CPC1965G

CPC1965G AC Solid State Relay INTEGRATED CIRCUITS DIVISION Parameter AC Operating Voltage Load Current On State Voltage Drop Rating 260 1 1.6 Features • Load Current up to 1Arms • 600VP Blocking Voltage • 5mA Sensitivity • Zero-Crossing Detection • DC Control, AC Output • Optically Isolated • Low EMI and RFI Generation • High Noise Immunity • Flammability Rating UL 94 V-0 Applications • Programmable Control • Process Control • Power Control Panels • Remote Switching • Gas Pump Electronics • Contactors • Large Relays • Solenoids • Motors • Heaters Units Vrms Arms Vrms (at IL = 1Arms) Description The CPC1965G is an AC Solid State Switch using patented waveguide coupling with dual power SCR outputs to produce an alternative to optocoupler and Triac circuits. The switches are robust enough to provide a blocking voltage of up to 600VP . In addition, tightly controlled zero-cross circuitry ensures switching of AC loads without the generation of transients. The input and output circuits are optically coupled to provide 3750Vrms of isolation and noise immunity between control and load circuits. As a result, the CPC1965G is well suited for industrial environments where electromagnetic interference could disrupt the operation of electromechanical relays. Approvals • UL Recognized Component: File E69938 • CSA Certified Component: File 043639 Ordering Information Part # CPC1965G Description 4-Pin (16-Pin Body) DIP (25/Tube) Pin Configuration 1 16 – LED + LED ZC 10 AC Load 8 AC Load DS-CPC1965G-R08 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC1965G Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 PD , Total Package Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature Ratings Units 600 VP 5 V 100 mA 1 A 150 mW 1600 mW 3750 Vrms -40 to +85 °C -40 to +125 °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 16.6 mW / ºC Electrical Characteristics @ 25ºC Parameters Output Characteristics Operating Voltage Range Load Current, Continuous Non-Repetitive Single Cycle Surge Current Off State Leakage Current On-State Voltage Drop Critical Rate of Rise 3 Switching Speeds Turn-on Turn-off Zero-Cross Turn-On Voltage 1 Operating Frequency Load Power Factor for Guaranteed Turn-On 2 Input Characteristics Input Control Current to Activate 4 Input Voltage Drop Input Drop-out Voltage Reverse Input Current Common Characteristics Input to Output Capacitance Conditions Symbol Min Typ Max Units VL VL=120-260Vrms VL=600VP IL=1Arms - IL dV/dt 20 0.005 1000 - 260 1 10 1 1.6 - Vrms Arms A mA Vrms V/µs 1st half-cycle Subsequent half-cycle - ton toff PF 20 0.25 2 1 - 0.5 0.5 10 400 - IF=5mA VR=5V IF VF IR 0.9 0.8 - 0.8 1.2 - 5 1.5 10 mA V V µA VIO=0V, f=1MHz CIO - 3 - pF IF=5 mA ITSM ILEAK cycles V V Hz - 1 Zero Cross 1st half-cycle @ 10mA. F 2 www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION CPC1965G PERFORMANCE DATA* Typical LED Forward Voltage Drop (IF=5mA, TA=25ºC) Device Count (N) Device Count (N) 30 25 20 15 10 5 0 Typical On-State Voltage (IL=1Arms, TA=25ºC) 25 20 20 Device Count (N) 35 15 10 5 1.26 1.27 1.28 1.29 LED Forward Voltage (V) 1.30 1.01 10 5 1.04 1.07 1.10 1.13 On-State Voltage (Vrms) 795 1.16 800 805 810 815 820 Blocking Voltage (VP) 825 Typical IF for Switch Operation (IL=1Arms, TA=25ºC) 20 Device Count (N) 15 0 0 1.25 Typical Blocking Voltage Distribution (TA=25ºC) 15 10 5 0 0.77 0.90 1.5 LED Forward Current (mA) LED Forward Voltage (V) 1.6 IF=50mA IF=20mA 1.4 1.3 1.2 1.1 -40 IF=10mA IF=5mA -20 0 20 40 60 Temperature (ºC) 80 100 0.79 0.80 0.81 LED Current (mA) 0.82 0.83 Typical IF for Switch Operation vs. Temperature (IL=500mArms) 1.15 On-State Voltage (Vrms) Typical LED Forward Voltage vs. Temperature 0.78 0.85 0.80 0.75 0.70 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Typical On-State Voltage vs. Temperature (IL=500mArms) 1.10 1.05 1.00 0.95 0.90 0.85 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. R08 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1965G PERFORMANCE DATA* Typical Blocking Voltage vs. Temperature Typical Maximum Load Current vs. Temperature 1000 1000 900 800 700 600 Typical Leakage vs. Temperature (VL=600VP) 280 950 260 Leakage (PA) 1100 Blocking Voltage (VP) Load Current (mArms) 1200 900 850 800 240 220 200 500 400 -40 -20 0 20 40 60 Temperature (ºC) 80 100 750 -40 180 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Maximum Surge Current (Non-Repetitive) (TJ=50ºC max) Peak Surge Current (A) 12 10 8 6 4 2 0 16 50 Pulse Duration (ms) 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION CPC1965G Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1965G MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles CPC1965G 245ºC 30 seconds 1 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R08 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1965G MECHANICAL DIMENSIONS CPC1965G 7.620 ± 0.254 (0.300 ± 0.010) 19.202 ± 0.381 (0.756 ± 0.015) 0.254 TYP (0.010 TYP) PCB Hole Pattern 0.800 DIA x 4 (0.031 DIA x 4) Pin 16 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 Pin 16 7.620 (0.300) 17.780 ± 0.127 (0.700 ± 0.005) 15.240 ± 0.127 (0.600 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.144 ± 0.508 (0.360 ± 0.020) 7.239 TYP (0.285 TYP) Pin 1 2.540 ± 0.127 (0.100 ± 0.005) 15.240 (0.600) 17.780 (0.700) 4.064 TYP (0.160 TYP) 0.559 ± 0.102 (0.022 ± 0.004) Dimensions mm (inches) 0.457 ± 0.076 (0.018 ± 0.003) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1965G-R08 ©Copyright 2018, IXYS Integrated Circuits OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 6/20/2018