CPC1968J

CPC1968 500V Single-Pole, Normally Open Power Relay INTEGRATED CIRCUITS DIVISION Characteristics Parameter Blocking Voltage Description Rating Units 500 VP The CPC1968 single-pole normally open (1-Form-A) Solid State Power Relay is rated for up to 5A continuous load current with a 5°C/W heat sink. Load Current, TA=25°C: With 5°C/W Heat Sink 5 No Heat Sink 2 On-Resistance 0.35  Thermal Impedance, Junction-to-Case, JC 0.3 °C/W Arms / ADC Features • • • • • • • • • • 5A Load Current with 5°C/W Heat Sink Low 0.35 On-Resistance 500VP Blocking Voltage 2500Vrms Input/Output Isolation Low Thermal Impedance: JC = 0.3 °C/W Isolated, Low Thermal Impedance Ceramic Pad for Heat Sink Applications Low Drive Power Requirements Arc-Free With No Snubbing Circuits No EMI/RFI Generation Flammability Rating UL 94 V-0 Applications • • • • • • • • • • • Industrial Controls / Motor Control Robotics Medical Equipment—Patient/Equipment Isolation Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Transportation Equipment Aerospace/Defense Approvals Optically coupled MOSFET technology enables the CPC1968 to provide 2500Vrms of input to output isolation. The output, constructed with efficient MOSFET switches and photovoltaic die, uses IXYS Integrated Circuits’ patented OptoMOS architecture while the input, a highly efficient infrared LED, provides the optically coupled control. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance switching applications. The unique ISOPLUS-264 package pioneered by IXYS enables Solid State Relays to achieve the highest load current and power ratings. This package features a unique IXYS process in which the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation, but also very low junction-to-case thermal impedance (0.3 °C/W). Ordering Information Part Description CPC1968J ISOPLUS-264 Package (25 per tube) Switching Characteristics • UL 508 Recognized Component: File E69938 Form-A Pin Configuration IF 90% 10% ILOAD ton DS-CPC1968-R04 www.ixysic.com toff 1 CPC1968 INTEGRATED CIRCUITS DIVISION 1 Specifications 1.1 Absolute Maximum Ratings @ 25°C Symbol Ratings Units 500 VP Reverse Input Voltage 5 V Input Control Current 100 mA 1 A Input Power Dissipation 150 mW Isolation Voltage, Input to Output 2500 Vrms Operational Temperature -40 to +85 °C Storage Temperature -40 to +125 °C Blocking Voltage Peak (10ms) Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. 1.2 Electrical Characteristics @ 25°C Parameter Conditions Symbol Minimum Typical Maximum Units ±25 AP Output Characteristics Load Current 1 Peak Continuous t10ms IL Continuous No Heat Sink TC=25°C Continuous TC=99°C IL(99) IF=10mA, IL=1A RON - - 0.35  VL=500VP ILEAK - - 1 A ton - 4.6 20 toff - 0.07 5 - 620 - - 3500 - On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance IF=20mA, VL=10V - - 2 15 Arms / ADC 7.1 ms IF=0mA, VL=25V, f=1MHz IF=0mA, VL=1V, f=1MHz Cout IL=1A IF - 2.45 10 mA IF=10mA IF 0.6 - - mA VF 0.9 1.35 1.56 V VR=5V IR - - 10 A VIO=0V, f=1MHz CIO - 1 - pF pF Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Input/Output Characteristics Capacitance, Input-to-Output 1 Higher load currents possible with proper heat sinking. Measurement taken within 1 second of on-time. 3 For applications requiring high temperature operation (T > 60ºC) an LED drive current of 20mA is recommended. C 2 2 www.ixysic.com R04 CPC1968 INTEGRATED CIRCUITS DIVISION 2 Thermal Characteristics Parameter Conditions Symbol Rating Units - JC 0.3 °C/W Free Air JA 33 °C/W - TJ -40 to +110 °C Thermal Impedance (Junction to Case) Thermal Impedance (Junction to Ambient) Junction Temperature (Operating) 2.1 Thermal Management Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient thermal impedance of 12.5°C/W. 2.2 Heat Sink Calculation Higher load currents are possible by using lower thermal impedance heat sink combinations. Heat Sink Rating θCA = (TJ - TA) IL(99)2 IL2 • PD(99) - θJC TJ = Junction Temperature (°C), TJ ≤ 110°C * TA = Ambient Temperature (°C) IL(99) = Load Current with Case Temperature @ 99°C (ADC) IL = Desired Operating Load Current (ADC), IL ≤ IL(MAX) θJC = Thermal Impedance, Junction to Case (°C/W) = 0.3°C/W θCA = Thermal Impedance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W) PD(99) = Maximum power dissipation with case temperature held at 99ºC = 31W * Elevated junction temperature reduces semiconductor lifetime. NOTE: The exposed surface of the