CPC1926Y

CPC1926 Single-Pole, Normally Open OptoMOS® Power SIP Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 250 0.7 1.4 Units VP Arms / ADC  Description IXYS Integrated Circuits brings OptoMOS® technology, reliability, and compact size to a new family of high-power, solid state relays. As part of that family, the CPC1926 is a single-pole, normally open (1-Form-A) solid state relay. Features • • • • • • • • • The CPC1926 employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The optically coupled outputs, that use patented OptoMOS architecture, are controlled by a highly efficient infrared LED. The combination of low on-resistance and high load-current handling capabilities makes the relay suitable for a variety of high-performance switching applications. Handle Load Currents Up to 0.7 ADC/Arms 2500Vrms Input/Output Isolation Power SIP Package High Reliability No Moving Parts Low Drive Power Requirements Arc-Free With No Snubbing Circuits No EMI/RFI Generation Flammability Rating UL 94 V-0 Approvals • UL 508 Certified Component: File E69938 Applications • • • • • • • • • • • • Industrial Controls Motor Control Robotics Medical Equipment—Patient/Equipment Isolation Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) IC Equipment Home Appliances Ordering Information Part # CPC1926Y Description 4-Pin (8-Pin Body) Power SIP Package (25 per tube) Pin Configuration 1 - 2 + 3 4 Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-CPC1926-R07 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1926 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation voltage Input to Output Operational Temperature Storage Temperature 1 Ratings 250 5 50 1 150 2400 2500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / ºC Derate linearly 20 mW / ºC 2 Electrical Characteristics @ 25ºC Parameter Output Characteristics Load Current, Continuous Peak Load Current On-Resistance1 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Input/Output Characteristics Capacitance Input/Output 1 Conditions Symbol Min Typ Max Units Free air t < 10ms IL=100mA VL=250VP IL ILPK RON ILEAK - 1.2 - 0.7 ±3 1.4 1 Arms / ADC AP  µA IF=0mA, VL=50V, f=1MHz ton toff COUT - 2.3 0.022 60 10 10 - IL=120mA IF=10mA VR=5V IF IF VF IR 0.6 0.9 - 3.75 1.35 - 10 1.56 10 mA mA V µA VIO=0V, f=1MHz CIO - 2 - pF IF=10mA, VL=10V ms pF Measurement taken within 1 second of on-time. Thermal Characteristics Parameter Thermal Impedance (junction to case) 2 Conditions Symbol Min Typ Max Units - RJC - 1.5 - °C/W www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION CPC1926 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=10mA, TA=25ºC) Device Count (N) 25 20 15 10 5 25 25 20 20 15 10 5 1.260 1.265 1.270 1.275 1.8 1.280 2.0 2.2 2.4 35 35 30 30 25 20 15 10 5 2.6 1.19 1.21 1.23 1.25 20 15 10 1.27 265 267 1.4 IF=50mA IF=20mA 1.2 IF=10mA 1.0 0.8 80 100 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0 0 120 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 50 Temperature (ºC) LED Forward Current (mA) LED Forward Current (mA) Typical IF for Switch Operation vs. Temperature (IL=100mADC) Typical Turn-On Time vs. Temperature (IL=100mADC) Typical Turn-Off Time vs. Temperature (IL=100mADC) 0.07 1.4 IF=10mA 1.2 Turn-On Time (ms) LED Current (mA) 60 Typical Turn-Off Time vs. LED Forward Current (IL=100mADC) Turn-Off Time (ms) 1.6 Turn-On Time (ms) LED Forward Voltage Drop (V) 1.8 277 269 271 273 275 Blocking Voltage (VP) Typical Turn-On Time vs.LED Forward Current (IL=100mADC) Typical LED Forward Voltage Drop vs. Temperature 0.06 1.0 0.8 0.6 IF=20mA 0.4 -20 0 20 40 60 Temperature (ºC) 80 100 0 0.05 IF=20mA 0.04 0.03 IF=10mA 0.02 0.01 0.2 -40 0.025 25 On-Resistance (:) 5.50 5.25 5.00 4.75 4.50 4.25 4.00 3.75 3.50 3.25 3.00 0.017 0.019 0.021 0.023 Turn-Off Time (ms) 0 1.17 40 0.015 2.8 5 0 20 5 Typical Blocking Voltage Distribution (N=50, TA=25ºC) Device Count (N) Device Count (N) Typical On-Resistance Distribution (N=50, IF=10mA, IL=0.7ADC, TA=25ºC) 0 10 Turn-On Time (ms) LED Forward Voltage (V) -20 15 0 0 0 Turn-Off Time (ms) Device Count (N) 30 Device Count (N) 35 -40 Typical Turn-Off Time (N=50, IF=10mA, IL=5mADC, TA=25ºC) Typical Turn-On Time (N=50, IF=10mA, IL=5mADC, TA=25ºC) 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 80 100 Temperature (ºC) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. R07 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1926 PERFORMANCE DATA* Typical On-Resistance vs. Temperature (IF=10mA, IL=100mADC) 2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 Temperature (ºC) 80 100 1.25 1.00 0.75 0.50 0.25 0.00 -0.25 -0.50 -0.75 -1.00 -1.25 -1.5 300 0.035 295 0.030 290 0.025 Leakage (PA) Blocking Voltage (VP) Blocking Voltage vs. Temperature 285 280 275 270 -1.0 0 -0.5 0.5 1.0 -20 0 20 40 60 Temperature (ºC) 80 100 1.0 0.8 0.6 IF=20mA 0.4 IF=10mA 0.2 -40 -20 0 20 40 60 80 Load Voltage (V) Temperature (ºC) Typical Leakage vs. Temperature Measured across Pins 3 & 4 (VL=250V) Energy Rating Curve Free Air, No Heat Sink 100 120 4.0 3.5 0.020 0.015 0.010 0 -40 1.2 0.0 1.5 0.005 265 260 -40 1.4 Load Current (ADC/Arms) Load Current (A) On-Resistance (:) 3.0 Load Current (A) 3.5 -40 Maximum Load Current vs. Temperature Typical Load Current vs. Load Voltage (IF=10mA, TA=25ºC) 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 Temperature (ºC) 80 100 0.0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION CPC1926 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1926Y MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles CPC1926Y 245ºC 30 seconds 1 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R07 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1926 MECHANICAL DIMENSIONS CPC1926Y 21.082±0.381 (0.830±0.015) PCB Hole Pattern 3.302±0.051 (0.130±0.002) 10.160±0.127 (0.400±0.005) 1.75 (0.069) 7º TYP 4 Places Pin 1 1.778 (0.070) 0.762±0.076 (0.030±0.003) 2.540±0.127 (0.100±0.005) 4.572±0.127 (0.180±0.005) 10.160±0.127 (0.400±0.005) 5.080±0.127 (0.200±0.005) 1.651±0.102 (0.065±0.004) 5.080 (0.200) 10.160 (0.400) 1.016±0.127 (0.040±0.005) Pin 1 1.150 DIA. x4 (0.045 DIA. x4) 2.540 (0.100) 0.381±0.013 (0.015±0.0005) 1.778 (0.070) 7º TYP 4 Places Note: Pin-to-pin tolerances are non-cumulative. Dimensions mm (inches) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1926-R07 ©Copyright 2018, IXYS Integrated Circuits OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 6/20/2018