CPC1966YX8

CPC1966YX8 Rapid Turn-On AC Power Switch INTEGRATED CIRCUITS DIVISION Parameter AC Operating Voltage Continuous Load Current On-State Voltage Drop Typical Turn-On Time Blocking Voltage Rating 20 - 240 3 1.1 20 800 Units Vrms Arms VP (at IL = 2AP) s VP Features • • • • • • • • • • Load Current up to 3Arms 800VP Blocking Voltage Rapid Turn-On (Non-Zero-Cross Turn-On) Typical Turn-On Time: 20s 5mA Sensitivity DC Input Switches AC Signal Optically Isolated Low EMI and RFI Generation High Noise Immunity Flammability Rating UL 94 V-0 Applications • • • • • • • • • • • • Lighting HVAC (Heating, Ventilation, Air Conditioning) Programmable Control Process Control Power Control Panels Remote Switching Gas Pump Electronics Contactors Large Relays Solenoids Motors Heaters Description CPC1966YX8 is an AC Solid State Switch utilizing dual power SCR outputs. This device features Rapid Turn-On (non-zero-cross) control of the output SCRs, which makes it ideal for precisely switching AC loads independent of the load voltage phase. The optically coupled input and output circuits provide 3750Vrms of isolation and noise immunity between the control and load circuits. As a result, the CPC1966YX8 is well suited for industrial environments where electromagnetic interference would disrupt the operation of plant facility communication and control systems. Approvals • UL Recognized Component: File E69938 • CSA Certified Component: Certificate 1172007 Ordering Information Part # CPC1966YX8 Description 4-Pin (8-Pin Body) Power SIP Package (25/Tube) Pin Configuration R 1 2 – LED + LED 3 4 AC Load AC Load Rapid Turn-On (Non-Zero-Cross) Waveforms Control AC Load Voltage Load Current Voltage Across Relay DS-CPC1966YX8-R01 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC1966YX8 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 i2t Fusing Current (1/2 Sine Wave, 60Hz) ESD, Human Body Model Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 2 Symbol VDRM VR PD Ratings 800 5 50 1 150 2400 Units VP V mA A mW mW - 8 A2s VIO TA TA 4 3750 -40 to +85 -40 to +125 kV Vrms °C °C IF Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / ºC Derate linearly 20 mW / ºC Electrical Characteristics @ 25ºC Parameters Output Characteristics Load Current, Continuous Maximum Surge Current Off State Leakage Current On-State Voltage Drop Critical Rate of Rise of On-State Current Off-State dV/dt Switching Speeds Turn-on Turn-on Turn-off Holding Current Latching Current Operating Frequency Input Characteristics Input Control Current to Activate 1 Input Drop-out Voltage Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 Conditions Symbol Min Typ Max Units VL=20-240Vrms t < 16ms VDRM IL=2AP - IL IP ILEAK di/dt dV/dt 0.1 1000 0.88 - 3 30 100 1.1 75 - Arms A AP VP A/s V/s IF = 5 mA, Resistive Load, VL=20V ton 20 45 44 48 - 20 0.5 50 75 500 s cycles mA mA Hz IF = 15 mA, Resistive Load, VL=20V - toff IH IL IF=5mA VR=5V IF VF IR 0.8 0.9 - 1.2 - 5 1.4 10 mA V V A VIO=0, f=1MHz CIO - 1 - pF For high-noise environments, or for high-frequency operation, use IF > 10mA. www.ixysic.com R01 INTEGRATED CIRCUITS DIVISION CPC1966YX8 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* LED Forward Voltage Drop vs. Temperature Typical IF for Switch Operation vs. Temperature 125 IF=50mA 1.4 IF=30mA 1.3 IF=10mA 1.2 Holding Current (mA) 1.75 1.5 LED Current (mA) Forward Voltage (V) 1.6 100 1.50 1.25 1.00 IF=5mA 1.1 1.0 -40 -20 0 20 40 60 Temperature (ºC) 80 0.75 -40 100 Holding Current vs. Temperature (IF=0mA) 75 50 25 0 -20 0 20 40 60 Temperature (C) 80 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 80 100 Typical Turn-On Time vs. Temperature (IF=15ma, VL=20V) Turn-On Time vs. LED Current (IL=1A) 35 15 Turn-On Time (Ps) Turn-On Time (Ps) 30 25 20 15 10 10 5 5 0 0 0 10 20 30 40 LED Forward Current (mA) Load Current vs. Load Voltage (IF=5mA) -40 50 0 20 40 60 Temperature (ºC) 4.0 IL=3A 0 -1 1.00 3.5 Load Current (A) Voltage Drop (V) 1 100 Maximum Load Current vs. Temperature (IF=5mA) 1.25 2 IL=2A IL=1A 0.75 -2 -3 -1.0 80 Voltage Drop vs. Temperature 3 Load Current (A) -20 3.0 2.5 2.0 1.5 1.0 0.5 -0.5 0.0 0.5 1.0 0.50 0.0 -40 -20 0 Load Voltage (V) 20 40 60 Temperature (ºC) 100 -40 -20 0 20 40 60 Temperature (ºC) Typical Leakage Current vs. Temperature Blocking Voltage vs. Temperature 1100 10000 Leakage Current (nA) Blocking Voltage (VP) 80 1050 1000 950 900 850 800 -40 -20 0 20 40 60 Temperature (ºC) 80 100 1000 VL=800V 100 VL=300V 10 1 -40 -20 0 20 40 60 Temperature (ºC) 80 100 * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R01 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1966YX8 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1966YX8 MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed.. Device Classification Temperature (Tc) Dwell Time (tp) Max Cycles CPC1966YX8 245ºC 30 seconds 1 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. 4 www.ixysic.com R01 INTEGRATED CIRCUITS DIVISION CPC1966YX8 MECHANICAL DIMENSIONS CPC1966YX8 21.082±0.381 (0.830±0.015) PCB Hole Pattern 3.302±0.051 (0.130±0.002) 10.160±0.127 (0.400±0.005) 1.150 DIA. x4 (0.045 DIA. x4) 1.75 (0.069) 7º TYP 4 Places 5.080 (0.200) Pin 1 1.778 (0.070) 0.762±0.076 (0.030±0.003) 2.540±0.127 (0.100±0.005) 10.160 (0.400) 1.016±0.127 (0.040±0.005) Pin 1 4.572±0.127 (0.180±0.005) 10.160±0.127 (0.400±0.005) 5.080±0.127 (0.200±0.005) 1.651±0.102 (0.065±0.004) 2.540 (0.100) 0.381±0.013 (0.015±0.0005) 1.778 (0.070) 7º TYP 4 Places Note: Pin-to-pin tolerances are non-cumulative. Dimensions mm (inches) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 5 Specification: DS-CPC1966YX8-R01 ©Copyright 2016, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 9/2/2016