DSSK28-006BS
Schottky Diode
VRRM
=
60 V
I FAV
= 2x
15 A
VF
=
0.52 V
High Performance Schottky Diode
Low Loss and Soft Recovery
Common Cathode
Part number
DSSK28-006BS
Backside: cathode
1
2
3
Features / Advantages:
Applications:
Package: TO-263 (D2Pak)
● Very low Vf
● Extremely low switching losses
● Low Irm values
● Improved thermal behaviour
● High reliability circuit operation
● Low voltage peaks for reduced
protection circuits
● Low noise switching
● Rectifiers in switch mode power
supplies (SMPS)
● Free wheeling diode in low voltage
converters
● Industry standard outline
● RoHS compliant
● Epoxy meets UL 94V-0
Disclaimer Notice
Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
IXYS reserves the right to change limits, conditions and dimensions.
© 2021 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20211013a
DSSK28-006BS
Ratings
Schottky
Conditions
Symbol
VRSM
Definition
max. non-repetitive reverse blocking voltage
TVJ = 25°C
VRRM
max. repetitive reverse blocking voltage
TVJ = 25°C
60
V
IR
reverse current, drain current
VF
forward voltage drop
I FAV
average forward current
VF0
threshold voltage
rF
slope resistance
R thJC
thermal resistance junction to case
min.
VR =
60 V
TVJ = 25°C
10
mA
60 V
TVJ = 100°C
50
mA
TVJ = 25°C
0.56
V
0.78
V
0.52
V
IF =
15 A
IF =
30 A
IF =
15 A
IF =
30 A
TVJ = 125 °C
TC = 135 °C
0.69
V
T VJ = 150 °C
15
A
TVJ = 150 °C
0.36
V
9.4
mΩ
d = 0.5
for power loss calculation only
1.4 K/W
R thCH
thermal resistance case to heatsink
Ptot
total power dissipation
I FSM
max. forward surge current
t = 10 ms; (50 Hz), sine; VR = 0 V
TVJ = 45°C
CJ
junction capacitance
VR =
TVJ = 25°C
© 2021 IXYS all rights reserved
max. Unit
60
V
VR =
rectangular
IXYS reserves the right to change limits, conditions and dimensions.
typ.
K/W
0.25
TC = 25°C
12 V f = 1 MHz
90
300
449
Data according to IEC 60747and per semiconductor unless otherwise specified
W
A
pF
20211013a
DSSK28-006BS
Package
Ratings
TO-263 (D2Pak)
Symbol
I RMS
Definition
Conditions
RMS current
per terminal
min.
TVJ
virtual junction temperature
T op
operation temperature
Tstg
storage temperature
-55
typ.
max.
35
Unit
A
-55
150
°C
-55
125
°C
150
°C
1.5
Weight
FC
20
mounting force with clip
g
60
N
Product Marking
XXXXXXXXX
Part Number
IXYS yywwZ
Logo
Date Code
Location
123456
Lot#
Ordering
Standard
Alternative
Ordering Number
DSSK28-006BS-TRL
DSSK28-006BS-TUB
Similar Part
DSB30C60PB
DSB60C60PB
DSB60C60HB
Equivalent Circuits for Simulation
I
V0
R0
Marking on Product
DSSK28-006BS-TRL
DSSK28-006BS
Package
TO-220AB (3)
TO-220AB (3)
TO-247AD (3)
* on die level
Delivery Mode
Tape & Reel
Tube
Code No.
523748
484016
Voltage class
60
60
60
T VJ = 150°C
Schottky
V 0 max
threshold voltage
0.36
V
R0 max
slope resistance *
6.2
mΩ
IXYS reserves the right to change limits, conditions and dimensions.
© 2021 IXYS all rights reserved
Quantity
800
50
Data according to IEC 60747and per semiconductor unless otherwise specified
20211013a
DSSK28-006BS
Outlines TO-263 (D2Pak)
Dim.
W
A
A1
H
D
E
Supplier
Option
D1
L1
c2
4
L
L2
1 2 3
c
2x e
3x b2
10.92
(0.430)
E1
W
Inches
min
max
0.160 0.190
typ. 0.004
0.095
0.020 0.039
0.045 0.055
0.016 0.029
0.045 0.055
0.330 0.370
0.315 0.350
0.098
0.380 0.410
0.245 0.335
0,100 BSC
0.169
0.575 0.625
0.070 0.110
0.040 0.066
typ.
0.002
0.0008
All dimensions conform with
and/or within JEDEC standard.
1.78
(0.07)
3.05
(0.120)
3.81
(0.150)
9.02
(0.355)
mm (Inches)
2x b
A
A1
A2
b
b2
c
c2
D
D1
D2
E
E1
e
e1
H
L
L1
Millimeter
min
max
4.06
4.83
typ. 0.10
2.41
0.51
0.99
1.14
1.40
0.40
0.74
1.14
1.40
8.38
9.40
8.00
8.89
2.5
9.65
10.41
6.22
8.50
2,54 BSC
4.28
14.61 15.88
1.78
2.79
1.02
1.68
typ.
0.040
0.02
2.54 (0.100)
Recommended min. foot print
1
IXYS reserves the right to change limits, conditions and dimensions.
© 2021 IXYS all rights reserved
2
3
Data according to IEC 60747and per semiconductor unless otherwise specified
20211013a
DSSK28-006BS
Schottky
1000
40
2000
TVJ=150°C
100
10
IF
IR 10
[A]
[mA] 1
100°C
CT
75°C
0.1
25°C
100
0.01
0.2
0.4
TVJ = 25°C
[pF]
50°C
TVJ =
150°C
125°C
25°C
1
0.0
1000
125°C
0.6
0.8
0
10
20
30
40
50
60
VR [V]
VF [V]
40
10
20
30
40
50
60
VR [V]
Fig. 2 Typ. reverse current
IR vs. reverse voltage VR
Fig. 1 Max. forward voltage
drop characteristics
0
Fig. 3 Typ. junction capacitance
CT vs. reverse voltage VR
25
20
30
DC
IF(AV)
P(AV) 15
d = 0.5
d=
DC
0.5
0.33
0.25
0.17
0.08
20
[A]
[W] 10
10
5
0
0
0
50
100
150
200
0
5
10
15
20
25
30
35
IF(AV) [A]
TC [°C]
Fig. 4 Average forward current
IF(AV) vs. case temp. TC
Fig. 5 Forward power loss
characteristics
2
1
D = 0.5
0.33
0.25
ZthJC
0.17
0.08
0.1
[K/W]
Single Pulse
0.01
0.0001
Note: All curves are per diode
0.001
0.01
0.1
1
t [s]
Fig. 6 Transient thermal impedance junction to case at various duty cycles
IXYS reserves the right to change limits, conditions and dimensions.
© 2021 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20211013a
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