CPC2125NTR

CPC2125N 400V, 100mA Dual Single-Pole Normally Closed Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Forward Current (to Activate) Rating 400 100 35 2 Units VP mArms / mADC  mA The CPC2125N is a miniature device with two independent normally-closed (1-Form-B) solid state relays in an 8-pin SOIC package that employs optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. Optically coupled outputs, using the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Features • • • • • • Description 1500Vrms Input/Output Isolation No EMI/RFI Generation Immune to Radiated EM Fields Tape & Reel Version Available Small 8-Pin SOIC Package Flammability Rating UL 94 V-0 Constructed using IXYS Integrated Circuits' state of the art double-molded, vertical construction packaging, this device is one of the world’s smallest relays. It offers substantial board space savings over the competitor’s larger 8-pin SOIC relay. Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Security • Passive Infrared Detectors (PIR) • Data Signaling • Sensor Circuitry • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Medical Equipment—Patient/Equipment Isolation • Industrial Controls Approvals • UL Recognized Component: File E76270 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # CPC2125N CPC2125NTR Description 8-Pin SOIC (50/tube) 8-Pin SOIC (2000/reel) Pin Configuration 1 8 + Control Load 7 2 – Control Load 3 6 + Control Load 4 5 – Control Load Switching Characteristics of Normally-Closed (Form-B) Devices Form-B IF ILOAD 10% toff DS-CPC2125N-R06 www.ixysic.com 90% ton 1 INTEGRATED CIRCUITS DIVISION CPC2125N Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage LED Forward Current Peak (10ms) Input Power Dissipation Total Power Dissipation 1 Isolation Voltage, Input to Output (60 Seconds) ESD Rating, Human Body Model Operational Temperature, Ambient Storage Temperature 1 Ratings 400 5 50 1 70 600 Units VP V mA A mW mW 1500 Vrms 8 -40 to +85 -40 to +125 kV °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 5mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Switching Speeds Turn-On Turn-Off Off-State Leakage Current Output Capacitance Input Characteristics LED Forward Current To Activate 3 To Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 3 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 400 - - V IF=0mA t =10ms IL=100mA IL ILPK RON - 26 100 ±350 35 mArms / mADC mAP  IF=5mA, VL=10V ton toff VL=400V, IF=2mA IF=2mA, VL= 50V, f=1MHz ILEAK COUT - 0.31 0.30 6 2 2 5 - 0.1 0.9 - 1.36 - 2 1.5 10 IL=100mA IF=5mA VR=5V IF VF IR VIO=0V, f=1MHz CIO 1 Load current derates linearly from 100mA @ 25oC to 60mA @ 85oC, and must be derated if both poles are operating simultaneously. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60°C) a minimum LED forward current of 4mA is recommended. www.ixysic.com - ms µA pF mA V µA pF R06 INTEGRATED CIRCUITS DIVISION CPC2125N PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) 20 15 10 5 15 10 5 0 0 1.364 0.12 Device Count (N) 15 10 5 20 15 10 0.28 0.30 0.32 0.34 Turn-On Time (ms) 30 20 10 0 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 LED Forward Voltage (V) 0.26 0.29 0.32 0.35 Turn-Off Time (ms) 0.6 0.5 0.4 0.3 -20 0 20 40 60 Temperature (ºC) 80 1.3 1.2 Typical Turn-Off Time vs. LED Forward Current (IL=60mA) 800 600 400 -50 -25 0 25 50 Temperature (ºC) 75 100 0 -50 -2 -1 0 1 Load Voltage (V) 2 3 Typical Turn-On Time vs. LED Forward Current (IL=60mA) 316 314 312 310 308 0 1.0 470 50 318 200 1.1 420 430 440 450 460 Blocking Voltage (VP) Typical Load Current vs. Load Voltage (IF=0mA) -3 Turn-On Time (Ps) Turn-Off Time (Ps) 1.4 410 100 100 1000 IF=10mA IF=5mA IF=2mA 5 -150 