IS62WV5128BLL-55BLI

IS62WV5128ALL IS62WV5128BLL 512K x 8 LOW VOLTAGE, ULTRA LOW POWER CMOS STATIC RAM JANUARY 2008 FEATURES DESCRIPTION • High-speed access time: 55ns, 70ns The ISSI IS62WV5128ALL / IS62WV5128BLL are highspeed, 4M bit static RAMs organized as 512K words by 8 bits. It is fabricated using ISSI's high-performance CMOS technology. This highly reliable process coupled with innovative circuit design techniques, yields highperformance and low power consumption devices. • CMOS low power operation 36 mW (typical) operating 9 µW (typical) CMOS standby When CS1 is HIGH (deselected) the device assumes a standby mode at which the power dissipation can be reduced down with CMOS input levels. • TTL compatible interface levels • Single power supply 1.65V – 2.2V VDD (IS62WV5128ALL) Easy memory expansion is provided by using Chip Enable and Output Enable inputs. The active LOW Write Enable (WE) controls both writing and reading of the memory. 2.5V – 3.6V VDD (IS62WV5128BLL) • Fully static operation: no clock or refresh required • Three state outputs • Industrial temperature available The IS62WV5128ALL and IS62WV5128BLL are packaged in the JEDEC standard 32-pin TSOP (TYPE I), 32-pin sTSOP (TYPE I), 32-pin TSOP (Type II), 32-pin SOP and 36-pin mini BGA. • Lead-free available FUNCTIONAL BLOCK DIAGRAM A0-A18 DECODER 512K x 8 MEMORY ARRAY VDD GND I/O DATA CIRCUIT I/O0-I/O7 CS1 OE COLUMN I/O CONTROL CIRCUIT WE Copyright © 2005 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. — www.issi.com Rev. E 01/29/08 1 IS62WV5128ALL, IS62WV5128BLL PIN DESCRIPTIONS A0-A18 Address Inputs CS1 Chip Enable 1 Input OE Output Enable Input WE Write Enable Input I/O0-I/O7 Input/Output NC No Connection VDD Power GND Ground 36-pin mini BGA (B) (6mm x 8mm) (Package Code B) 2 1 2 3 4 5 6 A A0 A1 NC A3 A6 A8 B I/O4 A2 WE A4 A7 I/O0 C I/O5 NC A5 D GND VDD E VDD GND F I/O6 G I/O7 H A9 I/O1 I/O2 A18 A17 OE CS1 A16 A15 I/O3 A10 A11 A12 A13 A14 Integrated Silicon Solution, Inc. — www.issi.com Rev. E 01/29/08 IS62WV5128ALL, IS62WV5128BLL PIN DESCRIPTIONS A0-A18 Address Inputs CS1 Chip Enable 1 Input OE Output Enable Input WE Write Enable Input I/O0-I/O7 Input/Output VDD Power GND Ground PIN CONFIGURATION 32-pin TSOP (TYPE I), (Package Code T) 32-pin sTSOP (TYPE I) (Package Code H) A11 A9 A8 A13 WE A18 A15 VDD A17 A16 A14 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CS1 I/O7 I/O6 I/O5 I/O4 I/O3 GND I/O2 I/O1 I/O0 A0 A1 A2 A3 Integrated Silicon Solution, Inc. — www.issi.com Rev. E 01/29/08 32-pin SOP (Package Code Q) 32-pin TSOP (TYPE II) (Package Code T2) A17 A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VDD A15 A18 WE A13 A8 A9 A11 OE A10 CS1 I/O7 I/O6 I/O5 I/O4 I/O3 3 IS62WV5128ALL, IS62WV5128BLL OPERATING RANGE (VDD) Range Ambient Temperature IS62WV5128ALL 0°C to +70°C –40°C to +85°C 1.65V - 2.2V 1.65V - 2.2V Commercial Industrial IS62WV5128BLL 2.5V - 3.6V 2.5V - 3.6V ABSOLUTE MAXIMUM RATINGS(1) Symbol VTERM VDD TSTG PT Parameter