IS61WV102416FBLL-8TLI-TR

IS61WV102416FALL IS61/64WV102416FBLL 1Mx16 HIGH-SPEED ASYNCHRONOUS CMOS STATIC RAM WITH 3.3V/1.8V SUPPLY FEATURES  High-speed access time: 8ns, 10ns, 20ns  High- performance, low power CMOS process  Multiple center power and ground pins for greater noise immunity  TTL compatible inputs and outputs  Single power supply – 1.65V-2.2V VDD (IS61WV102416FALL) – 2.4V-3.6V VDD (IS61/64WV102416FBLL)  Packages available : - 48 ball mini BGA (6mm x 8mm) - 48 pin TSOP (Type I) - 54 pin TSOP (Type II)  Industrial and Automotive temperature support Lead-free available Data Control for upper and lower bytes   DESCRIPTION AUGUST 2019 The ISSI IS61/64WV102416FALL/BLL are high-speed, 16M bit static RAMs organized as 1024K words by 16 bits. It is fabricated using ISSI's high-performance CMOS technology. This highly reliable process coupled with innovative circuit design techniques, yields high-performance and low power consumption devices. When CS# is HIGH (deselected), the device assumes a standby mode at which the power dissipation can be reduced down with CMOS input levels. Easy memory expansion is provided by using Chip Enable and Output Enable inputs. The active LOW Write Enable (WE#) controls both writing and reading of the memory. A data byte allows Upper Byte (UB#) and Lower Byte (LB#) access. The devices are packaged in the JEDEC standard 48-Pin TSOP (TYPE I), 48-pin mini BGA (6mm x 8mm), and 54-Pin TSOP (TYPE II) . FUNCTIONAL BLOCK DIAGRAM A0 – A19 DECODER 1024K x 16 MEMORY ARRAY VDD GND I/O0 – I/O7 I/O8 – I/O15 CS# or CS1#/CS2 OE# WE# UB# LB# I/O DATA CIRCUIT COLUMN I/O CONTROL CIRCUIT Copyright © 2019 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances Integrated Silicon Solution, Inc.- www.issi.com Rev. A1 08/07/2019 1 IS61WV102416FALL IS61/64WV102416FBLL 48-Pin mini BGA, 1 Chip Select, A19 on G2 (B), 48-Pin mini BGA, 2 Chip Select, A19 on G2 (B2) 1 2 3 4 5 6 LB# OE# A0 A1 A2 CS2 B I/O8 UB# A3 A4 CS1# I/O0 I/O2 C I/O9 I/O10 A5 A6 I/O1 I/O2 I/O3 VDD D VSS I/O11 A17 A7 I/O3 VDD A16 I/O4 VSS E VDD I/O12 NC A16 I/O4 VSS A14 A15 I/O5 I/O6 F I/O14 I/O13 A14 A15 I/O5 I/O6 A19 A12 A13 WE# I/O7 G I/O15 A19 A12 A13 WE# I/O7 A8 A9 A10 A11 NC H A18 A8 A9 A10 A11 NC 1 2 3 4 5 6 LB# OE# A0 A1 A2 NC B I/O8 UB# A3 A4 CS# I/O0 C I/O9 I/O10 A5 A6 I/O1 D VSS I/O11 A17 A7 E VDD I/O12 NC F I/O14 I/O13 G I/O15 H A18 A A 48-Pin mini BGA, 1 Chip Select, A19 on H6 (B3), 48-Pin mini BGA, 2 Chip Select,A19 on H6 (B4) 1 2 3 4 5 6 LB# OE# A0 A1 A2 CS2 B I/O8 UB# A3 A4 CS1# I/O0 I/O2 C I/O9 I/O10 A5 A6 I/O1 I/O2 I/O3 VDD D VSS I/O11 A17 A7 I/O3 VDD A16 I/O4 VSS E VDD I/O12 NC A16 I/O4 VSS A14 A15 I/O5 I/O6 F I/O14 I/O13 A14 A15 I/O5 I/O6 NC A12 A13 WE# I/O7 G I/O15 NC A12 A13 WE# I/O7 A8 A9 A10 A11 A19 H A18 A8 A9 A10 A11 A19 1 2 3 4 5 6 LB# OE# A0 A1 A2 NC B I/O8 UB# A3 A4 CS# I/O0 C I/O9 I/O10 A5 A6 I/O1 D VSS I/O11 A17 A7 E VDD I/O12 NC F I/O14 I/O13 G I/O15 H A18 A Integrated Silicon Solution, Inc.