IS61WV12816BLL-12TI

IS61WV12816BLL IS64WV12816BLL 128K x 16 HIGH-SPEED CMOS STATIC RAM ISSI FEBRUARY 2006 ® FEATURES • High-speed access time: 12 ns: 3.3V + 10% 15 ns: 2.5V-3.6V • Operating Current: 25mA (typ.) • Stand by Current: 400µA(typ.) • TTL and CMOS compatible interface levels • Fully static operation: no clock or refresh required • Three state outputs • Data control for upper and lower bytes • Industrial and Automotive temperatures available • Lead-free available DESCRIPTION The ISSI IS61WV12816BLL and IS64WV12816BLL are high-speed, 2,097,152-bit static RAM organized as 131,072 words by 16 bits. They are fabricated using ISSI's highperformance CMOS technology. This highly reliable process coupled with innovative circuit design techniques, yields access times as fast as 12 ns with low power consumption. When CE is HIGH (deselected), the device assumes a standby mode at which the power dissipation can be reduced down with CMOS input levels. Easy memory expansion is provided by using Chip Enable and Output Enable inputs, CE and OE. The active LOW Write Enable (WE) controls both writing and reading of the memory. A data byte allows Upper Byte (UB) and Lower Byte (LB) access. The IS61WV12816BLL and IS64WV12816BLL are packaged in the JEDEC standard 44-pin TSOP (Type II) and 48-pin mini BGA (6mm x 8mm). FUNCTIONAL BLOCK DIAGRAM A0-A16 DECODER 128Kx16 MEMORY ARRAY VDD GND I/O0-I/O7 Lower Byte I/O8-I/O15 Upper Byte I/O DATA CIRCUIT COLUMN I/O CE OE WE UB LB CONTROL CIRCUIT Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. C 02/03/06 1 IS61WV12816BLL IS64WV12816BLL TRUTH TABLE Mode Not Selected Output Disabled Read WE X H X H H H L L L CE H L L L L L L L L OE X H X L L L X X X LB X X H L H L L H L UB X X H H L L H L L I/O PIN I/O0-I/O7 I/O8-I/O15 High-Z High-Z High-Z DOUT High-Z DOUT DIN High-Z DIN High-Z High-Z High-Z High-Z DOUT DOUT High-Z DIN DIN ISSI VDD Current ISB1, ISB2 ICC ICC ® Write ICC PIN CONFIGURATION 44-Pin TSOP (Type II) (T) PIN DESCRIPTIONS A0-A16 Address Inputs Data Inputs/Outputs Chip Enable Input Output Enable Input Write Enable Input Lower-byte Control (I/O0-I/O7) Upper-byte Control (I/O8-I/O15) No Connection Power Ground I/O0-I/O15 CE OE WE LB UB NC VDD GND A4 A3 A2 A1 A0 CE I/O0 I/O1 I/O2 I/O3 VDD GND I/O4 I/O5 I/O6 I/O7 WE A16 A15 A14 A13 A12 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 A5 A6 A7 OE UB LB I/O15 I/O14 I/O13 I/O12 GND VDD I/O11 I/O10 I/O9 I/O8 NC A8 A9 A10 A11 NC 2 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. C 02/03/06 IS61WV12816BLL IS64WV12816BLL PIN CONFIGURATION 48-Pin mini BGA (B) 1 2 3 4 5 6 ISSI PIN DESCRIPTIONS A0-A16 I/O0-I/O15 CE Address Inputs Data Inputs/Outputs Chip Enable Input Output Enable Input Write Enable Input Lower-byte Control (I/O0-I/O7) Upper-byte Control (I/O8-I/O15) No Connection Power Ground ® A B C D E F G H LB