Terminal Voltage with Respect to GND VDD Related to GND Storage Temperature Power Dissipation Value –0.2 to VDD+0.3 –0.2 to VDD+0.3 –65 to +150 1.0 Unit V V °C W Note: 1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. DC ELECTRICAL CHARACTERISTICS (Over Operating Range) Symbol Parameter Test Conditions VDD Min. Max. Unit VOH Output HIGH Voltage IOH = -0.1 mA IOH = -1 mA 1.65-2.2V 2.5-3.6V 1.4 2.2 — — V V VOL Output LOW Voltage IOL = 0.1 mA IOL = 2.1 mA 1.65-2.2V 2.5-3.6V — — 0.2 0.4 V V VIH Input HIGH Voltage 1.65-2.2V 2.5-3.6V 1.4 2.2 VDD + 0.2 VDD + 0.3 V V VIL(1) Input LOW Voltage 1.65-2.2V 2.5-3.6V –0.2 –0.2 0.4 0.6 V V ILI Input Leakage GND ≤ VIN ≤ VDD –1 1 µA ILO Output Leakage GND ≤ VOUT ≤ VDD, Outputs Disabled –1 1 µA Notes: 1. VIL (min.) = –1.0V for pulse width less than 10 ns. 4 Integrated Silicon Solution, Inc. — www.issi.com Rev. E 01/29/08 IS62WV5128ALL, IS62WV5128BLL CAPACITANCE(1) Symbol Parameter CIN Input Capacitance COUT Input/Output Capacitance Conditions Max. Unit VIN = 0V 8 pF VOUT = 0V 10 pF Note: 1. Tested initially and after any design or process changes that may affect these parameters. AC TEST CONDITIONS Parameter Input Pulse Level Input Rise and Fall Times Input and Output Timing and Reference Level Output Load IS62WV5128ALL (Unit) 0.4V to VDD-0.2V 5 ns VREF IS62WV5128BLL (Unit) 0.4V to VDD-0.3V 5ns VREF See Figures 1 and 2 See Figures 1 and 2 IS62WV5128ALL 1.65 - 2.2V IS62WV5128BLL 2.5V - 3.6V R1(Ω) 3070 3070 R2(Ω) 3150 3150 VREF 0.9V 1.5V VTM 1.8V 2.8V AC TEST LOADS Figure 1 Integrated Silicon Solution, Inc. — www.issi.com Rev. E 01/29/08 Figure 2 5 IS62WV5128ALL, IS62WV5128BLL POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range) 62WV5128ALL (1.65V - 2.2V) Symbol Parameter Test Conditions ICC VDD Dynamic Operating Supply Current VDD = Max., IOUT = 0 mA, f = fMAX ICC1 Operating Supply Current ISB1 TTL Standby Current (TTL Inputs) VDD = Max., CS1 = 0.2V Com. WE = VDD-0.2V Ind. f=1MHZ VDD = Max., Com. VIN = VIH or VIL Ind. CS1 = VIH, f = 1 MHZ ISB2 CMOS Standby Current (CMOS Inputs) VDD = Max., CS1 ≥ VDD – 0.2V, VIN ≥ VDD – 0.2V, or VIN ≤ 0.2V, f = 0 Com. Ind. Com. Ind. Max. 70 ns 25 30 Unit 10 10 mA 0.35 0.35 mA 15 15 µA mA Note: 1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change. POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range) 62WV5128BLL (2.5V - 3.6V) Symbol Parameter Test Conditions ICC VDD Dynamic Operating Supply Current VDD = Max., IOUT = 0 mA, f = fMAX ICC1 Operating Supply Current ISB1 TTL Standby Current (TTL Inputs) VDD = Max., CS1 = 0.2V Com. WE = VDD-0.2V Ind. f=1MHZ VDD = Max., Com. VIN = VIH or VIL Ind. CS1 = VIH, f = 1 MHZ ISB2 CMOS Standby Current (CMOS Inputs) VDD = Max., CS1 ≥ VDD – 0.2V, VIN ≥ VDD – 0.2V, or VIN ≤ 0.2V, f = 0 Com. Ind. Com. Ind. Max. 55 ns 40 45 Unit 15 15 mA 0.35 0.35 mA 15 15 µA mA Note: 1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change. 