- www.issi.com Rev. A1 08/07/2019 A 2 IS61WV102416FALL IS61/64WV102416FBLL 54-Pin TSOP (II) 48-Pin TSOP (I) I/O12 1 54 I/O11 VDD 53 VSS I/O13 2 3 52 I/O14 4 51 I/O10 I/O9 VSS 5 50 I/O15 6 A4 A3 A2 A1 A4 1 48 A5 2 3 47 A6 VDD A3 A2 46 49 I/O8 A1 4 45 A7 A8 7 48 A5 A0 5 8 47 A6 NC 6 44 43 9 46 A7 7 42 UB# LB# 45 A8 8 41 I/O15 A0 10 11 CS# I/O0 A9 40 I/O14 12 NC I/O1 I/O2 9 UB# 44 43 39 CS1# 42 OE# I/O3 I/O13 I/O12 VDD 13 14 10 11 41 VSS VDD 12 WE# 15 40 NC VDD 16 39 LB# 13 14 36 CS2 VSS I/O4 35 I/O11 A19 17 38 A10 I/O5 15 34 I/O10 A18 18 37 A11 I/O6 16 33 I/O9 A17 19 36 A12 I/O7 17 32 I/O8 A16 20 35 A13 WE# 18 31 NC A15 I/O0 21 34 A14 19 30 A9 22 I/O7 20 29 A10 VDD 23 33 32 NC A19 21 28 A11 I/O1 24 31 I/O6 A18 A17 22 A12 I/O2 25 I/O5 A16 23 VSS 26 30 29 27 26 VDD A15 24 25 A14 I/O3 27 28 I/O4 VSS 38 37 OE# VSS A13 Pin Descriptions A0-A19 Address Inputs I/O0-I/O15 CS# or CS1#/CS2 OE# WE# LB# Data Inputs/Outputs Chip Enable Input(s) UB# NC VDD VSS Output Enable Input Write Enable Input Lower-byte Control (I/O0-I/O7) Upper-byte Control (I/O8-I/O15) No Connection Power Ground Integrated Silicon Solution, Inc.- www.issi.com Rev. A1 08/07/2019 3 IS61WV102416FALL IS61/64WV102416FBLL FUNCTION DESCRIPTION SRAM is one of random access memories. Each byte or word has an address and can be accessed randomly. SRAM has three different modes supported. Each function is described below with Truth Table. STANDBY MODE Device enters standby mode when deselected (CS# HIGH). The input and output pins (I/O0-15) are placed in a high impedance state. CMOS input in this mode will maximize saving power. WRITE MODE Write operation issues with Chip selected (CS#) and Write Enable (WE#) input LOW. The input and output pins (I/O015) are in data input mode. Output buffers are closed during this time even if OE# is LOW. UB# and LB# enables a byte write feature. By enabling LB# LOW, data from I/O pins (I/O0 through I/O7) are written into the location specified on the address pins. And with UB# being LOW, data from I/O pins (I/O8 through I/O15) are written into the location. READ MODE Read operation issues with Chip selected (CS# LOW) and Write Enable (WE#) input HIGH. When OE# is LOW, output buffer turns on to make data output. Any input to I/O pins during READ mode is not permitted. UB# and LB# enables a byte read feature. By enabling LB# LOW, data from memory appears on I/O0-7. And with UB# being LOW, data from memory appears on I/O8-15. In the READ mode, output buffers can be turned off by pulling