CPC1510GSTR

CPC1510 Single-Pole, Normally Open Relay with Integrated Current Limit INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 250 200 15 Units VP mArms / mADC  Features • • • • • • • • • Integrated active current-limit protection Thermal shutdown Linear AC or DC operation Low power consumption Clean, bounce-free switching High surge capability Low power drive requirements Surface mount version available Tape & reel packaging available Applications • • • • • • Description The CPC1510 is a single-pole, normally open (1-Form-A) Solid State Relay with an integrated current limit feature that can replace electromechanical relays while enhancing the robustness of wireline-interface applications. The relay is constructed using a GaAIAs LED for actuation control and an integrated monolithic die for the switch output. The die, fabricated in a high-voltage dielectrically isolated technology, comprises a photodiode array, switch control with active current limiting circuitry, and MOSFET switches. The active current limit circuitry in the CPC1510 also provides a thermal shutdown feature offering excellent power cross immunity for improved survivability in harsh environments. These enhancements greatly improve the robustness of end systems using this device compared to systems using relays without the integrated current limit. In addition, the active current limit circuitry enables the CPC1510 to pass FCC 68.302 and other regulatory voltage surge requirements when adequate overvoltage protection is provided. The CPC1510 relay may be used in both unidirectional DC applications as well as bi-directional AC applications. Fault protected switch Instrumentation Elevator controls Industrial controls Security Peripherals • Automatic tuning/balancing • Transducer driver • Pre-driver for large electro-mechanical relays • Telecom switching • Medical equipment Approvals Pin Configuration • UL Approved Component: File # E76270 • CSA Certified Component: Certificate # 1172007 • EN/IEC 60950-1 Certified Component: Pending AC/DC Configuration + Control – Control Do Not Use 1 6 2 5 3 4 Load Do Not Use Load DC Only Configuration + Control – Control Do Not Use 1 6 2 5 3 4 Ordering Information Part # CPC1510G CPC1510GS CPC1510GSTR Description 6-Pin 0.250" Wide, Through Hole (50/Tube) 6-Pin 0.250" Wide, Surface Mount (50/Tube) 6-Pin 0.250" Wide, Surface Mount (1000/Reel) + Load Switching Characteristics of Normally Open Devices – Load Form-A IF 90% 10% ILOAD ton DS-CPC1510-R04 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1510 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input LED Current Continuous Peak (10ms) Input Control Current Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate Linearly 1.33 mW/ºC 2 Derate Linearly 1.67 mW/ºC Ratings 250 5 Units VP V 50 1 10 150 800 3750 -40 to +85 -40 to +125 mA A mA mW mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Recommended Operating Conditions Parameter Load Current, Continuous Input Control Current Operating Temperature Range Symbol IL IF TA Configuration AC/DC DC-Only - Min 3 -40 Nominal 5 - Max 200 350 10 +85 Units mArms / mADC mADC mA ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Current Limit AC/DC Configuration DC Configuration On-Resistance AC/DC Configuration DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Conditions Symbol Min Typ Max Units IF=5mA, VL=±5V, t=5ms ILMT 300 600 366 730 450 920 mAP IF=5mA, IL=100mA RON VL=200V ILEAK 6 1.5 - 13 3.3 1.3e-5 15 3.75 1 µA IF=5mA, IL=10mA, VL=10V ton toff - 0.845 0.26 2 ms CO - - pF IL=100mA IL=100mA IF=5mA IF IF VF 0.2 1.15 1.37 2 1.5 mA mA V - CI/O - 3 - pF IF=0mA, VL=1V, f=1MHz IF=0mA, VL=50V, f=1MHz Input Characteristics Input Control Current to Activate Input Control Current to Deactivate LED Forward Voltage Common Characteristics Input to Output Capacitance 2 www.ixysic.com 205 65  R04 INTEGRATED CIRCUITS DIVISION CPC1510 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) Device Count (N) 25 20 15 10 5 0 20 Device Count (N) 30 Typical Turn-On Time (N=50, IF=5mA, IL=100mA) 15 10 5 0 1.364 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) 0.76 0.82 0.85 0.88 0.91 Turn-On Time (ms) 50 45 40 35 30 25 20 15 10 5 0 0.22 0.94 0.24 0.26 0.28 Turn-Off Time (ms) 0.30 Typical On-Resistance (N=50, IF=5mA, IL=100mA) 25 Device Count (N) 0.79 Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) 20 15 10 5 0 12.2 12.4 12.6 12.8 13.0 13.2 13.4 13.6 On-Resistance (:) Typical IF for Switch Operation vs. Temperature (IL=100mADC) Typical LED Forward Voltage Drop vs. Temperature LED Current (mA) 1.7 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 1.1 1.0 -50 400 -25 0 25 50 Temperature (ºC) 75 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 LED Current (mA) LED Forward Voltage Drop (V) 1.8 -50 100 -25 0 25 50 Temperature (ºC) 75 Typical IF for Switch Dropout vs. Temperature (IL=1mA) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -50 100 -25 2.0 2.0 75 100 Typical