CPC1767J

Power Solid State Relays i4-PAC™, ISOPLUS264, and the Power SIP Relays Features • Solid State Reliability • Handle loads up to 15Arms • Voltage ratings from 60V - 1000V • Low On Resistance • Compact i4-PAC™ Package with low thermal resistance and heat sink • Industry Standard 4-Pin SIP Package • Low input control current (≤ 10mA) • UL 508 Approval Pending Applications Description This unique family of 1-Form-A high power Solid State Relays (SSRs) combines Clare’s proven optical isolation with IXYS advanced power MOSFET devices to deliver the industry’s highest power MOSFET based SSRs. The efficient MOSFET switches and photovoltaic die employ Clare’s patented OptoMOS™ architecture which is based on an optically-coupled input controlled by a highly efficient GaAlAs infrared LED. The combination of low on resistance and high load current handling capabilities makes these relays suitable for a variety of high performance switching applications. As with all Clare SSRs, they are ideal EMR replacements and offer higher reliability, lower drive current, no contact bounce and peak performance in the harshest shock, vibration and magnetic environments. With the recent expansion of the power relay family, Clare provides maximum flexibility for designers as it now offers a full range of current (up to 15Arms) and voltage (60V to 1000V) options, full AC/DC or reduced cost DC-only operation in 3 different package types (Power SIP, i4-PAC™ and the ISOPLUS264). The SIP package offers pin for pin compatibility with other power solid state relays, allowing designers to bring Clare’s superior reliability to existing designs without changing printed circuit boards. What distinguishes Clare’s offerings from other power solid state relays are the unique package options, the i4-PAC™ and the ISOPLUS264. Both are part of the IXYS family of ISOPLUS packages. These packages feature the IXYS unique (patent pending) process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the usual copper lead frame. The DCB ceramic, the same substrate material used in high power modules, not only provides isolation capability (2500Vrms) but also unbeatable low thermal resistance (0.30 ºC/W for the ISOPLUS264) compared to conventional external mounted isolation material. Along with the ability to attach a heat sink, these factors combine to give Clare’s new power relays unbeatable current handling capability in a compact package. Block Diagrams: * i4-PAC™ and ISOPLUS264 have both AC/DC and DC-only versions AC/DC Version* DC Version* • Motor controls • Power Supplies • Robotics • Medical equipment • Transportation equipment • Consumer appliances • Industrial control • Test and Measurement Equipment • Aerospace/Defense i4-PAC™, ISOPLUS264, and the Power SIP Relays Part Number Many electronic designs can take advantage of the improved performance of solid-state relays (SSRs) relative to the electro-mechanical relays (EMRs) that perform the same circuit function. The advantages of solid-state relays include the following: • SSRs are typically smaller than EMRs, preserving valuable real estate in printedcircuit board applications. • SSRs offer improved system reliability since they have no moving parts or contacts to degrade. • SSRs provide state-of-the-art performance, including no requirement for driver electronics and bounce-free switching. • SSRs provide improved system lifecycle costs, including simplified designs with reduced power supply and heat dissipation requirements. • SIP style package allows for maximum density/minimal PCB space Application Notes • AN-145, “Advantages of solid state relays over electromechanical relays.” Output Type Blocking Voltage Load Current On Resistance Package (Ohms) Switching Speeds TON/TOFF (ms) Thermal Resistance RθJC (ºC/W) (VP) (Arms) CPC1908J AC/DC 60 8 0.3 20/5 i4-PAC™ 0.35 CPC1928J AC/DC 200 6 0.2 20/5 i4-PAC™ 0.35 CPC1967J AC/DC 400 3 0.85 20/5 i4-PAC™ 0.35 CPC1977J AC/DC 600 4 1 20/5 i4-PAC™ 0.35 CPC1978J AC/DC 800 2.5 2.3 20/5 i4-PAC™ 0.35 CPC1986J AC/DC 1000 1.2 3 20/5 i4-PAC™ 0.35 CPC1909J AC/DC 60 10 0.1 20/5 ISOPLUS264 0.3 CPC1918J AC/DC 100 9 0.12 25/10 ISOPLUS264 0.3 CPC1927J AC/DC 250 7 0.20 25/10 ISOPLUS264 0.3 CPC1979J AC/DC 600 5 0.75 25/10 ISOPLUS264 0.3 CPC1988J AC/DC 1000 1.5 2.5 25/10 ISOPLUS264 0.3 CPC1906Y AC/DC 60 2 0.3 10/5 Power SIP 1.5 CPC1916Y AC/DC 100 2.5 0.34 10/10 Power SIP 1.5 CPC1926Y AC/DC 250 0.7 1.4 10/10 Power SIP 1.5 CPC1972Y AC/DC 600 0.30 6.5 10/5 Power SIP 1.5 CPC1973Y AC/DC 400 0.35 5 5/3 Power SIP 1.5 CPC1981Y AC/DC 1000 0.18 18 10/5 Power SIP 1.5 CPC1976Y AC 600 2 n/a 1/2 cycle Power SIP 1.5 CPC1708J* DC 60 11 0.08 20/5 i4-PAC™ 0.35 CPC1728J* DC 200 10 0.10 20/5 i4-PAC™ 0.35 CPC1767J* DC 400 8 0.3 20/5 i4-PAC™ 0.35 CPC1777J* DC 600 6 0.5 20/5 i4-PAC™ 0.35 CPC1778J* DC 800 3 1.3 20/5 i4-PAC™ 0.35 CPC1786J DC 1000 1.5 1.5 20/5 i4-PAC™ 0.35 CPC1709J* DC 60 15 0.05 25/10 ISOPLUS264 0.3 CPC1718J* DC 100 13 0.075 25/10 ISOPLUS264 0.3 CPC1727J* DC 250 12 0.09 25/10 ISOPLUS264 0.3 CPC1779J* DC 600 6.5 0.4 25/10 ISOPLUS264 0.3 CPC1788J* DC 1000 2 1.25 25/10 ISOPLUS264 0.3 * In Development - Samples Available in Q1-05 Power SIP i4-PAC™ 0.770 MIN - 0.799 MAX (19.56 MIN - 20.29 MAX) 0.770 MIN - 0.799 MAX (19.56 MIN - 20.29 MAX) 0.660 MIN - 0.690 MAX (16.76 MIN - 17.53 MAX) ISOLATED HEAT SINK ISOLATED HEAT SINK 0.819 MIN - 0.840 MAX (20.80 MIN - 21.34 MAX) 0.590 MIN - 0.620 MAX (14.99 MIN - 15.75 MAX) ISOPLUS264 1.020 MIN - 1.040 MAX (25.91 MIN - 26.42 MAX) 0.668 MIN - 0.690 MAX (16.97 MIN - 17.53 MAX) 0.801 MIN - 0.821 MAX (20.34 MIN - 20.85 MAX) 1 2 3 4 PIN 4 PIN 1 Dimensions: inches (mm) Clare, 78 Cherry Hill Drive, Beverly, MA 01915 Tel: 978-524-6700 • Fax: 978-524-4700 Web: www.clare.com DIMENSIONS: INCHES (MM)