OE# HIGH. In this mode, internal device operates as READ but I/Os are in a high impedance state. Since device is in READ mode, active current is used. TRUTH TABLE Mode CS# WE# OE# LB# UB# I/O0-I/O7 I/O8-I/O15 VDD Current Not Selected H X X X X High-Z High-Z ISB1, ISB2 L H H L X High-Z High-Z L X X H H High-Z High-Z L H L L H DOUT High-Z L H L H L High-Z DOUT L H L L L DOUT DOUT L L X L H DIN High-Z L L X H L High-Z DIN L L X L L DIN DIN Output Disabled Read Write ICC,ICC1 ICC,ICC1 ICC,ICC1 Note: 1. CS# = H means CS1#=HIGH, and CS2= LOW in Dual Chip Select Device. Integrated Silicon Solution, Inc.- www.issi.com Rev. A1 08/07/2019 4 IS61WV102416FALL IS61/64WV102416FBLL POWER UP INITIALIZATION The device includes on-chip voltage sensor used to launch POWER-UP initialization process. When VDD reaches stable level, the device requires 150us of tPU (Power-Up Time) to complete its self-initialization process. When initialization is complete, the device is ready for normal operation. tPU 150 us Stable VDD VDD Device Initialization Device for Normal Operation 0V ABSOLUTE MAXIMUM RATINGS AND Operating Range ABSOLUTE MAXIMUM RATINGS (1) Symbol Vt erm Parameter Terminal Voltage with Respect to VSS Value –0.5 to VDD + 0.5V Unit V VDD V DD Related to VSS –0.3 to 4.0 V tStg Storage Temperature –65 to +150 PT Power Dissipation 1.0 C W Notes: 1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. PIN CAPACITANCE (1) Parameter Symbol Input capacitance DQ capacitance (IO0–IO15) CIN CI/O Test Condition TA = 25°C, f = 1 MHz, VDD = VDD(typ) Max Units 6 8 pF pF Note: 1. These parameters are guaranteed by design and tested by a sample basis only. OPERATING RANGE Range Industrial Automotive (A3) Ambient Temperature -40C to +85C -40C to +125C IS61WV102416FALL VDD (20ns) 1.65V – 2.2V – Integrated Silicon Solution, Inc.- www.issi.com Rev. A1 08/07/2019 IS61WV102416FBLL VDD (8, 10ns) 2.4V – 3.6V – IS64WV102416FBLL VDD (10ns) – 2.4V – 3.6V 5 IS61WV102416FALL IS61/64WV102416FBLL AC TEST CONDITIONS (OVER THE OPERATING RANGE) Parameter Input Pulse Level Unit (1.65V~2.2V) 0V to VDD Unit (2.4V~3.6V) 0V to VDD 1.5 ns ½ VDD 13500 10800 1.8V 1.5 ns ½ VDD 319 353 3.3V Input Rise and Fall Time Output Timing Reference Level R1 (ohm) R2 (ohm) VTM (V) Output Load Conditions Refer to Figure 1 and 2 AC TEST LOADS FIGURE 1 FIGURE 2 R1 VTM TM V Zo = 50 ohm Output 50 ohm VDD/2 30 pF, Including jig and scope Integrated Silicon Solution, Inc.