CPC1964G

CPC1964G AC Power Switch INTEGRATED CIRCUITS DIVISION Parameter AC Operating Voltage Load Current On-State Voltage Drop Blocking Voltage Rating 20 - 280 1 1.4 800 Units Vrms Arms VP (at IL = 1AP) VP Features • • • • • • • • • • • Load Current up to 1Arms 800VP Blocking Voltage 5mA Sensitivity 2500Vrms Input to Output Isolation Off-State dV/dt: 1000V/Ps Minimum Zero-Cross Switching DC Control, AC Output Optically Isolated TTL and CMOS Compatible Low EMI and RFI Generation High Noise Immunity Applications • • • • • • • • • • • • Description CPC1964G is an AC Solid State Switch utilizing dual power SCR outputs. This device also includes zero-cross turn-on circuitry and is specified with a blocking voltage of 800VP . In addition, the tightly controlled zero-cross circuitry ensures low noise switching of AC loads by minimizing the generation of transients. The optically coupled input and output circuits provide 2500Vrms of isolation between the control and load circuits. As a result, the CPC1964G is well suited for industrial environments where electromagnetic interference would disrupt the operation of plant facility communication and control systems. Approvals • UL 508 Certified Component: File E69938 Ordering Information Lighting Programmable Control Process Control Power Control Panels Remote Switching Gas Pump Electronics Contactors Large Relays Solenoids Motors Heaters Meters Part # CPC1964G Description 4-Pin (16-Pin Body) DIP (25/Tube) Switching Characteristics Control AC Line Pin Configuration 1 16 – LED + LED Load Current Voltage Across Relay ZC 10 AC Load 8 AC Load DS-CPC1964G-R01 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC1964G Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage (VDRM) Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage Input to Output ESD, Human Body Model i2t for Fusing (1/2 Sine Wave, 50Hz) Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 16.67 mW / ºC Ratings 800 5 50 1 150 1600 2500 4 1 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms kV A2s °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Electrical Characteristics @ 25ºC Parameters Output Characteristics Load Current, Continuous Maximum Surge Current Off State Leakage Current On-State Voltage Drop 1 Off-State dV/dt Switching Speeds Turn-on Turn-off Zero-Cross Turn-On Voltage 2 Holding Current Latching Current Operating Frequency Load Power Factor for Guaranteed Turn-On 3 Input Characteristics Input Control Current to Activate 4 Input Drop-out Voltage to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance Conditions Symbol Min Typ Max Units VL=120-280Vrms t < 20ms IF=0mA, VL=VDRM IF=5mA, IL=1.5AP IF=0mA IL IP 0.1 1000 1.21 - 1 10 100 1.4 - Arms AP PAP VP V/Ps ton toff IH IL 20 5 - 0.5 0.5 20 5 75 75 500 cycles cycles V V mA mA Hz f=60Hz PF 0.25 - - - f=60Hz, IL=1A Resistive IF=5mA VR=5V IF VF IR 0.8 0.9 - 1.2 - 5 1.4 10 mA V V PA VIO=0V, f=1MHz CIO - - 3 pF IF = 5 mA 1st half cycle Subsequent half cycle - ILEAK dV/dt 1 Tested at a peak value equivalent. 