CPC1125NTR

CPC1125N 400V, 100mArms/mADC Single-Pole Normally Closed Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Current to Operate Rating 400 100 35 2 Units VP mArms / mADC  mA Description CPC1125N is a miniature normally-closed (1-Form-B), single-pole solid state relay. It uses IXYS Integrated Circuits' patented, optically coupled, OptoMOS architecture to provide 1500Vrms of input/output isolation in a small 4-pin SOP package. CPC1125N uses IXYS Integrated Circuits' state of the art double-molded vertical construction packaging to produce one of the world’s smallest relays. It is ideal for replacing larger, less-reliable reed and electromechanical relays. Features • 1500Vrms Input/Output Isolation • Low Drive Power Requirements • High Reliability • No EMI/RFI Generation • Small 4-Pin SOP Package • Tape & Reel Version Available • Flammability Rating UL 94 V-0 Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Industrial Controls Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1172007 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # CPC1125N CPC1125NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel) Pin Configuration + Control – Control 1 4 3 2 Load Load Switching Characteristics of Normally-Closed Devices Form-B IF ILOAD 10% toff DS-CPC1125N-R06 www.ixysic.com 90% ton 1 INTEGRATED CIRCUITS DIVISION CPC1125N Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mw / ºC 2 Derate output power linearly 3.33 mw / ºC Ratings 400 5 50 1 150 400 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Switching Speeds Turn-On Turn-Off Off-State Leakage Current Output Capacitance Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 3 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 400 - - V IF=0mA t =10ms IL=100mA IL ILPK RON - 26 100 ±350 35 mArms / mADC mAP  IF=5mA, VL=10V ton toff VL=400V, IF=2mA IF=2mA, VL= 50V, f=1MHz ILEAK COUT - 0.31 0.30 6 2 2 5 - IL=100mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 1.36 - 2 1.5 10 mA mA V µA 1 - pF CIO VIO=0V, f=1MHz Load current derates linearly from 100mA @ 25oC to 60mA @ 85oC. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60°C) a minimum LED drive current of 4mA is recommended. www.ixysic.com ms µA pF R06 INTEGRATED CIRCUITS DIVISION CPC1125N PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) 20 15 10 5 1.364 15 10 5 0.12 Device Count (N) 15 10 5 0.28 0.30 0.32 0.34 Turn-On Time (ms) 25 20 15 10 0.20 Typical LED Forward Voltage vs. Forward Current 0.23 0.26 0.29 0.32 0.35 Turn-Off Time (ms) 10 0.6 0.5 0.4 0.3 0.1 1200 1.5 1.4 1.3 1.2 -20 0 20 40 60 Temperature (ºC) 80 -3 800 600 400 -50 -25 0 25 50 Temperature (ºC) 75 100 -2 -1 0 1 Load Voltage (V) 2 3 Typical Turn-On Time vs. LED Forward Current (IL=60mA) 318 316 314 312 310 308 0 1.0 Typical Load Current vs. Load Voltage (IF=0mA) -50 100 200 1.1 470 0 Turn-On Time (Ps) Turn-Off Time (Ps) IF=10mA IF=5mA IF=2mA 420 430 440 450 460 Blocking Voltage (VP) 50 1000 1.6 410 100 Typical Turn-Off Time vs. LED Forward Current (IL=60mA) Typical LED Forward Voltage Drop vs. Temperature 1.7 5 -150 -40 1.8 10 -100 0.2 0 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 Forward Voltage (V) 28 15 150 Load Current (mA) LED Current (mA) 20 28 20 400 0.7 30 25 26 27 On-Resistance (:) Typical Blocking Voltage Distribution (N=50, IF=2mA) 0.38 Typical IF for Switch Operation (IL=60mA) 0.8 40 25 0 0.36 50 5 24 0 0.26 10 0.22 5 0.24 Forward Current (mA) 0.16 0.18 0.20 LED Current (mA) 25 0 LED Forward Voltage Drop (V) 0.14 Typical Turn-Off Time (N=50, IF=5mA, IL=60mA) 30 20 15 0 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical Turn-On Time (N=50, IF=5mA, IL=60mA) 25 Device Count (N) 20 0 0 Typical On-Resistance Distribution (N=50, IF=0mA, IL=100mA) 20 Device Count (N) Device Count (N) 25 Device Count (N) 30 Typical IF for Switch Operation (N=50, IL=120mA) 306 0 10 20 30 LED Current (mA) 40 50 0 10 20 30 LED Current (mA) 40 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R06 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1125N PERFORMANCE DATA* 45 Typical On-Resistance vs. Temperature (IF=0mA, IL=60mA) Typical Turn-Off Time vs. Temperature (IL=60mA) 2000 500 35 30 25 1600 1200 IF=5mA 800 400 450 Turn-On Time (Ps) Turn-Off Time (Ps) On-Resistance (:) IF=2mA 40 Typical Turn-On Time vs. Temperature (IL=60mA) 400 350 300 250 IF=5mA 200 IF=2mA 150 20 0 20 40 60 Temperature (ºC) 80 100 Maximum Load Current vs. Temperature (IF=0mA) 110 100 90 80 70 60 50 100 -20 0 20 40 60 Temperature (ºC) 80 460 455 450 445 0 20 40 60 Temperature (ºC) Output Capacitence (pF) 70 80 100 -20 0 20 40 60 Temperature (ºC) Output Capacitance vs. Load Voltage (IF=2mA, f=1MHz) 50 40 30 20 10 0 1 20 40 60 Temperature (ºC) 80 100 4 3 2 1 10 100 Load Voltage (V) 1000 80 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve 1.0 60 0.1 0 0 -40 Load Current (A) -20 -20 Leakage Current vs. Temperature Measured Across Pins 3 & 4 (IF=2mA, VL=400V) 5 440 -40 -40 100 Typical Blocking Voltage vs. Temperature (IF=5mA) 465 Blocking Voltage (VP) Load Current (mA) -20 Leakage Current (PA) -40 0 -40 0.8 0.6 0.4 0.2 0.0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC1125N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1125N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles CPC1125N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R06 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1125N MECHANICAL DIMENSIONS CPC1125N 4.089 ± 0.025 (0.161 ± 0.001) Recommended PCB Land Pattern 0.203 ± 0.025 (0.008 ± 0.001) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.025 (0.150 ± 0.001) 0.559 ± 0.127 (0.022 ± 0.005) 0.910 ± 0.025 (0.036 ± 0.001) Pin 1 2.54 Typ (0.100 Typ) 2.030± 0.025 (0.080± 0.001) 0.481 (0.019) 0-0.1 (0-0.004) 0.60 (0.024) 3.85 (0.152) 1.54 (0.061) 2.54 (0.10) Dimensions mm (inches) Package standoff: 0.051 ± 0.051 (0.0020 ± 0.0020) Note: 1. Lead dimensions do not include plating: 1000 microinches max. 2. Controlling dimension: mm 0.381 ± 0.025 (0.015 ± 0.001) CPC1125NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) P1=8.00 (0.315) A0=6.50 (0.256) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. Specification: DS-CPC1125N-R06 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 8/5/2021 6