- www.issi.com Rev. A1 08/07/2019 OUTPUT 5pF, Including jig and scope R2R2 6 IS61WV102416FALL IS61/64WV102416FBLL DC ELECTRICAL CHARACTERISTICS DC ELECTRICAL CHARACTERISTICS-I (OVER THE OPERATING RANGE) VDD = 1.65V – 2.2V Symbol Parameter VOH Output HIGH Voltage VOL Output LOW Voltage (1) VIH Input HIGH Voltage (1) VIL Input LOW Voltage ILI Input Leakage ILO Output Leakage Test Conditions I OH = -0.1 mA IOL = 0.1 mA GND < VIN < VDD GND < VIN < VDD, Output Disabled Min. 1.4 — 1.4 –0.2 –1 –1 Max. — 0.2 VDD + 0.2 0.4 1 1 Unit V V V V µA µA Notes: 1. VILL(min) = -1.0V AC (pulse width < 10ns). Not 100% tested. VIHH (max) = VDD + 1.0V AC (pulse width < 10ns). Not 100% tested. DC ELECTRICAL CHARACTERISTICS-I (OVER THE OPERATING RANGE) VDD = 2.4V – 3.6V Symbol Parameter VOH Output HIGH Voltage VOL Output LOW Voltage (1) VIH Input HIGH Voltage VIL(1) ILI ILO Input LOW Voltage 2.4V 2.7V 2.4V 2.7V 2.4V 2.7V 2.4V 2.7V ~ ~ ~ ~ ~ ~ ~ ~ 2.7V 3.6V 2.7V 3.6V 2.7V 3.6V 2.7V 3.6V Input Leakage Output Leakage Test Conditions V DD = Min., I OH = -1.0 mA V DD = Min., I OH = -4.0 mA V DD = Min., IOL = 2.0 mA V DD = Min., I OL = 8.0 mA VSS < VIN < VDD VSS < VIN < VDD, Output Disabled Min. 2.0 2.2 — — 2.0 2.0 –0.3 –0.3 –2 –2 Max. — 0.4 0.4 VDD + 0.3 0.6 0.8 2 2 Unit V V V V µA µA Notes: 1. VIL(min) = -0.3V DC ; VIL(min) = -2.0V AC (pulse width 2.0ns). Not 100% tested. VIH (max) = VDD + 0.3V DC ; VIH(max) = VDD + 2.0V AC (pulse width 2.0ns). Not 100% tested. Integrated Silicon Solution, Inc.- www.issi.com Rev. A1 08/07/2019 7 IS61WV102416FALL IS61/64WV102416FBLL POWER SUPPLY CHARACTERISTICS-II FOR POWER (1) (OVER THE OPERATING RANGE) Symbol Parameter ICC VDD Dynamic Operating Supply Current ICC1 Operating Supply Current ISB1 TTL Standby Current (TTL Inputs) ISB2 CMOS Standby Current (CMOS Inputs) Test Conditions VDD = MAX, IOU T = 0 mA, f = fMAX VDD = MAX, IOUT = 0 mA, f = 0 VDD = MAX, VIN = VIH or VIL CS# ≥ VIH , f = 0 VDD = MAX, CS# ≥ VDD - 0.2V VIN ≥ VDD - 0.2V , or VIN ≤ 0.2V , f =0 Notes: 1. 2. 3. Grade Com. Ind. Auto. Com. Ind. Auto. Com. Ind. Auto. Com. Ind. Auto. -8 Max. 90 100 80 90 40 50 30 -10 Max. 85 95 135 80 90 110 40 50 60 30 -20 Max 80 90 80 90 40 50 30 40 40 40 - 50 - Typ. (2) Unit mA mA mA mA 10 At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input line change. Typical values are measured at VDD = 3.0V/1.8V, TA = 25 °C and not 100% tested. CS#=H means CS1#=HIGH, and CS2=LOW in Dual Chip Select Device Integrated Silicon Solution, Inc.- www.issi.com Rev. A1 08/07/2019 8 IS61WV102416FALL IS61/64WV102416FBLL AC CHARACTERISTICS (OVER OPERATING RANGE) READ CYCLE AC CHARACTERISTICS Parameter Symbol Read Cycle Time Address Access Time Output Hold Time CS# Access Time OE# Access Time tRC tAA tOHA tACE tDOE OE# to High-Z Output OE# to Low-Z Output CS# to High-Z Output CS# to Low-Z Output UB#, LB# Access Time UB#, LB# to High-Z Output UB#, LB# to Low-Z Output Notes: 1. 2. 