6 Integrated Silicon Solution, Inc. — www.issi.com Rev. E 01/29/08 IS62WV5128ALL, IS62WV5128BLL READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range) Symbol Parameter 55 ns Min. Max. 70 ns Min. Max. Unit tRC Read Cycle Time 55 — 70 — ns tAA Address Access Time — 55 — 70 ns tOHA Output Hold Time 10 — 10 — ns tACS1 CS1 Access Time — 55 — 70 ns OE Access Time — 25 — 35 ns tHZOE OE to High-Z Output — 20 — 25 ns tLZOE(2) OE to Low-Z Output 5 — 5 — ns tHZCS1 CS1 to High-Z Output 0 20 0 25 ns tLZCS1 CS1 to Low-Z Output 10 — 10 — ns tDOE (2) Notes: 1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 0.9V/1.5V, input pulse levels of 0.4 to VDD-0.2V/VDD-0.3V and output loading specified in Figure 1. 2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested. AC WAVEFORMS READ CYCLE NO. 1(1,2) (Address Controlled) (CS1 = OE = VIL, WE = VIH) tRC ADDRESS tAA tOHA DOUT PREVIOUS DATA VALID Integrated Silicon Solution, Inc. — www.issi.com Rev. E 01/29/08 tOHA DATA VALID 7 IS62WV5128ALL, IS62WV5128BLL AC WAVEFORMS READ CYCLE NO. 2(1,3) (CS1, OE Controlled) tRC ADDRESS tAA tOHA OE tDOE CS1 tHZOE tLZOE tACS1 tLZCS1 DOUT HIGH-Z tHZCS DATA VALID Notes: 1. WE is HIGH for a Read Cycle. 2. The device is continuously selected. OE, CS1= VIL. WE=VIH. 3. Address is valid prior to or coincident with CS1 LOW transition. 8 Integrated Silicon Solution, Inc. — www.issi.com Rev. E 01/29/08 IS62WV5128ALL, IS62WV5128BLL WRITE CYCLE SWITCHING CHARACTERISTICS(1,2) (Over Operating Range) Symbol 55 ns Min. Max. Parameter 70 ns Min. Max. Unit tWC Write Cycle Time 55 — 70 — ns tSCS1 tAW CS1 to Write End 45 — 60 — ns Address Setup Time to Write End 45 — 60 — ns tHA tSA Address Hold from Write End 0 — 0 — ns Address Setup Time 0 — 0 — ns tPWE tSD WE Pulse Width 40 — 50 — ns Data Setup to Write End 25 — 30 — ns tHD tHZWE(3) Data Hold from Write End 0 — 0 — ns WE LOW to High-Z Output — 20 — 20 ns tLZWE(3) WE HIGH to Low-Z Output 5 — 5 — ns Notes: 1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 0.9V/1.5V, input pulse levels of 0.4V to VDD-0.2V/VDD-0.3V and output loading specified in Figure 1. 2. The internal write time is defined by the overlap of CS1 LOW and WE LOW. All signals must be in valid states to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the write. 3. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested. AC WAVEFORMS WRITE CYCLE NO. 1 (CS1 Controlled, OE = HIGH or LOW) tWC ADDRESS tHA tSCS1 CS1 tAW tPWE WE tSA DOUT tHZWE DATA UNDEFINED tLZWE HIGH-Z tSD DIN Integrated Silicon Solution, Inc. — www.issi.com Rev. E 01/29/08 tHD DATA-IN VALID 9 IS62WV5128ALL, IS62WV5128BLL WRITE CYCLE NO. 2 (WE Controlled: OE is HIGH During Write Cycle) tWC ADDRESS OE tHA tSCS1 CS1 tAW tPWE WE tSA DOUT tHZWE tLZWE HIGH-Z DATA UNDEFINED tSD DIN tHD DATA-IN VALID WRITE CYCLE NO. 3 (WE Controlled: OE is LOW During Write Cycle) tWC ADDRESS OE tHA tSCS1 CS1 tAW tPWE WE tSA DOUT DATA UNDEFINED tHZWE tLZWE HIGH-Z tSD DIN 10 tHD DATA-IN VALID Integrated Silicon Solution, Inc. — www.issi.com Rev. E 