DE275-102N06A
RF Power MOSFET
N-Channel Enhancement Mode
Low Qg and Rg
High dv/dt
Nanosecond Switching
Ideal for Class C, D, & E Applications
Maximum Ratings
VDSS
=
1000 V
ID25
=
8A
RDS(on)
=
1.5 Ω
PDC
=
590 W
Symbol
Test Conditions
VDSS
TJ = 25°C to 150°C
1000
V
VDGR
TJ = 25°C to 150°C; RGS = 1 MΩ
1000
V
VGS
Continuous
±20
V
VGSM
Transient
±30
V
ID25
Tc = 25°C
8
A
IDM
Tc = 25°C, pulse width limited by TJM
48
A
IAR
Tc = 25°C
6
A
EAR
Tc = 25°C
20
mJ
5
V/ns
dv/dt
IS ≤ IDM, di/dt ≤ 100A/µs, VDD ≤ VDSS,
Tj ≤ 150°C, RG = 0.2Ω
>200
V/ns
590
W
300
W
SG1
3.0
W
Features
RthJC
0.25
C/W
RthJHS
0.50
C/W
IS = 0
PDC
PDHS
Tc = 25°C
Derate 2.0W/°C above 25°C
PDAMB
Tc = 25°C
Symbol
Test Conditions
min.
VDSS
VGS = 0 V, ID = 3 mA
1000
VGS(th)
VDS = VGS, ID = 250 µA
IGSS
VGS = ±20 VDC, VDS = 0
IDSS
VDS = 0.8 VDSS TJ = 25°C
VGS = 0
TJ = 125°C
gfs
V
5.0
V
±100
nA
50
1
µA
mA
2.5
4.3
7
0.50
-55
TJ
+175
-55
Tstg
1.6mm (0.063 in) from case for 10 s
SD1
SD2
• Isolated Substrate
− high isolation voltage (>2500V)
− excellent thermal transfer
− Increased temperature and power
•
•
−
−
•
•
•
cycling capability
IXYS advanced low Qg process
Low gate charge and capacitances
easier to drive
faster switching
Low RDS(on)
Very low insertion inductance (
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