DCB substrate is not to be soldered. R04 www.ixysic.com 3 CPC1968 INTEGRATED CIRCUITS DIVISION 3 Performance Data* Unless otherwise specified, all performance data was acquired without the use of a heat sink. 40 Typical LED Forward Voltage Drop (N=50, IF=5mA) Typical Turn-On Time (N=50, IF=20mA, IL=1A) 25 25 20 15 10 25 20 Device Count (N) Device Count (N) Device Count (N) 35 30 15 10 5 0 3.7 Device Count (N) 25 15 10 5 4.3 4.6 4.9 5.2 Turn-On Time (ms) 5.5 0.060 0.065 0.070 0.075 0.080 0.085 0.090 Turn-Off Time (ms) Typical On-Resistance Distribution (N=50, IF=10mA, IL=1A) Typical Blocking Voltage Distribution (N=50, IF=0mA, IL=10µA) 20 15 10 5 25 Typical LED Forward Voltage Drop vs. Temperature Typical Turn-On Time vs. LED Forward Current (IL=1A) Turn-On Time (ms) 1.4 1.3 1.2 -40 -20 0 20 40 60 Temperature (ºC) 80 15 10 5 100 12 5 545 550 555 560 565 Blocking Voltage (VP) 570 575 Typical Turn-Off Time vs. LED Forward Current (IL=1A) 75 70 65 60 0 Typical IF for Switch Operation vs. Temperature (IL=1A) 10 80 0 1.1 15 540 Turn-Off Time (µs) 20 1.5 20 0 0.260 0.265 0.270 0.275 0.280 0.285 0.290 On-Resistance (Ω) IF=50mA IF=20mA IF=10mA IF=5mA 10 5.8 1.65 1.90 2.15 2.40 2.65 2.90 3.15 3.40 LED Forward Current (mA) 1.6 LED Forward Voltage (V) 4.0 0 0 15 0 1.240 Typical IF for Switch Operation (N=50, IL=1A) 20 Device Count (N) 1.220 1.225 1.230 1.235 LED Forward Voltage (V) Device Count (N) 1.215 20 5 5 0 Typical Turn-Off Time (N=50, IF=20mA, IL=1A) 30 10 20 30 LED Current (mA) 40 50 0 Typical Turn-On Time vs. Temperature (VL=10V) 14 10 20 30 LED Current (mA) 40 50 Typical Turn-Off Time vs. Temperature (VL=10V) 80 8 6 4 12 Turn-Off Time (µs) Turn-On Time (ms) LED Current (mA) 75 10 IF=10mA 10 8 IF=20mA 6 70 IF=20mA 65 60 IF=10mA 55 50 45 2 4 -40 -20 0 20 40 60 Temperature (ºC) 80 100 40 -40 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R04 CPC1968 INTEGRATED CIRCUITS DIVISION Typical On-Resistance vs. Temperature (IF=20mA, IL=1A) 0.35 0.30 2 0 -2 -4 0.20 -6 -1.5 20 40 60 Temperature (ºC) 80 100 Typical Blocking Voltage vs. Temperature (IL=50μA) 590 Leakage Current (μA) 570 560 550 540 530 520 -0.5 0.0 0.5 Load Voltage (V) 1.0 -20 0 20 40 60 Temperature (ºC) 80 30 25 20 15 10 5 100 0 20 40 60 Temperature (ºC) 80 100 Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) 3500 35 3000 2500 2000 1500 1000 500 0 0 -40 4 1.5 Leakage Current vs. Temperature Measured Across Pins 1&2 (IF=0mA, VL=500VP) 40 580 6 0 -1.0 Output Capacitance (pF) 0 8 2 0.25 -20 Heat Sink 1ºC/W 5ºC/W 10ºC/W Free Air 10 Load Current (A) 0.40 Maximum Load Current vs. Temperature (IF=20mA) 12 4 -40 Blocking Voltage (VP) 6 0.45 Load Current (A) On-Resistance (Ω) 0.50 Typical Load Current vs. Load Voltage (IF=20mA) -40 -20 0 20 40 60 Temperature (ºC) 80 100 10s 100s 0 50 100 150 Load Voltage (V) 200 Energy Rating Curve 30 Load Current (A) 25 20 15 10 5 0 10μs 100μs 1ms 10ms 100ms Time 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. R04 www.ixysic.com 5 CPC1968 INTEGRATED CIRCUITS DIVISION 4 Manufacturing Information 4.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1968J MSL 1 4.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 4.3 Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (TC) Dwell Time (tp) Max Reflow Cycles CPC1968J 245°C 30 seconds 1 NOTE: The exposed surface of the DCB substrate is not to be soldered. 4.4 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. 6 www.ixysic.com R04 CPC1968 INTEGRATED CIRCUITS DIVISION 4.5 Mechanical Dimensions 5.029 ± 0.127 (0.198 ± 0.005) 19.914 ± 0.254 (0.784 ± 0.010) 1.181 ± 0.076 (0.047 ± 0.003) 17.221 ± 0.254 (0.678 ± 0.010) 1.930 ± 0.381 (0.076 ± 0.015) 26.162 ± 0.254 (1.030 ± 0.010) 20.600 ± 0.254 (0.811 ± 0.010) DCB Substrate NOTE: Not to be soldered 2.362 ± 0.381 (0.093 ± 0.015) 20.396 ± 0.508 (0.803 ± 0.020) DIMENSIONS mm (inches) 3.810 ± 0.254 (0.150 ± 0.010) 15.240 ± 0.508 (0.600 ± 0.020) 0.635 ± 0.076 (0.025 ± 0.003) 1.270 TYP (0.050 TYP) 2.794 ± 0.127 (0.110 ± 0.005) NOTE: Metallized external surface of DCB substrate maintains 2500Vrms isolation to device internal structure and all external pins. For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits’ Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits’ product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1968-R04 ©Copyright 2018, IXYS Integrated Circuits All rights reserved. Printed in USA. 6/20/2018 R04 www.ixysic.com 7