CPC1708J

CPC1708 60V Single-Pole, Normally Open DC-Only Power Relay INTEGRATED CIRCUITS DIVISION Characteristics Description Parameter Rating Units 60 VP Blocking Voltage IXYS Integrated Circuits brings OptoMOS® technology, reliability and compact size to a new family of High Power Solid State Relays. As part of this new family, the CPC1708 single-pole normally open (1-Form-A) DC Solid State Relay employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. Load Current, TA=25°C: With 5°C/W Heat Sink 11.85 No Heat Sink ADC 4 On-Resistance (max) 0.08  Thermal Impedance, Junction-to-Case, JC 0.35 °C/W Features • • • • • • • • • • 11.85ADC Load Current with 5°C/W Heat Sink Low 0.08 On-Resistance 60VP Blocking Voltage 2500Vrms Input/Output Isolation Low Thermal Impedance: JC = 0.35 °C/W Isolated, Low Thermal Impedance Ceramic Pad for Heat Sink Applications Low Drive Power Requirements Arc-Free With No Snubbing Circuits No EMI/RFI Generation Flammability Rating UL 94 V-0 Applications • • • • • • • • • • • Industrial Controls / Motor Control Robotics Medical Equipment—Patient/Equipment Isolation Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Transportation Equipment Aerospace/Defense The relay output is constructed with efficient MOSFET switches that use IXYS Integrated Circuits’ patented OptoMOS architecture. The input, a highly efficient infrared LED, controls the optically coupled output. Low on-resistance and high load current handling capability make this relay suitable for a variety of high performance DC switching applications. The unique i4-PAC package pioneered by IXYS enables solid state relays to achieve the highest load current and power ratings. This package features an IXYS-unique process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the usual copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low junction-to-case thermal impedance (0.35°C/W). Ordering Information Part Description CPC1708J i4-PAC Package (25 per tube) Switching Characteristics Approvals • UL 508 Certified Component: File E69938 • CSA Certified Component: Certificate 1172007 Form-A Pin Configuration IF 90% 10% ILOAD 1 2 + DS-CPC1708 - R08 3 - 4 - ton toff + www.ixysic.com 1 CPC1708 INTEGRATED CIRCUITS DIVISION 1 Specifications 1.1 Absolute Maximum Ratings @ 25°C Symbol Ratings Units Blocking Voltage 60 VP Reverse Input Voltage 5 V Input Control Current 50 mA 1 A 150 mW Peak (10ms) Input Power Dissipation Isolation Voltage, Input to Output 2500 Vrms Operational Temperature -40 to +85 °C Storage Temperature -40 to +125 °C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. 1.2 Electrical Characteristics @ 25°C Parameter Conditions Symbol Minimum Typical Maximum Units 30 AP Output Characteristics Load Current 1 Peak Continuous Continuous Continuous 2 On-Resistance Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Input/Output Characteristics Capacitance, Input-to-Output t10ms No Heat Sink TC=25°C IL TC=99°C IL(99) IF=10mA, IL=1A RON - 0.05 0.08  VL=60VP ILEAK - - 1 A ton - 5 20 toff - 0.13 5 IF=0mA, VL=25V, f=1MHz Cout - 1250 - pF IL=1A IF - - 10 mA IF=10mA IF 0.6 - - mA VF 0.9 1.35 1.56 V VR=5V IR - - 10 A VIO=0V, f=1MHz CIO - 1 - pF IF=20mA, VL=10V - 4 - 24 ADC 5.35 ms 1 Higher load currents possible with proper heat sinking. Measurement taken within 1 second of on-time. 3 For applications requiring high temperature operation (> 60ºC) an LED drive current of 20mA is recommended. 2 R08 www.ixysic.com 2 CPC1708 INTEGRATED CIRCUITS DIVISION 2 Thermal Characteristics Parameter Conditions Symbol Rating Units - JC 0.35 °C/W Free Air JA 45 °C/W - TJ -40 to +100 °C Thermal Impedance (Junction to Case) Thermal Impedance (Junction to Ambient) Junction Temperature (Operating) 2.1 Thermal Management Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient thermal impedance of 12.5°C/W. 2.2 Heat Sink Calculation Higher load currents are possible by using lower thermal impedance heat sink combinations. Heat Sink Rating θCA = (TJ - TA) IL(99)2 IL2 • PD(99) - θJC TJ = Junction Temperature (°C), TJ ≤ 100°C * TA = Ambient Temperature (°C) IL(99) = Load Current with Case Temperature @ 99°C (ADC) IL = Desired Operating Load Current (ADC), IL ≤ IL(MAX) θJC = Thermal Impedance, Junction to Case (°C/W) = 0.35°C/W θCA = Thermal Impedance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W) PD(99) = Maximum power dissipation with case temperature held at 99ºC = 2.86W * Elevated junction temperature reduces semiconductor lifetime. NOTE: The exposed surface of the DCB substrate is not to be soldered. 