I/O8 I/O9 GND VDD I/O14 I/O15 NC OE UB I/O10 I/O11 I/O12 I/O13 NC A8 A0 A3 A5 NC NC A14 A12 A9 A1 A4 A6 A7 A16 A15 A13 A10 A2 CE I/O1 I/O3 I/O4 I/O5 WE A11 NC I/O0 I/O2 VDD GND I/O6 I/O7 NC OE WE LB UB NC VDD GND Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. C 02/03/06 3 IS61WV12816BLL IS64WV12816BLL ABSOLUTE MAXIMUM RATINGS(1) Symbol VDD VTERM TSTG PT Note: Parameter Power Supply Voltage Relative to GND Terminal Voltage with Respect to GND Storage Temperature Power Dissipation Value –0.5 to 4.0V –0.5 to VDD + 0.5 –65 to + 150 1.0 Unit V V °C W ISSI ® 1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. OPERATING RANGE (VDD) Range Industrial Automotive Ambient Temperature –40°C to +85°C –40°C to +125°C VDD (15 nS) 2.5V-3.6V 2.5V-3.6V VDD (12 nS) 3.3V + 10% DC ELECTRICAL CHARACTERISTICS (Over Operating Range) VDD = 2.5V-3.6V Symbol VOH VOL VIH VIL ILI ILO Note: 1. VIL (min.) = –0.3V DC; VIL (min.) = –2.0V AC (pulse width - 2.0 ns). Not 100% tested. VIH (max.) = VDD + 0.3V DC; VIH (max.) = VDD + 2.0V AC (pulse width - 2.0 ns). Not 100% tested. Parameter Output HIGH Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage(1) Input Leakage Output Leakage Test Conditions VDD = Min., IOH = –1.0 mA VDD = Min., IOL = 1.0 mA Min. 1.8 — 2.0 –0.3 Max. — 0.4 VDD + 0.3 0.4 1 1 Unit V V V V µA µA GND ≤ VIN ≤ VDD GND ≤ VOUT ≤ VDD, Outputs Disabled –1 –1 DC ELECTRICAL CHARACTERISTICS (Over Operating Range) VDD = 3.3V + 10% Symbol VOH VOL VIH VIL ILI ILO Note: 1. VIL (min.) = –0.3V DC; VIL (min.) = –2.0V AC (pulse width - 2.0 ns). Not 100% tested. VIH (max.) = VDD + 0.3V DC; VIH (max.) = VDD + 2.0V AC (pulse width - 2.0 ns). Not 100% tested. Parameter Output HIGH Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage(1) Input Leakage Output Leakage Test Conditions VDD = Min., IOH = –4.0 mA VDD = Min., IOL = 8.0 mA Min. 2.4 — 2 –0.3 Max. — 0.4 VDD + 0.3 0.8 1 1 Unit V V V V µA µA GND ≤ VIN ≤ VDD GND ≤ VOUT ≤ VDD, Outputs Disabled –1 –1 4 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. C 02/03/06 IS61WV12816BLL IS64WV12816BLL POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range) Symbol ICC Parameter VDD Operating Supply Current Test Conditions VDD = Max., CE = VIL IOUT = 0 mA, f = Max. Com. Ind. Auto typ.(2) Com. Ind. Auto Com. Ind. Auto typ.(2) -12ns Min. Max. — — — — — — — — 35 40 25 20 20 750 900 400 ISSI -15 ns Min. Max. — — — — — — — — — — — 30 35 40 20 20 20 30 750 900 6 400 Unit mA ® ISB1 TTL Standby Current (TTL Inputs) CMOS Standby Current (CMOS Inputs) VDD = Max., VIN = VIH or VIL CE ≥ VIH, f = max VDD = Max., CE ≥ VDD – 0.2V, VIN ≥ VDD – 0.2V, or VIN ≤ 0.2V, f = 0 mA ISB2 μA μA mA μA Note: 1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change. 