01/29/08 IS62WV5128ALL, IS62WV5128BLL DATA RETENTION SWITCHING CHARACTERISTICS Symbol Parameter Test Condition Min. Max. Unit VDR VDD for Data Retention See Data Retention Waveform 1.2 3.6 V IDR Data Retention Current VDD = 1.2V, CS1 ≥ VDD – 0.2V — 15 µA tSDR Data Retention Setup Time See Data Retention Waveform 0 — ns tRDR Recovery Time See Data Retention Waveform tRC — ns DATA RETENTION WAVEFORM (CS1 CS1 Controlled) tSDR Data Retention Mode tRDR VDD VDR CS1 GND CS1 ≥ VDD Integrated Silicon Solution, Inc. — www.issi.com Rev. E 01/29/08 - 0.2V 11 IS62WV5128ALL, IS62WV5128BLL ORDERING INFORMATION IS62WV5128ALL (1.65V-2.2V) Industrial Range: –40°C to +85°C Speed (ns) Order Part No. Package 70 IS62WV5128ALL-70TI TSOP, TYPE I 70 IS62WV5128ALL-70T2I TSOP, TYPE II 70 IS62WV5128ALL-70HI sTSOP, TYPE I 70 IS62WV5128ALL-70BI mini BGA (6mmx8mm) ORDERING INFORMATION IS62WV5128BLL (2.5V - 3.6V) Commercial Range: 0°C to +70°C Speed (ns) 55 Order Part No. Package IS62WV5128BLL-55H sTSOP, TYPE I Industrial Range: –40°C to +85°C Speed (ns) 12 Order Part No. Package 55 IS62WV5128BLL-55TI TSOP, TYPE I 55 IS62WV5128BLL-55TLI TSOP, TYPE I, Lead-free 55 IS62WV5128BLL-55QLI SOP, Lead-free 55 IS62WV5128BLL-55T2I TSOP, TYPE II 55 IS62WV5128BLL-55T2LI TSOP, TYPE II, Lead-free 55 IS62WV5128BLL-55HI sTSOP, TYPE I 55 IS62WV5128BLL-55HLI sTSOP, TYPE I, Lead-free 55 IS62WV5128BLL-55BI mini BGA (6mmx8mm) 55 IS62WV5128BLL-55BLI mini BGA (6mmx8mm), Lead-free Integrated Silicon Solution, Inc. — www.issi.com Rev. E 01/29/08 PACKAGING INFORMATION Plastic TSOP Package Code: T (Type II) N N/2+1 E1 1 Notes: 1. Controlling dimension: millimieters, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package. 4. Formed leads shall be planar with respect to one another within 0.004 inches at the seating plane. E N/2 D SEATING PLANE A ZD . b e Symbol Ref. Std. No. Leads A A1 b C D E1 E e L ZD α Millimeters Min Max Inches Min Max (N) 32 — 1.20 — 0.047 0.05 0.15 0.002 0.006 0.30 0.52 0.012 0.020 0.12 0.21 0.005 0.008 20.82 21.08 0.820 0.830 10.03 10.29 0.391 0.400 11.56 11.96 0.451 0.466 1.27 BSC 0.050 BSC 0.40 0.60 0.016 0.024 0.95 REF 0.037 REF 0° 5° 0° 5° L α A1 Plastic TSOP (T - Type II) Millimeters Inches Min Max Min Max 44 — 1.20 — 0.047 0.05 0.15 0.002 0.006 0.30 0.45 0.012 0.018 0.12 0.21 0.005 0.008 18.31 18.52 0.721 0.729 10.03 10.29 0.395 0.405 11.56 11.96 0.455 0.471 0.80 BSC 0.032 BSC 0.41 0.60 0.016 0.024 0.81 REF 0.032 REF 0° 5° 0° 5° Millimeters Min Max C Inches Min Max 50 — 1.20 0.05 0.15 0.30 0.45 0.12 0.21 20.82 21.08 10.03 10.29 11.56 11.96 0.80 BSC 0.40 0.60 0.88 REF 0° 5° — 0.047 0.002 0.006 0.012 0.018 0.005 0.008 0.820 0.830 0.395 0.405 0.455 0.471 0.031 BSC 0.016 0.024 0.035 REF 0° 5° Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. F 06/18/03 PACKAGING INFORMATION Plastic TSOP-Type I Package Code: T (32-pin) 1 E H N D SEATING PLANE A S MILLIMETERS Symbol No. Leads A A1 B C D E H e L α S Min. L B e A1 INCHES Max. Min. Max. 32 — 1.20 0.05 0.25 0.17 0.23 0.12 0.17 7.90 8.10 18.30 18.50 19.80 20.20 0.50 BSC 0.40 0.60 0° 8° 0.25 REF — 0.047 0.002 0.010 0.007 0.009 0.005 0.007 0.311 0.319 0.720 0.728 0.780 0.795 0.020 BSC 0.016 0.024 0° 8° 0.010 REF α C Notes: 1. Controlling dimension: millimeters, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package. 