Turn-Off Time vs. LED Forward Current (IL=10mA & IL=100mADC) Typical Turn-On Time vs. LED Forward Current Typical Load Current vs. Load Voltage (IF=5mA) 0 25 50 Temperature (ºC) 200 100 0 -100 -200 1.5 IL=100mADC 1.0 IL=10mADC 0.5 Turn-Off Time (ms) Turn-On Time (ms) Load Current (mA) 300 1.5 1.0 0.5 -300 -400 0.0 0.0 -4 -3 -2 -1 0 1 Load Voltage (V) 2 3 4 0 1 2 3 4 5 6 7 8 9 10 11 12 LED Forward Current (mA) 0 1 2 3 4 5 6 7 8 9 10 11 12 LED Forward Current (mA) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. R04 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1510 PERFORMANCE DATA* 3.0 Turn-On Time (ms) On-Resistance (:) 20 15 10 5 Typical Turn-On Time vs. Temperature (IL=100mADC) 2.5 2.0 IF=2mA IF=5mA IF=10mA 1.5 1.0 Typical Turn-Off Time vs. Temperature (IL=100mADC) 2.0 Turn-Off Time (ms) On-Resistance vs. Temperature AC/DC Configuration (IF=2mA, IL=100mADC) 1.5 1.0 IF=10mA IF=5mA IF=2mA 0.5 0.5 0.0 -50 0 25 50 Temperature (ºC) 75 -50 100 On-Resistance vs. Temperature DC-Only Configuration (IF=2-10mA, IL=100mADC) 5 2.0 4 Turn-On Time (ms) 3 2 1 0 0 25 50 Temperature (C) 75 0.0 -50 100 Typical Turn-On Time vs. Temperature (IL=10mADC) IF=2mA IF=5mA IF=10mA 1.5 1.0 0.5 -25 0 25 50 Temperature (ºC) 75 100 400 DC-Only Configuration 250 AC/DC Configuration 150 100 50 0 -50 -25 0 25 50 Temperature (ºC) 1000 900 800 700 600 500 400 300 200 100 0 -50 Current Limit (mAP) 300 200 -25 75 0 25 50 Temperature (ºC) 75 100 100 75 100 1.5 1.0 0.5 -50 DC Configuration AC/DC Configuration -25 0 25 50 Temperature (ºC) 75 100 -25 0 25 50 Temperature (ºC) 75 100 Typical Leakage Current vs. Temperature (Measured with 250V across pins 6 & 4) Typical Current Limit vs. Temperature (IF=5mA) 350 0 25 50 Temperature (ºC) 0.0 -50 Maximum Load Current vs. Temperature -25 Typical Turn-Off Time vs. Temperature (IF=2-10mA, IL=10mADC) 2.0 0.0 -50 Load Current (mA) -25 10 Leakage Current (nA) On-Resistance (:) -25 Turn-Off Time (ms) 0 1 0.1 0.01 0.001 0.0001 -25 0 25 50 Temperature (ºC) 75 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION CPC1510 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1510GS MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles CPC1510GS 250ºC 30 seconds 3 The maximum wave soldering conditions of the through-hole devices is provided in the following table. Dwell time is the time it takes for the pins to pass through both waves. Device Maximum Wave Temperature Body Temperature Dwell Time Wave Cycles CPC1510G 260ºC 250ºC 10 seconds 1 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents that are Chlorine, Bromine, Fluorine, or Iodine-based. R04 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1510 Mechanical Dimensions CPC1510G 8.382±0.381 (0.330±0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54±0.127 (0.100±0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144±0.508 (0.360±0.020) 6.350±0.127 (0.250±0.005) 1.524 TYP (0.060 TYP) Pin 1 1.651±0.254 (0.065±0.010) 3.302±0.051 (0.130±0.002) 2.540±0.127 (0.100±0.005) 7.620±0.127 (0.300±0.005) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 5.080±0.127 (0.200±0.005) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457±0.076 (0.018±0.003) CPC1510GS 8.382±0.381 (0.330±0.015) 9.524±0.508 (0.375±0.020) Pin 1 0.635±0.127 (0.025±0.005) PCB Land Pattern 2.54±0.127 (0.100±0.005) 2.54 (0.10) 6.350±0.127 (0.250±0.005) 0.457±0.076 (0.018±0.003) 1.651±0.254 (0.065±0.010) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302±0.051 (0.130±0.002) 4.445±0.254 (0.175±0.010) Dimensions mm (inches) 1.524 TYP (0.060 TYP) 6 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION CPC1510 CPC1510GSTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) P1 = 12.00 (0.472) User Direction of Feed Embossed Carrier Embossment A0 = 10.10 (0.398) Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com Disclaimer Notice - Littelfuse products are not designed for, and shall not be used for, any purpose (including, without limitation, automotive, military, aerospace, medical, life-saving, life-sustaining or nuclear facility applications, Components intended for surgical implant into the body, or any other application in which the failure or lack of desired operation of the product may result in personal injury, death, or property damage) other than those expressly set forth in applicable Littelfuse product documentation. Warranties granted by Littelfuse shall be deemed void for products used for any purpose not expressly set forth in applicable Littelfuse documentation. Littelfuse shall not be liable for any claims or damages arising out of products used in applications not expressly intended by Littelfuse as set forth in applicable Littelfuse documentation. The sale and use of Littelfuse products is subject to Littelfuse Terms and Conditions of Sale, unless otherwise agreed by Littelfuse. Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-CPC1510-R04 ©Copyright 2019, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 10/7/2019