2. Typical values are measured at VDD=3.3V, TA=250C. Not 100% tested. CAPACITANCE(1) Symbol CIN COUT Note: 1. Tested initially and after any design or process changes that may affect these parameters. Parameter Input Capacitance Input/Output Capacitance Conditions VIN = 0V VOUT = 0V Max. 6 8 Unit pF pF Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. C 02/03/06 5 IS61WV12816BLL IS64WV12816BLL AC TEST CONDITIONS Parameter Input Pulse Level Input Rise and Fall Times Input and Output Timing and Reference Level (VRef) Output Load Unit (2.5V-3.6V) 0.4V to VDD-0.3V 1.5ns VDD/2 See Figures 1 and 2 Unit (3.3V + 10%) 0.4V to VDD-0.3V 1.5ns VDD/2 + 0.05 See Figures 1 and 2 ISSI ® AC TEST LOADS 319 Ω ZO = 50Ω OUTPUT 50Ω 1.5V 30 pF Including jig and scope 3.3V OUTPUT 5 pF Including jig and scope 353 Ω Figure 1. Figure 2. READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range) Symbol Parameter Read Cycle Time Address Access Time Output Hold Time CE Access Time OE Access Time OE to High-Z Output OE to Low-Z Output CE to High-Z Output CE to Low-Z Output LB, UB Access Time (2) (2) (2) -12 ns Min. Max. 12 — 3 — — — 0 0 3 — 0 0 — 12 — 12 5 5 — 5 — 5 5 — -15 ns Min. Max. 15 — 3 — — — 0 0 3 — 0 0 — 15 — 15 7 6 — 6 — 7 6 — Unit ns ns ns ns ns ns ns ns ns ns ns ns tRC tAA tOHA tACE tDOE tHZOE(2) tLZOE tHZCE tBA tHZB tLZB (2) tLZCE(2) LB, UB to High-Z Output LB, UB to Low-Z Output Notes: 1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0V to 3.0V and output loading specified in Figure 1. 2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested. 6 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. C 02/03/06 IS61WV12816BLL IS64WV12816BLL AC WAVEFORMS READ CYCLE NO. 1(1,2) (Address Controlled) (CE = OE = VIL, UB or LB = VIL) t RC ADDRESS ISSI ® t AA t OHA DOUT PREVIOUS DATA VALID t OHA DATA VALID READ1.eps READ CYCLE NO. 2(1,3) t RC ADDRESS t AA OE t OHA t DOE CE t HZOE t LZOE t ACE t LZCE t HZCE LB, UB DOUT HIGH-Z t LZB t BA DATA VALID t HZB UB_CEDR2.eps 1. WE is HIGH for a Read Cycle. 2. The device is continuously selected. OE, CE, UB, or LB = VIL. 3. Address is valid prior to or coincident with CE LOW transition. Notes: Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. C 02/03/06 7 IS61WV12816BLL IS64WV12816BLL WRITE CYCLE SWITCHING CHARACTERISTICS(1,3) (Over Operating Range) Symbol Parameter Write Cycle Time CE to Write End Address Setup Time to Write End Address Hold from Write End Address Setup Time LB, UB Valid to End of Write WE Pulse Width (OE = HIGH) WE Pulse Width (OE = LOW) Data Setup to Write End Data Hold from Write End WE LOW to High-Z Output WE HIGH to Low-Z Output -12 ns Min. Max. 12 8 8 0 0 9 8 10 6 0 — 0 — — — — — — — — — — 5 — -15 ns Min. Max. 15 10 10 0 0 10 10 12 7 0 — 0 — — — — — — — — — — 7 — Unit ns ns ns ns ns ns ns ns ns ns ns ns ISSI ® tWC tSCE tAW tHA tSA tPBW tPWE1 tPWE2 tSD tHD tHZWE(3) tLZWE(3) Notes: 1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0V to 3.0V and output loading specified in Figure 1. 