2 Zero Cross 1st half cycle @ 10mA. F 2 www.ixysic.com R01 INTEGRATED CIRCUITS DIVISION CPC1964G PERFORMANCE DATA* (@25ºC Unless Otherwise Noted) Typical LED Forward Voltage Drop (N=50, IF=5mA) 35 30 30 30 20 15 10 Device Count (N) 25 20 15 10 5 5 0 1.26 1.27 1.28 1.29 LED Forward Voltage (V) 20 15 10 0 1.30 0.6 0.8 1.0 1.2 1.4 LED Current (mA) 1.6 First Zero-Cross Turn-On Voltage Distribution (N=50, IF=5mA) 1.200 1.205 1.210 1.215 1.220 1.225 1.230 Forward Voltage (VP) 1.8 Typical Blocking Voltage Distribution (N=50) 35 30 20 Device Count (N) Device Count (N) 25 25 5 0 1.25 On-State Forward Voltage Drop (N=50, IF=5mA, IL=1.5A) 35 25 Device Count (N) Device Count (N) Typical IF for Switch Operation Resistive Load (N=50, IL=1.5A, VL=120VAC/60Hz) 15 10 5 25 20 15 10 5 0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 Zero-Cross Voltage (V) Typical LED Forward Voltage Drop vs. Temperature 850 865 880 895 910 Blocking Voltage (VP) First Zero-Cross Turn-On Voltage (IF=5mA, RL=120:) 8.5 1.3 IF=50mA IF=20mA IF=10mA IF=5mA 1.1 -20 0 20 40 60 Temperature (ºC) 80 Forward Current (mA) 3.0 2.6 2.4 2.2 2.0 -20 0 20 40 60 Temperature (ºC) 80 100 70 60 50 40 30 20 -40 100 2.8 -40 7.0 6.5 LED Forward Current to Operate vs. Temperature - Resistive Load (IL=350mA, 60Hz) 3.0 7.5 -20 0 20 40 60 Temperature (ºC) 80 100 -20 0 20 40 60 Temperature (ºC) 80 100 LED Forward Current to Operate vs.Load Frequency (VP=67V, RL=50:, IL=0.94Arms) LED Forward Current to Operate vs. Temperature - Inductive Load (IL=500mA, 60Hz, 200mH) 3.2 2.8 2.6 2.4 2.2 2.0 -40 -40 Forward Current (mA) 1.2 8.0 925 Holding Current vs. Temperature (RL=1.9:) 80 Holding Current (mA) 1.4 1.0 -40 Forward Current (mA) 0 1.5 Zero-Cross (V) LED Forward Voltage (V) 1.6 8.0 3.0 2.8 2.6 2.4 2.2 2.0 -20 0 20 40 60 Temperature (ºC) 80 100 0 100 200 300 400 Load Frequency (Hz) 500 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R01 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1964G PERFORMANCE DATA* (@25ºC Unless Otherwise Noted) Load Current vs. Load Voltage (IF=5mA) On-State Voltage vs. Temperature 3 1.30 1.25 Von@1AP 1.10 1.05 Von@0.5AP 1.00 Load Current (A) 1.15 1 0 -1 -2 0.95 -3 -1.5 0.90 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Maximum Load Current vs. Temperature (IF=5mA) -0.5 0.0 0.5 Voltage (V) 1.0 1.5 0.75 0.50 1000 950 900 850 0.25 -40 -20 0 20 40 60 Temperature (ºC) 80 -40 100 -1.0 -0.5 0.0 0.5 Load Voltage (V) 1.0 1.5 80 100 10 1050 1.00 -40ºC 25ºC 85ºC Typical Leakage Current vs. Temperature Blocking Voltage vs. Temperature Blocking Voltage (VP) 1.25 -1.0 Leakage Current (PA) Von (VP) Von@1.5AP Current (A) 2 1.20 Load Current (Arms) Typical Load Current vs. Load Voltage 2.5 2.0 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -1.5 -20 0 20 40 60 Temperature (ºC) 80 100 VL=800V VL=300V 1 0.1 0.01 0.001 -40 -20 0 20 40 60 Temperature (ºC) Maximum Surge Current vs. Time Load Current (Apeak) 12 10 8 6 4 2 0 100Ps 1ms 10ms 100ms Time 1s 10s 100s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R01 INTEGRATED CIRCUITS DIVISION CPC1964G Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1964G MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1964G 245ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. R01 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1964G Mechanical Dimensions CPC1964G 7.620 ± 0.254 (0.300 ± 0.010) 19.202 ± 0.381 (0.756 ± 0.015) 0.254 TYP (0.010 TYP) PCB Hole Pattern 0.800 DIA x 4 (0.031 DIA x 4) Pin 16 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 Pin 16 7.620 (0.300) 17.780 ± 0.127 (0.700 ± 0.005) 15.240 ± 0.127 (0.600 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.144 ± 0.508 (0.360 ± 0.020) 7.239 TYP (0.285 TYP) Pin 1 2.540 ± 0.127 (0.100 ± 0.005) 15.240 (0.600) 17.780 (0.700) 4.064 TYP (0.160 TYP) 0.559 ± 0.102 (0.022 ± 0.004) 0.457 ± 0.076 (0.018 ± 0.003) Dimensions mm (inches) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1964G-R01 ©Copyright 2014, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 9/24/2014