT t AA t OHA DATA VALID PREVIOUS DATA VALID READ1.eps READ CYCLE NO. 2(1,3) tRC ADDRESS tAA tOHA OE tHZOE tDOE tLZOE CE tACE tLZCE tHZCE LB, UB DOUT VDD Supply Current HIGH-Z tBA tLZB tHZB tRC DATA VALID tPU 50% tPD 50% ICC ISB UB_CEDR2.eps Notes: 1. WE is HIGH for a Read Cycle. 2. The device is continuously selected. OE, CE, UB, or LB = Vil. 3. Address is valid prior to or coincident with CE LOW transition. Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 12/15/2011 7 IS61LV25616AL READ CYCLE NO. 2(1,3) tRC ADDRESS tAA tOHA OE tHZOE tDOE tLZOE CE tACE tLZCE tHZCE LB, UB DOUT VDD Supply Current HIGH-Z tBA tLZB tHZB tRC DATA VALID tPU tPD 50% 50% ICC ISB UB_CEDR2.eps Notes: 1. WE is HIGH for a Read Cycle. 2. The device is continuously selected. OE, CE, UB, or LB = Vil. 3. Address is valid prior to or coincident with CE LOW transition. WRITE CYCLE SWITCHING CHARACTERISTICS(1,3) (Over Operating Range) Symbol Parameter twc Write Cycle Time tsce CE to Write End taw Address Setup Time to Write End tha Address Hold from Write End tsa Address Setup Time tpwb LB, UB Valid to End of Write WE Pulse Width tpwe1 tpwe2 WE Pulse Width (OE = LOW) tsd Data Setup to Write End thd Data Hold from Write End thzwe(2) WE LOW to High-Z Output (2) tlzwe WE HIGH to Low-Z Output -10 Min. Max. 10 — 8 — 8 — 0 — 0 — 8 — 8 — 10 — 6 — 0 — — 5 2 — -12 Min. Max. 12 — 8 — 8 — 0 — 0 — 8 — 8 — 12 — 6 — 0 — — 6 2 — Unit ns ns ns ns ns ns ns ns ns ­ns ns ns Notes: 1.  Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0V to 3.0V and output loading specified in Figure 1. 2.  Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested. 3.  The internal write time is defined by the overlap of CE LOW and UB or LB and WE LOW. All signals must be in valid states to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the write. 8 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 12/15/2011 IS61LV25616AL AC WAVEFORMS WRITE CYCLE NO. 1 (CE Controlled, OE is HIGH or LOW) (1 ) t WC VALID ADDRESS ADDRESS t SA t SCE t HA CE t AW t PWE1 t PWE2 WE t PBW UB, LB t HZWE DOUT t LZWE HIGH-Z DATA UNDEFINED t SD t HD DATAIN VALID DIN UB_CEWR1.eps Notes: 1.  WRITE is an internally generated signal asserted during an overlap of the LOW states on the CE and WE inputs and at least one of the LB and UB inputs being in the LOW state. 2.  WRITE = (CE) [ (LB) = (UB) ] (WE). WRITE CYCLE NO. 2 (WE Controlled. OE is HIGH During Write Cycle) (1,2) t WC ADDRESS VALID ADDRESS t HA OE CE LOW t AW t PWE1 WE t SA t PBW UB, LB t HZWE DOUT DATA UNDEFINED t LZWE HIGH-Z t SD DIN t HD DATAIN VALID UB_CEWR2.eps Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 12/15/2011 9 IS61LV25616AL AC WAVEFORMS WRITE CYCLE NO. 3 (WE Controlled. OE is LOW During Write Cycle) (1) t WC ADDRESS VALID ADDRESS OE LOW CE LOW t HA t AW t PWE2 WE t SA t PBW UB, LB t HZWE DOUT t LZWE HIGH-Z DATA UNDEFINED t SD t HD DATAIN VALID DIN UB_CEWR3.eps WRITE CYCLE NO. 4 (LB, UB Controlled, Back-to-Back Write) (1,3) t WC ADDRESS t WC ADDRESS 1 ADDRESS 2 OE t SA CE LOW t HA t SA WE UB, LB t HA t PBW t PBW WORD 1 WORD 2 t HZWE DOUT t LZWE HIGH-Z DATA UNDEFINED t HD t SD DIN DATAIN VALID t HD t SD DATAIN VALID UB_CEWR4.eps Notes: 1.  