2. The internal write time is defined by the overlap of CE LOW and UB or LB, and WE LOW. All signals must be in valid states to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the write. 3. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested. 8 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. C 02/03/06 IS61WV12816BLL IS64WV12816BLL WRITE CYCLE NO. 1(1,2) (CE Controlled, OE = HIGH or LOW) t WC ADDRESS VALID ADDRESS ISSI ® t SA CE t SCE t HA WE t AW t PWE1 t PWE2 t PBW UB, LB t HZWE DOUT DATA UNDEFINED HIGH-Z t LZWE t SD DIN t HD DATAIN VALID UB_CEWR1.eps Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. C 02/03/06 9 IS61WV12816BLL IS64WV12816BLL WRITE CYCLE NO. 2(1) (WE Controlled, OE = HIGH during Write Cycle) t WC ADDRESS VALID ADDRESS ISSI ® t HA OE CE LOW t AW WE t PWE1 t PBW t SA UB, LB t HZWE DOUT DATA UNDEFINED HIGH-Z t LZWE t SD DIN t HD DATAIN VALID UB_CEWR2.eps WRITE CYCLE NO. 3 (WE Controlled: OE is LOW During Write Cycle) t WC ADDRESS OE CE VALID ADDRESS LOW t HA LOW t AW WE t PWE2 t PBW t SA UB, LB t HZWE DOUT DATA UNDEFINED HIGH-Z t LZWE t SD DIN t HD DATAIN VALID UB_CEWR3.eps 10 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. C 02/03/06 IS61WV12816BLL IS64WV12816BLL WRITE CYCLE NO. 4 (LB, UB Controlled, Back-to-Back Write) (1,3) t WC ADDRESS ADDRESS 1 ISSI t WC ADDRESS 2 ® OE t SA CE LOW WE t HA t SA t PBW t PBW WORD 2 t HA UB, LB WORD 1 t HZWE DOUT HIGH-Z t LZWE t HD DATAIN VALID DATA UNDEFINED t SD DIN t SD DATAIN VALID t HD UB_CEWR4.eps Notes: 1. The internal Write time is defined by the overlap of CE = LOW, UB and/or LB = LOW, and WE = LOW. All signals must be in valid states to initiate a Write, but any can be deasserted to terminate the Write. The tSA, tHA, tSD, and tHD timing is referenced to the rising or falling edge of the signal that terminates the Write. 2. Tested with OE HIGH for a minimum of 4 ns before WE = LOW to place the I/O in a HIGH-Z state. 3. WE may be held LOW across many address cycles and the LB, UB pins can be used to control the Write function. Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. C 02/03/06 11 IS61WV12816BLL IS64WV12816BLL DATA RETENTION SWITCHING CHARACTERISTICS Symbol Parameter VDD for Data Retention Data Retention Current Data Retention Setup Time Recovery Time Test Condition See Data Retention Waveform VDD = 2.0V, CE ≥ VDD – 0.2V See Data Retention Waveform See Data Retention Waveform O ISSI Options Ind. Auto Min. 1.8 — — 0 Typ.