CPC1303
Optocoupler with
Single-Transistor Output
INTEGRATED CIRCUITS DIVISION
Parameter
Breakdown Voltage - BVCEO
Current Transfer Ratio
Saturation Voltage
Input Control Current
Rating
30
200
0.5
0.2
Description
Units
VP
%
V
mA
The CPC1303 is a unidirectional input optocoupler
with a single-transistor output, which uses optically
coupled technology to provide an enhanced 5000Vrms
isolation barrier between the input and the output.
The optically coupled output is controlled by a highly
efficient infrared LED.
Features
•
•
•
•
•
•
•
This optocoupler satisfies the PD output requirements
of IXYS Integrated Circuits' CPC1466 Broadband
ADSL/VDSL DC Termination IC.
5000Vrms Input/Output Isolation
Low Drive Power Requirements
High Reliability
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Small 4-pin Package
Flammability Rating UL 94 V-0
Approvals
• UL 1577 Approved Component: File E76270
• EN/IEC 60950-1 Certified Component:
Certificate available on our website
Applications
•
•
•
•
•
•
•
•
•
•
Sensor Circuitry
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Medical Equipment: Patient/Equipment Isolation
Aerospace
Industrial Controls
Ordering Information
Part Number
CPC1303G
CPC1303GR
CPC1303GRTR
Description
4-Pin DIP (100/Tube)
4-Pin Surface Mount, Tubed (100/Tube)
4-Pin Surface Mount, Tape & Reel (1000/Reel)
Pin Configuration
A
K
DS-CPC1303-R06
www.ixysic.com
1
4
2
3
C
E
1
INTEGRATED CIRCUITS DIVISION
CPC1303
Absolute Maximum Ratings @ 25ºC
Parameter
Breakdown Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Power Dissipation 2
Input 1
Phototransistor 2
Isolation Voltage, Input to Output
Operating Temperature
Storage Temperature
1
2
Ratings
30
5
50
1
150
150
5000
-40 to +85
-40 to +125
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Units
VP
V
mA
A
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements..
mW
Vrms
°C
°C
Derate linearly 1.33 mW / oC
Derate linearly 2.00 mW / oC
Electrical Characteristics @ 25ºC
Parameters
Output Characteristics
Phototransistor Breakdown Voltage
Phototransistor Output (Dark) Current
Saturation Voltage
Current Transfer Ratio
Output Capacitance
Input Characteristics
Input Control Current
Input Voltage Drop
Input Reverse Current
Common Characteristics
Capacitance, Input to Output
Conditions
Symbol
Min
Typ
Max
Units
ICEO=10µA
VCEO=5V, IF=0mA
IC=0.4mA, IF=0.2mA
IC=10mA, IF=10mA
IF=0.2mA, VCE=0.5V
IF=0mA, V=25V, f=1MHz
BVCEO
ICEO
25
0.1
0.12
1000
6
500
0.45
0.5
2500
-
VP
nA
CTR
COUT
30
200
-
IC=0.4mA, VCE=0.5V
IF=5mA
VR=5V
IF
VF
IR
0.9
-
1.2
-
0.2
1.5
10
mA
V
µA
VIO=0V, f=1MHz
CIO
-
3
-
pF
VCEsat
V
%
pF
Switching Characteristics @ 25ºC
Characteristic
Turn-On Time
Turn-Off Time
Symbol
ton
toff
Test Condition
Typ
2
8
VCC=5V, IF=1mA, RL=500
Switching Time Test Circuit
Units
s
VCC
IF
RL
Pulse Width=5ms
Duty Cycle=1%
IF
VCE
VCE
90%
10%
t on
2
www.ixysic.com
t off
R06
INTEGRATED CIRCUITS DIVISION
CPC1303
PERFORMANCE DATA*
LED Voltage vs. LED Current
(Linear)
1.6
40
30
20
10
0
1.1
1.2
1.3
1.4
1.5
LED Forward Voltage (V)
1.6
LED Forward Voltage (V)
100
LED Forward Current (mA)
10
1
0.1
1.1
1.2
1.3
1.4
1.5
LED Forward Voltage (V)
Collector Current (mA)
-40ºC
1000
CTR (%)
25ºC
85ºC
600
400
200
10
100
LED Forward Current (PA)
1.2
1.1
40
IF=3mA
30
IF=2mA
20
IF=1mA
IF=0.5mA IF=0.2mA
2
3
Collector Voltage (V)
4
IF=50PA
IF=20PA
100
IF=10PA
IF=5PA
IF=2PA
IF=1PA
10
Typical Blocking Voltage
vs. Temperature
0
40
80
Temperature (ºC)
120
Leakage Current vs. Temperature
500
Leakage Current (nA)
Blocking Voltage (VP)
0.08
100
IF=200PA
IF=100PA
-40
5
95
0.10
80
IF=1000PA
IF=500PA
1
1
96
0.12
20
40
60
Temperature (ºC)
1000
10
Saturation Voltage vs. Temperature
(IF=1mA, ICE=2mA)
0.14
0
10000
0
0.16
-20
IF=5mA
50
1000
IF=2mA
IF=1mA
IF=0.2mA
ICE Current vs. Temperature
0
0
1
1.3
100000
60
1200
800
1.4
Typical Collector Voltage vs.
