CPC1976YX6

CPC1976YX6 Rapid Turn-On AC Power Switch INTEGRATED CIRCUITS DIVISION Parameter AC Operating Voltage Load Current On-State Voltage Drop Blocking Voltage Rating 20 - 240 2 1.25 600 Units Vrms Arms VP (at IL = 2AP) VP CPC1976YX6 is an AC Solid State Switch utilizing dual power SCR outputs. This device features Rapid Turn-On (non-zero-cross) control of the output SCRs, which makes it ideal for precisely switching AC loads independent of the load voltage phase. The optically coupled input and output circuits provide 3750Vrms of isolation and noise immunity between the control and load circuits. As a result, the CPC1976YX6 is well suited for industrial environments where electromagnetic interference would disrupt the operation of plant facility communication and control systems. Features • • • • • • • • • • • • Description Load Current up to 2Arms 600VP Blocking Voltage High Surge Current: 20A Rapid Turn-On (Non-Zero-Cross Turn-On) 5mA Sensitivity Creepage Distance: 0.125" on Output Pins DC Control, AC Output Optically Isolated TTL and CMOS Compatible Low EMI and RFI Generation High Noise Immunity Machine Insertable, Wave Solderable Approvals • UL Recognized Component: File E69938 • CSA Certified Component: Certificate 1172007 Ordering Information Applications • • • • • • • • • • • • HVAC Control (Heating, Ventilation, Air Conditioning) Lighting Programmable Control Process Control Power Control Panels Remote Switching Gas Pump Electronics Contactors Large Relays Solenoids Motors Heaters Part # CPC1976YX6 Description 4-Pin (8-Pin Body) SIP (25/Tube) Pin Configuration R 1 2 – LED + LED 3 4 AC Load AC Load Rapid Turn-On (Non-Zero-Cross) Waveforms Control AC Load Voltage Load Current Voltage Across Relay DS-CPC1976YX6-R02 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC1976YX6 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage (VDRM) Reverse Input Voltage Input Control Current Peak (10ms) di/dt Critical Rate of Rise of On-State Current Input Power Dissipation 1 Total Power Dissipation 2 ESD, Human Body Model i2t for Fusing (1/2 Sine Wave, 60Hz) Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 20 mW / ºC Ratings 600 5 50 1 Units VP V mA A 40 A/s 150 2400 4 3.5 3750 -40 to +85 -40 to +125 mW mW kV A2s Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Electrical Characteristics @ 25ºC Parameters Output Characteristics Load Current, Continuous Maximum Surge Current Off State Leakage Current On-State Voltage Drop Critical Rate of Rise Switching Speeds Turn-on Turn-off Holding Current Latching Current Operating Frequency Input Characteristics Input Control Current to Activate 1 Input Drop-out Voltage Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 Conditions Symbol Min Typ Max Units VL=20-240Vrms t < 16ms VDRM IL=2AP - IL IPK 0.070 1000 1.1 1200 2 20 10 1.25 - Arms A A VP V/s ton toff IH IL 20 20 - 500 0.5 75 100 500 s cycle mA mA Hz 60Hz IF=5mA VR=5V IF VF IR 0.8 0.9 - 1.2 - 5 1.4 10 mA V V A - CI/O - - 3 pF IF = 5 mA, Resistive VL=20V, 60Hz - ILEAK dv/dt For high-noise environments, or for high-frequency operation, use IF > 10mA. www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION CPC1976YX6 PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)* LED Forward Voltage Distribution (N=50, IF=5mA) 35 30 25 25 20 15 10 Device Count (N) 25 Device Count (N) Device Count (N) 30 LED Current to Operate Distribution (N=50, VL=120VAC/60Hz) 20 15 10 1.25 1.26 1.27 1.28 1.29 LED Forward Voltage (V) 1.5 1.30 15 10 0 0 0 20 5 5 5 On-State Voltage Drop Distribution (N=50, IF=5mA, IL=2AP) 1.7 1.9 2.1 2.3 LED Current (mA) 2.5 1.04 2.7 1.06 1.08 1.10 1.12 On-State Voltage Drop (V) 1.14 Typical Blocking Voltage Distribution (N=50) Device Count (N) 25 20 15 10 5 0 747 768 IF=50mA IF=20mA IF=10mA IF=5mA 1.3 1.2 2.6 2.5 Holding Current (mA) LED Current to Operate (mA) LED Forward Voltage (V) 1.6 1.4 753 756 759 762 765 Blocking Voltage (VP) LED Current to Operate vs. Temperature (Resistive Load) (IL=1A, f=60Hz) LED Forward Voltage vs. Temperature 1.5 750 2.4 2.3 2.2 2.1 2.0 1.9 1.8 1.1 -40 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 Temperature (ºC) Typical Turn-On Time vs. LED Forward Current 80 100 Holding Current vs. Temperature (RL=1.9:) 100 90 80 70 60 50 40 30 20 10 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Turn-On Time vs. Temperature 20 70 IF=5mA Turn-On Time (Ps) Turn-On Time (Ps) 60 50 40 30 20 15 IF=10mA 10 5 10 0 0 0 10 20 30 40 LED Forward Current (mA) 50 -40 -20 0 20 40 60 Temperature (ºC) 80 100 * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R02 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1976YX6 PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)* 3 1.0 0.9 IL=2.5A IL=2A IL=1A IL=0.5A 0.8 -40 -20 1 0 -1 -2 0.7 0 20 40 60 Temperature (ºC) 80 -3 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 Load Voltage (V) 100 850 800 750 -40 -20 0 20 40 60 Temperature (ºC) 80 100 0.5 -20 0 20 40 60 Temperature (ºC) 80 100 Maximum Non-Repetitive Surge Current (Values Apply to TJ=50ºC Before Surge) 25 VL=600V VL=400V VL=200V 1000 100 10 1 20 15 10 5 0 0.1 700 1.0 -40 Load Current (AP) Leakage Current (PA) Blocking Voltage (VP) 900 1.5 2.0 10000 950 2.0 0.0 1.5 Leakage Current vs. Temperature Blocking Voltage vs. Temperature Maximum Load Current vs. Temperature (IF=5mA) 2.5 TA=+85ºC TA=+25ºC TA= -40ºC 2 1.1 Load Current (A) Load Voltage (V) 1.2 Load Current vs. Load Voltage (IF=5mA) Load Current (Arms) Load Voltage vs. Temperature (IF=5mA) -40 -20 0 20 40 60 Temperature (ºC) 80 100 0.1 1 10 Time (ms) 100 1000 * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION CPC1976YX6 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1976YX6 MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1976YX6 245ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. R02 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1976YX6 MECHANICAL DIMENSIONS CPC1976YX6 21.082±0.381 (0.830±0.015) PCB Hole Pattern 3.302±0.051 (0.130±0.002) 10.160±0.127 (0.400±0.005) 1.75 (0.069) 7º TYP 4 Places Pin 1 1.778 (0.070) 0.762±0.076 (0.030±0.003) 2.540±0.127 (0.100±0.005) 4.572±0.127 (0.180±0.005) 10.160±0.127 (0.400±0.005) 5.080±0.127 (0.200±0.005) 1.651±0.102 (0.065±0.004) 5.080 (0.200) 10.160 (0.400) 1.016±0.127 (0.040±0.005) Pin 1 1.150 DIA. x4 (0.045 DIA. x4) 0.381±0.013 (0.015±0.0005) 2.540 (0.100) 1.778 (0.070) 7º TYP 4 Places Dimensions mm (inches) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1976YX6-R02 ©Copyright 2014, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 6/11/2014