3. -8(1) -10(1) -20(1) unit notes Min Max Min Max Min Max 8 2.5 - 8 8 5.5 10 2.5 - 10 10 6 20 2.5 - 20 20 8 ns ns ns ns ns tHZOE tLZOE tHZCE tLZCE tBA tHZB 0 0 0 3 0 4 4 5.5 4 0 0 0 3 0 5 5 6 5 0 0 0 3 0 8 8 8 8 ns ns ns ns ns ns 2 2 2 2 tLZB 0 - 0 - 0 - ns 2 2 Test conditions assume signal transition times of 3 ns or less, timing reference levels of VDD/2, and output loading specified in Figure 1. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested. CS#=H means CS1#=HIGH, and CS2=LOW in Dual Chip Select Device Integrated Silicon Solution, Inc.- www.issi.com Rev. A1 08/07/2019 9 IS61WV102416FALL IS61/64WV102416FBLL AC WAVEFORMS READ CYCLE NO. 1(1) (Address Controlled, CS# = OE# = UB# = LB# = LOW, WE# = HIGH) tRC Address tAA tOHA tOHA DQ 0-15 Notes: 1. PREVIOUS DATA VALID DATA VALID The device is continuously selected. READ CYCLE NO. 2(1) (OE# CONTROLLED, WE# = HIGH) tRC ADDRESS tAA tOHA tDOE OE# tHZOE tLZOE CS# tACS tHZCS tLZCS UB#,LB# tHZB tBA tLZB DOUT Notes: 1. HIGH-Z LOW-Z DATA VALID Address is valid prior to or coincident with CS# LOW transition. Integrated Silicon Solution, Inc.- www.issi.com Rev. A1 08/07/2019 10 IS61WV102416FALL IS61/64WV102416FBLL WRITE CYCLE AC CHARACTERISTICS Parameter Symbol -8(1) Min Max Write Cycle Time tWC tSCS 8 6.5 tAW tPWB tHA tSA tPWE1 tPWE2 tSD tHD tHZWE tLZWE CS# to Write End Address Setup Time to Write End UB#,LB# to Write End Address Hold from Write End Address Setup Time WE# Pulse Width WE# Pulse Width (OE# = LOW) Data Setup to Write End Data Hold from Write End WE# LOW to High-Z Output WE# HIGH to Low-Z Output Notes: 1 2 3 4 5 -10(1) -20(1) unit Min Max Min Max - 10 8 - 20 12 - ns ns 6.5 6.5 0 0 6.5 8 - 8 8 0 0 8 10 - 12 12 0 0 12 17 - ns ns ns ns ns ns 5 0 2 3.5 - 6 0 2 4 - 9 0 3 9 - ns ns ns ns notes 2 Test conditions assume signal transition times of 3 ns or less, timing reference levels of VDD/2, and output loading specified in Figure 1. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested. The internal write time is defined by the overlap of CS# = LOW, UB# or LB# = LOW, and WE# = LOW. All signals must be in valid states to initiate a Write, but anyone can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the write. CS#=H means CS1#=HIGH, and CS2=LOW in Dual Chip Select Device If OE# is LOW during write cycle, (WE# controlled, CS# = UB# = LB# = LOW), the minimum Write cycle time for write cycle NO.3 is the sum of tHZWE and tSD Integrated Silicon Solution, Inc.- www.issi.com Rev. A1 08/07/2019 11 IS61WV102416FALL IS61/64WV102416FBLL AC WAVEFORMS WRITE CYCLE NO. 1(1) (CS# CONTROLLED, OE# = HIGH OR LOW) tWC ADDRESS tSA tSCS tHA CS# WE# tAW tPWE1 tPWE2 UB#,LB# tPBW tHZWE DOUT DATA UNDEFINED tLZWE HIGH-Z tSD DIN tHD DATA IN VALID Note: 1. tHZWE is is based on the assumption when tSA=0nS after READ operation. Actual DOUT for tHZWE may not appear if OE# goes high before Write Cycle. Integrated Silicon Solution, Inc.