3 www.ixysic.com R08 CPC1708 INTEGRATED CIRCUITS DIVISION 3 Performance Data* Unless otherwise specified, all data was collected without the use of a heat sink. 35 Device Count (N) 25 20 15 10 25 20 15 10 5 5 1.30 1.31 1.32 1.33 24 18 12 6 0 0 0 Typical Turn-Off Time (N=50, IF=20mA, IL=1ADC) 30 30 30 Device Count (N) Typical Turn-On Time (N=50, IF=20mA, IL=1ADC) Device Count (N) 35 Typical LED Forward Voltage Drop (N=50, IF=10mA) 2.9 1.34 4.0 5.1 6.2 7.3 0.108 8.4 0.116 0.124 Turn-On (ms) LED Forward Voltage (V) 0.132 0.140 0.148 Turn-Off (ms) Typical On-Resistance Distribution (N=50, IF=10mA, IL=1ADC) 35 Device Count (N) 30 25 20 15 10 5 0 0.040 IF=20mA IF=10mA 1.0 0.8 0 20 40 60 80 100 0.16 0.14 0.10 0.08 0.06 0.02 0.00 0 120 0.12 0.04 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 50 Temperature (ºC) LED Forward Current (mA) LED Forward Current (mA) Typical IF for Switch Operation vs. Temperature (IL=1ADC) Typical Turn-On Time vs. Temperature (IL=1ADC) Typical Turn-Off Time vs. Temperature (IL=1ADC) 14 0.16 12 0.14 IF=10mA 10 8 Turn-Off (ms) 4.0 3.9 3.8 3.7 3.6 3.5 3.4 3.3 3.2 3.1 3.0 -40 -20 Typical Turn-Off Time vs. LED Forward Current (IL=1ADC) 0.18 12 11 10 9 8 7 6 5 4 3 2 1 0 Turn-Off (ms) 1.2 -40 LED Current (mA) Turn-On (ms) 1.6 Turn-On (ms) LED Forward Voltage Drop (V) 1.8 IF=50mA 0.065 Typical Turn-On Time vs. LED Forward Current (IL=1ADC) Typical LED Forward Voltage Drop vs. Temperature 1.4 0.045 0.050 0.055 0.060 On-Resistance (Ω) IF=20mA 6 4 2 0 20 40 60 Temperature (ºC) 80 100 0.10 0.08 IF=20mA 0.06 0.04 0 -20 0.12 -40 -20 0 20 40 60 Temperature (ºC) 80 100 0.02 -40 IF=10mA -20 0 20 40 60 Temperature (ºC) 80 100 * Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. R08 www.ixysic.com 4 CPC1708 INTEGRATED CIRCUITS DIVISION 0.09 0.07 0.08 0.06 0.07 0.05 0.04 0.03 0.02 0.01 0 Typical On-Resistance vs. Temperature (IF=10mA, IL=max rated) 5.0 0.06 0.05 0.04 0.03 0.02 3.0 2.0 1.0 -20 0 20 40 60 80 0.00 100 0.0 -40 -20 0 25 1ºC/W Blocking Voltage (VP) 20 15 5ºC/W 10 10ºC/W 5 Free Air 0 20 40 60 80 100 40 60 80 100 0 0.05 0.10 0.15 0.20 0.25 Load Voltage (V) Blocking Voltage vs. Temperature Typical Leakage vs. Temperature At Maximum Rated Voltage Measured Across Pins 1 & 2 185 0.07 180 0.06 175 Leakage (μA) Maximum Load Current vs. Temperature with Heat Sink (IF=20mA) 20 Temperature (ºC) Temperature (ºC) Load Current (A) 4.0 0.01 -40 0 Typical Load Current vs. Load Voltage (IF=10mA) Load Current (A) 0.08 On-Resistance (Ω) On-Resistance (Ω) Typical On-Resistance vs. Temperature (IF=10mA, IL=1ADC) 170 165 160 155 0.30 0.05 0.04 0.03 0.02 0.01 150 145 -40 -20 0 20 40 60 80 100 Temperature (ºC) Temperature (ºC) 0 -40 -20 0 20 40 60 80 100 Temperature (ºC) Energy Rating Curve Free Air, No Heat Sink 35 Load Current (A) 30 25 20 15 10 5 0 10µs 100µs 1ms 10ms 100ms 1s 10s 100s Time Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. 5 www.ixysic.com R08 CPC1708 INTEGRATED CIRCUITS DIVISION 4 Manufacturing Information 4.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1708J MSL 1 4.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 4.3 Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (TC) Dwell Time (tp) Max Reflow Cycles CPC1708J 245°C 30 seconds 1 NOTE: The exposed surface of the DCB substrate is not to be soldered. 4.4 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R08 www.ixysic.com 6 CPC1708 INTEGRATED CIRCUITS DIVISION 4.5 Mechanical Dimensions 5.029 ± 0.127 (0.198 ± 0.005) 19.914 ± 0.254 (0.784 ± 0.010) 1.930 ± 0.381 (0.076 ± 0.015) 17.221 ± 0.254 (0.678 ± 0.010) 1.181 ± 0.076 (0.047 ± 0.003) 15.317 ± 0.254 (0.603 ± 0.010) 20.879 ± 0.254 (0.822 ± 0.010) DCB Substrate NOTE: Not to be soldered 2.362 ± 0.381 (0.093 ± 0.015) 20.396 ± 0.508 (0.803 ± 0.020) DIMENSIONS mm (inches) 3.810 ± 0.254 (0.150 ± 0.010) 15.240 ± 0.508 (0.600 ± 0.020) 0.635 ± 0.076 (0.025 ± 0.003) 1.270 TYP (0.050 TYP) 2.794 ± 0.127 (0.110 ± 0.005) NOTE: Metallized external surface of DCB substrate maintains 2500Vrms isolation to device internal structure and all external pins. For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits’ Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits’ product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1708-R08 ©Copyright 2018, IXYS Integrated Circuits All rights reserved. Printed in USA. 6/18/2018 7 www.ixysic.com R08