1200 1.5 10 -100 0.2 Typical LED Forward Voltage Drop vs. Temperature 1.6 28 15 150 0.7 -40 1.7 28 20 400 0.1 1.8 25 26 27 On-Resistance (:) Typical Blocking Voltage Distribution (N=50, IF=2mA) 0.38 Load Current (mA) LED Forward Current (mA) 40 0.23 Typical LED Forward Current to Activate (IL=60mA) 0.8 50 25 0 0.20 0.36 LED Forward Voltage vs. LED Forward Current LED Forward Current (mA) 25 0 0.26 5 24 5 0.24 10 0.22 25 0 LED Forward Voltage Drop (V) 0.14 0.16 0.18 0.20 LED Forward Current (mA) Typical Turn-Off Time (N=50, IF=5mA, IL=60mA) 30 20 15 0 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical Turn-On Time (N=50, IF=5mA, IL=60mA) 25 Device Count (N) 20 Device Count (N) Device Count (N) 25 Typical On-Resistance Distribution (N=50, IF=0mA, IL=100mA) 20 Device Count (N) 30 Typical LED Forward Current to Activate (N=50, IL=120mA) 306 0 10 20 30 40 LED Forward Current (mA) 50 0 10 20 30 40 LED Forward Current (mA) 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R06 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC2125N PERFORMANCE DATA* 45 Typical On-Resistance vs. Temperature (IF=0mA, IL=60mA) Typical Turn-Off Time vs. Temperature (IL=60mA) 2000 500 35 30 25 1600 1200 IF=5mA 800 400 450 Turn-On Time (Ps) Turn-Off Time (Ps) On-Resistance (:) IF=2mA 40 Typical Turn-On Time vs. Temperature (IL=60mA) 400 350 300 250 IF=5mA 200 IF=2mA 150 20 0 0 20 40 60 Temperature (ºC) 80 100 -40 Maximum Load Current vs. Temperature (IF=0mA) 110 100 90 80 70 60 -20 0 20 40 60 Temperature (ºC) 80 100 460 455 450 445 -20 0 20 40 60 Temperature (ºC) Output Capacitence (pF) 70 80 100 -20 0 20 40 60 Temperature (ºC) Output Capacitance vs. Load Voltage (IF=2mA, f=1MHz) 50 40 30 20 10 0 1 20 40 60 Temperature (ºC) 80 100 4 3 2 1 10 100 Load Voltage (V) 1000 80 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve 60 0.1 0 0 -40 Load Current (A) -40 -20 Leakage Current vs. Temperature Measured Across Pins 5&6, 7&8 (IF=2mA, VL=400V) 5 440 50 100 -40 Typical Blocking Voltage vs. Temperature (IF=5mA) 465 Blocking Voltage (VP) Load Current (mA) -20 Leakage Current (PA) -40 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC2125N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC2125N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles CPC2125N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R06 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC2125N MECHANICAL DIMENSIONS CPC2125N 1.016 ± 0.025 (0.040 ± 0.001) 9.347 ± 0.203 (0.368 ± 0.008) Pin 1 2.184 MAX (0.086 MAX) 0.432 ± 0.127 (0.017 ± 0.005) Pin to Package Standoff MIN 0.0254 (0.001) (MAX 0.102 (0.004) 0.838 ± 0.102 (0.033 ± 0.004) PCB Land Pattern 5.60 (0.22) 1.30 (0.051) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.051 (0.150 ± 0.002) 2.540 TYP (0.100 TYP) 0.203 ± 0.025 (0.008 ± 0.001) 0.381 ± 0.051 (0.015 ± 0.002) 2.54 (0.100) 0.55 (0.022) Dimensions mm (inches) Note: 1. Lead dimensions do not include plating: 1000 microinches max. CPC2125NTR Tape & Reel 1.75 ± 0.10 330.2 DIA. (13.00 DIA.) 4.00 ± 0.10 P1=8.00 ± 0.10 2.00 ± 0.10 Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 1.20 7.50 ± 0.10 Ø1.50 +0.1, -0 6.50 9.65 ± 0.10 16.00 ± 0.30 Embossed Carrier Direction of feed 3.50 Embossment 6.55 ± 0.10 2.35 ± 0.10 NOTES: 1. All dimensions in millimeters 2. 10 sprocket hole pitch cumulative tolerance ± 0.20. 3. Carrier camber is within 1mm in 250mm. Ø1.50 MIN 2.85 ± 0.10 4. Tape material : Black Conductive Polystyrene Alloy. 5. All dimensions meet EIA-481-C requirements. 6. Thickness : 0.30 ± 0.05mm. For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 6 Specification: DS-CPC2125N-R06 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 9/7/2021