(1) — 0.4 0.4 — — Max. 3.6 0.9 6 — — Unit V mA mA ns ns ® VDR IDR tSDR tRDR tRC Note 1: Typical values are measured at VDD = 3.3V, TA = 25 C. Not 100% tested. DATA RETENTION WAVEFORM (CE Controlled) tSDR VDD Data Retention Mode tRDR VDR CE ≥ VDD - 0.2V CE GND 12 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. C 02/03/06 IS61WV12816BLL IS64WV12816BLL ORDERING INFORMATION: Industrial Range: –40°C to +85°C Speed (ns) 12 (15 ) 1 ISSI Package mini BGA (6mm x 8mm) mini BGA (6mm x 8mm), Lead-free Plastic TSOP (Type II) Plastic TSOP (Type II), Lead-free ® Order Part No. IS61WV12816BLL-12BI IS61WV12816BLL-12BLI IS61WV12816BLL-12TI IS61WV12816BLL-12TLI Note: 1. Speed = 12ns for VDD = 3.3V + 10%. Speed = 15ns for VDD = 2.5V-3.6V Automotive Range: –40°C to +125°C Speed (ns) 15 Order Part No. IS64WV12816BLL-15BA3 IS64WV12816BLL-15TA3 IS64WV12816BLL-15TLA3 Package mini BGA (6mm x 8mm) Plastic TSOP (Type II) Plastic TSOP (Type II), Lead-free Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. C 02/03/06 13 PACKAGING INFORMATION Mini Ball Grid Array Package Code: B (48-pin) Top View 1 2 3 4 56 6 ISSI Bottom View φ b (48x) ® 5 4 3 2 1 A B C D D E F G H D1 e A B C D E F G H e E E1 A2 SEATING PLANE A1 A Notes: 1. Controlling dimensions are in millimeters. mBGA - 6mm x 8mm MILLIMETERS Sym. N0. Leads A A1 A2 D D1 E E1 e b — 0.24 0.60 7.90 5.90 mBGA - 8mm x 10mm INCHES Min. Typ. Max. Sym. N0. Leads MILLIMETER Min. Typ. Max. 48 — 0.24 0.60 9.90 7.90 — — — — — 1.20 0.30 — 10.10 8.10 — INCHES Min. Typ. Max. Min. Typ. Max. 48 — — — — — 1.20 0.30 — 8.10 6.10 — 0.009 0.024 0.311 0.232 — — — — — 0.047 0.012 — 0.319 0.240 A A1 A2 D D1 E E1 e b — — — — — 0.047 0.012 — 0.398 0.319 0.009 0.024 0.390 0.311 5.25 BSC 3.75 BSC 0.75 BSC 0.30 0.35 0.40 0.207 BSC 0.148 BSC 0.030 BSC 0.012 0.014 0.016 5.25 BSC 3.75 BSC 0.75 BSC 0.30 0.35 0.40 0.207 BSC 0.148 BSC 0.030 BSC 0.012 0.014 0.016 Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. D 01/15/03 PACKAGING INFORMATION Plastic TSOP Package Code: T (Type II) ISSI Notes: 1. Controlling dimension: millimieters, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package. 4. Formed leads shall be planar with respect to one another within 0.004 inches at the seating plane. ® N N/2+1 E1 E 1 D N/2 SEATING PLANE ZD A . e b L A1 α C Symbol Ref. Std. No. Leads A A1 b C D E1 E e L ZD α Millimeters Min Max Inches Min Max Plastic TSOP (T - Type II) Millimeters Inches Min Max Min Max 44 — 1.20 — 0.047 0.05 0.15 0.002 0.006 0.30 0.45 0.012 0.018 0.12 0.21 0.005 0.008 18.31 18.52 0.721 0.729 10.03 10.29 0.395 0.405 11.56 11.96 0.455 0.471 0.80 BSC 0.032 BSC 0.41 0.60 0.016 0.024 0.81 REF 0.032 REF 0° 5° 0° 5° Millimeters Min Max 50 — 1.20 0.05 0.15 0.30 0.45 0.12 0.21 20.82 21.08 10.03 10.29 11.56 11.96 0.80 BSC 0.40 0.60 0.88 REF 0° 5° Inches Min Max (N) 32 — 1.20 — 0.047 0.05 0.15 0.002 0.006 0.30 0.52 0.012 0.020 0.12 0.21 0.005 0.008 20.82 21.08 0.820 0.830 10.03 10.29 0.391 0.400 11.56 11.96 0.451 0.466 1.27 BSC 0.050 BSC 0.40 0.60 0.016 0.024 0.95 REF 0.037 REF 0° 5° 0° 5° — 0.047 0.002 0.006 0.012 0.018 0.005 0.008 0.820 0.830 0.395 0.405 0.455 0.471 0.031 BSC 0.016 0.024 0.035 REF 0° 5° Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 06/18/03