DE275-201N25A

DE275-201N25A RF Power MOSFET N-Channel Enhancement Mode Low Qg and Rg High dv/dt Nanosecond Switching Symbol Test Conditions Maximum Ratings VDSS TJ = 25°C to 150°C 200 V VDGR TJ = 25°C to 150°C; RGS = 1 MΩ 200 V VGS Continuous ±20 V VGSM Transient ±30 V ID25 Tc = 25°C 25 A IDM Tc = 25°C, pulse width limited by TJM 150 A IAR Tc = 25°C 25 A EAR Tc = 25°C 20 mJ 5 V/ns dv/dt IS ≤ IDM, di/dt ≤ 100A/µs, VDD ≤ VDSS, Tj ≤ 150°C, RG = 0.2Ω >200 V/ns 590 W 284 W 3.0 W RthJC 0.25 C/W RthJHS 0.53 C/W PDC Tc = 25°C Derate 1.9W/°C above 25°C PDAMB Tc = 25°C Symbol Test Conditions SG1 VDSS VGS = 0 V, ID = 3 ma 200 VGS(th) VDS = VGS, ID = 4 ma 2.5 IGSS VGS = ±20 VDC, VDS = 0 IDSS VDS = 0.8 VDSS TJ = 25°C VGS = 0 TJ = 125°C Weight V 5.5 V ±100 nA 50 1 µA mA 18 VDS = 15 V, ID = 0.5ID25, pulse test -55 +175 -55 1.6mm(0.063 in) from case for 10 s Ω S 175 Tstg = 25 A RDS(on) = 0.08 Ω PDC = 590 W °C °C +175 SG2 SD1 SD2 • Isolated Substrate − high isolation voltage (>2500V) − excellent thermal transfer − Increased temperature and power max. .08 TJM TL typ. VGS = 15 V, ID = 0.5ID25 Pulse test, t ≤ 300µS, duty cycle d ≤ 2% TJ ID25 Features Characteristic Values min. gfs 200 V DRAIN TJ = 25°C unless otherwise specified RDS(on) = GATE IS = 0 PDHS VDSS °C 300 °C 2 g • • − − • • • cycling capability IXYS advanced low Qg process Low gate charge and capacitances easier to drive faster switching Low RDS(on) Very low insertion inductance (