- www.issi.com Rev. A1 08/07/2019 12 IS61WV102416FALL IS61/64WV102416FBLL WRITE CYCLE NO. 2(1, 2) (WE# CONTROLLED: OE# IS HIGH DURING WRITE CYCLE) tWC ADDRESS tSCS tHA CS# tAW WE# tPWE tSA tPWB UB#,LB# OE# tHZOE DATA UNDEFINED DOUT HIGH-Z (1) tHD tSD DATA UNDEFINED DIN (2) DATA IN VALID Notes: 1. tHZOE is the time DOUT goes to High-Z after OE# goes high. 2. During this period, the I/Os are in output state. Do not apply input signals. WRITE CYCLE NO. 3(1) (WE# CONTROLLED: OE# IS LOW DURING WRITE CYCLE) tWC ADDRESS OE# = LOW CS#=LOW tHA tAW tPWE2 WE# tSA UB#,LB# tPWB tHZWE DOUT tLZWE HIGHZ DATA UNDEFINED tSD DIN Note: 1. tHD DATA IN VALID If OE# is low during write cycle, tHZWE must be met in the application. Do not apply input signal during this period. Data output from the previous READ operation will drive IO BUS. Integrated Silicon Solution, Inc.- www.issi.com Rev. A1 08/07/2019 13 IS61WV102416FALL IS61/64WV102416FBLL WRITE CYCLE NO. 4(1, 2, 3) (UB# & LB# Controlled, CS# = OE# = LOW) tWC tWC ADDRESS ADDRESS 1 ADDRESS 2 CS#=LOW OE#=LOW tSA tHA tSA tHA WE# tPWB UB#, LB# tPWB WORD 1 WORD 2 tHZWE DOUT tLZWE HIGH-Z DATA UNDEFINED tHD tSD DIN Notes: 1. 2. 3. DATA IN VALID DATA IN VALID If OE# is low during write cycle, tHZWE must be met in the application. Do not apply input signal during this period. Data output from the previous READ operation will drive IO BUS. Due to the restriction of note1, OE# is recommended to be HIGH during write period. WE# stays LOW in this example. If WE# toggles,, tPWE and tHZWE must be considered Integrated Silicon Solution, Inc.- www.issi.com Rev. A1 08/07/2019 14 IS61WV102416FALL IS61/64WV102416FBLL DATA RETENTION CHARACTERISTICS Symbol Parameter VDR VDD for Data Retention Data Retention Current IDR Test Condition OPTION Min. VDD = 2.4V to 3.6V 2.0 Typ.(2) Max. Unit 3.6 See Data Retention Waveform V VDD = 1.65V to 2.2V 1.2 Com. - 10 30 Ind. - - 40 Auto - - 50 VDD= VDR(min), CS# ≥ VDD – 0.2V 3.6 mA tSDR Data Retention Setup Time See Data Retention Waveform 0 - - ns tRDR Recovery Time See Data Retention Waveform tRC - - ns Note: 1. 2. 3. If CS# > VDD–0.2V, all other inputs including UB# and LB# must meet this condition. CS#=H means CS1#=HIGH, and CS2=LOW in Dual Chip Select Device Typical values are measured at VDD = VDR (Min), TA = 25 °C and not 100% tested. DATA RETENTION WAVEFORM (CS# CONTROLLED) tSDR Data Retention Mode tRDR VDD VDR CS# CS# > VDD – 0.2V GND Integrated Silicon Solution, Inc.