The internal Write time is defined by the overlap of CE = LOW, UB and/or LB = LOW, and WE = LOW. All signals must be in valid states to initiate a Write, but any can be deasserted to terminate the Write. The t sa, t ha, t sd, and t hd timing is referenced to the rising or falling edge of the signal that terminates the Write. 2.  Tested with OE HIGH for a minimum of 4 ns before WE = LOW to place the I/O in a HIGH-Z state. 3.  WE may be held LOW across many address cycles and the LB, UB pins can be used to control the Write function. 10 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 12/15/2011 IS61LV25616AL DATA RETENTION SWITCHING CHARACTERISTICS  (LL) Symbol Parameter Test Condition Vdr Vdd for Data Retention See Data Retention Waveform Idr Data Retention Current Vdd = 2.0V, CE ≥ Vdd – 0.2V tsdr Data Retention Setup Time See Data Retention Waveform trdr Recovery Time See Data Retention Waveform Note 1: Typical values are measured at Vdd = 3.0V, Ta = 25 C and not 100% tested. Options Com. Ind. Min. 2.0 — — 0 trc Typ.(1) — 5 — — — Max. 3.6 10 15 — — Unit V mA ns ns o DATA RETENTION WAVEFORM (CE Controlled) tSDR Data Retention Mode tRDR VDD 1.65V 1.4V VDR CE GND CE ≥ VDD - 0.2V Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 12/15/2011 11 IS61LV25616AL ORDERING INFORMATION Commercial Range: 0°C to +70°C Speed (ns) 10 12 Order Part No. IS61LV25616AL-10T IS61LV25616AL-10TL IS61LV25616AL-10K IS61LV25616AL-12T Package TSOP (Type II) TSOP (Type II), Lead-free 400-mil SOJ TSOP (Type II) Industrial Range: –40°C to +85°C Speed (ns) 10 12 12 Order Part No. IS61LV25616AL-10TI IS61LV25616AL-10TLI IS61LV25616AL-10KI IS61LV25616AL-10KLI IS61LV25616AL-10LQI IS61LV25616AL-10LQLI IS61LV25616AL-10BI IS61LV25616AL-10BLI IS61LV25616AL-12TI Package TSOP (Type II) TSOP (Type II), Lead-free 400-mil SOJ 400-mil SOJ, Lead-free LQFP LQFP, Lead-free Mini BGA (8mm x 10mm) Mini BGA (8mm x 10mm), Lead-free TSOP (Type II) Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 12/15/2011 IS61LV25616AL Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 12/15/2011 13 14 SEATING PLANE 4. Formed leads shall be planar with respect to one another within 0.1mm at the seating plane after final test. 5. Reference document : JEDEC SPEC MS-027. 3. Dimension b2 does not include dambar protrusion/intrusion. 2. Dimension D and E1 do not include mold protrusion . 1. Controlling dimension : mm NOTE : 12/21/2007 IS61LV25616AL Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 12/15/2011 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 12/15/2011 Θ Package Outline 06/04/2008 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION/INTRUSION. 2. DIMENSION D AND E1 DO NOT INCLUDE MOLD PROTRUSION. 1. CONTROLLING DIMENSION : MM NOTE : Θ IS61LV25616AL 15 16 08/12/2008 Package Outline 2. Reference document : JEDEC MO-207 1. Controlling dimension : mm NOTE : IS61LV25616AL Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 12/15/2011