4. Formed leads shall be planar with respect to one another within 0.004 inches at the seating plane. Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. C 06/13/03 PACKAGING INFORMATION 450-mil Plastic SOP Package Code: Q (32-pin) N E1 E 1 D SEATING PLANE A S MILLIMETERS Symbol No. Leads A A1 B C D E E1 e L α S Min. L B e A1 INCHES Max. Min. Max. 32 — 3.00 0.10 — 0.36 0.51 0.15 0.30 20.14 20.75 13.87 14.38 11.18 11.43 1.27 BSC 0.58 0.99 0° 10° — 0.86 — 0.118 0.004 — 0.014 0.020 0.006 0.012 0.793 0.817 0.546 0.566 0.440 0.450 0.050 BSC 0.023 0.039 0° 10° — 0.034 α C Notes: 1. Controlling dimension: inches, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package. 4. Formed leads shall be planar with respect to one another within 0.004 inches at the seating plane. Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. C 06/13/03 PACKAGING INFORMATION Plastic STSOP - 32 pins Package Code: H (Type I) A2 A A1 1 N E b e D1 S SEATING PLANE D L Plastic STSOP (H - Type I) Millimeters Inches Symbol Min Max Min Max Ref. Std. N 32 A — 1.25 — 0.049 A1 0.05 — 0.002 — A2 0.95 1.05 0.037 0.041 b 0.17 0.23 0.007 0.009 C 0.14 0.16 0.0055 0.0063 D 13.20 13.60 0.520 0.535 D1 11.70 11.90 0.461 0.469 E 7.90 8.10 0.311 0.319 e 0.50 BSC 0.020 BSC L 0.30 0.70 0.012 0.028 S 0.28 Typ. 0.011 Typ. α 0° 5° 0° 5° Integrated Silicon Solution, Inc. PK13197H32 Rev. B 04/21/03 α C Notes: 1. Controlling dimension: millimeters, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D1 and E do not include mold flash protrusions and should be measured from the bottom of the package. 4. Formed leads shall be planar with respect to one another within 0.004 inches at the seating plane. PACKAGING INFORMATION Mini Ball Grid Array Package Code: B (36-pin) Top View Bottom View φ b (36x) 1 2 3 4 5 6 6 A 4 3 2 1 A e B B C C D D D 5 D1 E E F F G G H H e E E1 Notes: 1. Controlling dimensions are in millimeters. A2 A A1 SEATING PLANE mBGA - 6mm x 8mm mBGA - 8mm x 10mm MILLIMETERS INCHES MILLIMETER INCHES Sym. Min. Typ. Max. Min. Typ. Max. Sym. Min. Typ. Max. Min. Typ. Max. N0. Leads 36 36 N0. Leads 36 36 A — — 1.20 — — 0.047 A — — 1.20 — — 0.047 A1 0.24 — 0.30 0.009 — 0.012 A1 0.24 — 0.30 0.009 — 0.012 A2 0.60 — — 0.024 — — A2 0.60 — — 0.024 — — D 7.90 8.00 8.10 D 9.90 10.00 10.10 D1 E 5.25BSC 5.90 6.00 0.311 0.315 0.319 0.207BSC 6.10 D1 0.232 0.236 0.240 E 5.25BSC 7.90 0.390 0.394 0.398 .207BSC 8.00 8.10 0.311 0.315 0.319 E1 3.75BSC 0.148BSC E1 3.75BSC 0.148BSC e 0.75BSC 0.030BSC e 0.75BSC 0.030BSC 0.012 0.014 0.016 b b 0.30 0.35 0.40 0.30 0.35 0.40 0.012 0.014 0.016 Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. E 01/15/03