Typical Collector Current
LED Forward Current vs. CTR
IF=50mA
IF=20mA
IF=10mA
IF=5mA
1.5
1.0
-40
1.6
ICE Current (PA)
LED Forward Current (mA)
50
Saturation Voltage (V)
LED Forward Voltage
vs. Temperature
LED Voltage vs. LED Current
(LOG)
94
93
92
91
90
89
400
VCE Leakage 10V
300
VCE Leakage 5V
VCE Leakage 3V
200
100
88
0.06
-40
87
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
350
1.4
300
Turn-Off Time (Ps)
Turn-On Time (Ps)
1.5
1.2
1.1
1.0
100
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Turn-Off Time vs. Load Resistance
(VCC=5V, IF=1mA)
Turn-On Time vs. Load Resistance
(IF=1mA, VCC=5V)
1.3
80
250
200
150
100
50
0.9
0
0
20
40
60
80
Load Resistance (k:)
100
0
20
40
60
80
Load Resistance (k:)
100
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
R06
www.ixysic.com
3
INTEGRATED CIRCUITS DIVISION
CPC1303
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Classification
CPC1303G
CPC1303GR
MSL 1
MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body
Temperature allowed for this device during lead-free reflow processes. Additionally, for the CPC1303GR, the solder
reflow profile given in Technical Brief TB-200 “Pb-Free Solder Reflow Profile for Select Devices” must be followed.
For the through-hole device, CPC1303G, and any other processes, the guidelines of J-STD-020 must be observed.
Device
Classification Temperature (Tc)
Dwell Time (tp)
Max Reflow Cycles
CPC1303G
CPC1303GR
250ºC
250ºC
15 seconds
15 seconds
1
3
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage
to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow
up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the
variability of the wash parameters used to clean the board, determination of the bake temperature and duration
necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning
or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the
device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
4
www.ixysic.com
R06
INTEGRATED CIRCUITS DIVISION
CPC1303
MECHANICAL DIMENSIONS
CPC1303G
0.991
(0.039)
PC Board Pattern (Top View)
0.254
(0.010)
3.30 ± 0.050
(0.130 ± 0.002)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
6.350 ± 0.127
(0.250 ± 0.005)
4.572 ± 0.127
(0.180 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
PIN 1
9º (ALL)
9º (ALL)
7.620 ± 0.250
(0.300 ± 0.010)
2.159
(0.085)
0.457 ± 0.076
(0.018 ± 0.003)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
0.508
(0.020)
3.175
(0.125)
2.540 ± 0.127
(0.100 ± 0.005)
Dimensions
mm
(inches)
CPC1303GR
2.540 ± 0.127
(0.100 ± 0.005)
PCB Land Pattern
3.300 ± 0.050
(0.130 ± 0.002)
0.635 ± 0.254
(0.025 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
9.525
(0.375)
7.620 ± 0.254
(0.300 ± 0.010)
8.80
(0.346)
1.60
(0.063)
PIN #1
0.991
(0.039)
9º ± 1º
(ALL)
2.287
(0.09)
3.480 ± 0.076
(0.137 ± 0.003)
4.572 ± 0.127
(0.180 ± 0.005)
0.254
(0.010)
0.95
(0.037)
2.540 ± 0.127
(0.100 ± 0.005)
2.287 ± 0.127
(0.090 ± 0.005)
R06
0.102 min / 0.254 max
(0.004 min / 0.010 max)
www.ixysic.com
Dimensions
mm
(inches)
5
INTEGRATED CIRCUITS DIVISION
CPC1303
CPC1303GRTR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00±0.30
(0.630±0.012)
B0=5.00
(0.197)
K0=4.20
(0.165)
K1=3.70
(0.146)
A0=10.01
(0.394)
P1=12.00
(0.472)
Direction of feed
Dimensions
mm
(inches)
Embossed
Carrier
Embossment
NOTES:
1. All dimensions meet EIA-481-C requirements
2. Unless otherwise noted, tolerances = ±0.10 (0.004)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes
to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits'
Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but
not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property
or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.
6
Specification: DS-CPC1303-R06
©Copyright 2018, IXYS Integrated Circuits
All rights reserved. Printed in USA.
6/18/2018