- www.issi.com Rev. A1 08/07/2019 15 IS61WV102416FALL IS61/64WV102416FBLL ORDERING INFORMATION Industrial Range: -40°C to +85°C, Voltage Range: 1.65V to 2.2V Speed (ns) Order Part No. Package 20 IS61WV102416FALL-20BLI mini BGA (6mm x 8mm), Single Chip Select, Lead-free 20 IS61WV102416FALL-20B2LI mini BGA (6mm x 8mm), Dual Chip Select, Lead-free 20 IS61WV102416FALL-20B3LI mini BGA (6mm x 8mm), Single Chip Select, Lead-free 20 IS61WV102416FALL-20B4LI mini BGA (6mm x 8mm), Dual Chip Select, Lead-free 20 IS61WV102416FALL-20TLI 48-pin TSOP (Type I), Lead-free 20 IS61WV102416FALL-20T2LI 54-pin TSOP (Type II), Lead-free Industrial Range: -40°C to +85°C, Voltage Range: 2.4V to 3.6V Speed (ns) Order Part No. Package 8 IS61WV102416FBLL-8BI mini BGA (6mm x 8mm), Single Chip Select 8 IS61WV102416FBLL-8BLI mini BGA (6mm x 8mm), Single Chip Select, Lead-free 8 IS61WV102416FBLL-8B2I mini BGA (6mm x 8mm), Dual Chip Select 8 IS61WV102416FBLL-8B2LI mini BGA (6mm x 8mm), Dual Chip Select, Lead-free 8 IS61WV102416FBLL-8B3LI mini BGA (6mm x 8mm), Single Chip Select, Lead-free 8 IS61WV102416FBLL-8B4LI mini BGA (6mm x 8mm), Dual Chip Select, Lead-free 8 IS61WV102416FBLL-8TLI 48-pin TSOP (Type I), Lead-free 8 IS61WV102416FBLL-8T2LI 54-pin TSOP (Type II), Lead-free 10 IS61WV102416FBLL-10BI mini BGA (6mm x 8mm), Single Chip Select 10 IS61WV102416FBLL-10BLI mini BGA (6mm x 8mm), Single Chip Select, Lead-free 10 IS61WV102416FBLL-10B2I mini BGA (6mm x 8mm), Dual Chip Select 10 IS61WV102416FBLL-10B2LI mini BGA (6mm x 8mm), Dual Chip Select, Lead-free 10 IS61WV102416FBLL-10B3LI mini BGA (6mm x 8mm), Single Chip Select, Lead-free 10 IS61WV102416FBLL-10B4LI mini BGA (6mm x 8mm), Dual Chip Select, Lead-free 10 IS61WV102416FBLL-10TLI 48-pin TSOP (Type I), Lead-free 10 IS61WV102416FBLL-10T2LI 54-pin TSOP (Type II), Lead-free Automotive (A3) Range: –40°C to +125°C, Voltage Range: 2.4V to 3.6V Speed (ns) Order Part No. Package 10 IS64WV102416FBLL-10BA3 mini BGA (6mm x 8mm), Single Chip Select 10 IS64WV102416FBLL-10BLA3 mini BGA (6mm x 8mm), Single Chip Select, Lead-free 10 IS64WV102416FBLL-10B2A3 mini BGA (6mm x 8mm), Dual Chip Select 10 IS64WV102416FBLL-10B2LA3 mini BGA (6mm x 8mm), Dual Chip Select, Lead-free 10 IS64WV102416FBLL-10B3LA3 mini BGA (6mm x 8mm), Single Chip Select, Lead-free 10 IS64WV102416FBLL-10B4LA3 mini BGA (6mm x 8mm), Dual Chip Select, Lead-free 10 IS64WV102416FBLL-10CTLA3 48-pin TSOP (Type I), Copper Leadframe, Lead-free 10 IS64WV102416FBLL-10CT2LA3 54-pin TSOP (Type II), Copper Leadframe, Lead-free Integrated Silicon Solution, Inc.- www.issi.com Rev. A1 08/07/2019 16 IS61WV102416FALL IS61/64WV102416FBLL PACKAGE INFORMATION Integrated Silicon Solution, Inc.- www.issi.com Rev. A1 08/07/2019 17 IS61WV102416FALL IS61/64WV102416FBLL Integrated Silicon Solution, Inc.- www.issi.com Rev. A1 08/07/2019 18 IS61WV102416FALL IS61/64WV102416FBLL Integrated Silicon Solution, Inc.- www.issi.com Rev. A1 08/07/2019 19