IXBOD2-09

IXBOD2 Breakover Diode Gen2 (BOD2) VBO [V] Standard Types 400 ±50 IXBOD2-04 500 ±50 IXBOD2-05 600 ±50 IXBOD2-06 700 ±50 IXBOD2-07 800 ±50 IXBOD2-08 900 ±50 IXBOD2-09 1000 ±50 IXBOD2-10 1100 ±50 IXBOD2-11 1200 ±50 IXBOD2-12 1300 ±50 IXBOD2-13 1400 ±50 IXBOD2-14 VBO = 400-1400 V IAVM = 0.9 A A K A K Backside: isolated Features / Advantages: Applications: Package: FP-Case • Extra fast turn-on • Very low temperature dependance • Very low leakage current • High voltage circuit protection • Transient voltage protection • Trigger device • Power pulse generators • Lightning and arcing protection • Energy discharge circuits • Battery overvoltage protection • Solar array protection • Industry standard outline • RoHS compliant • Epoxy meets UL 94V-0 • Soldering pins for PCB mounting • Base plate: Plastic overmolded tab • Reduced weight Disclaimer Notice Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. IXYS reserves the right to change limits, test conditions and dimensions. © 2020 IXYS All rights reserved Data according ot IEC 60747 and per semiconductor unless otherwise specified 20210720b 1-4 IXBOD2 BOD2 Ratings Symbol Definitions Conditions min. ID drain current VD = 0.8·VBO VBO breakover voltage VBO (TVJ) = VBO, 25°C [1 + KT (TVJ - 25°C)] IRMS RMS current f = 50 Hz typ. TVJ = 25°C TVJ = 125°C max. 10 200 µA µA V Tamb = 50°C 1.4 A 0.9 A pins soldered to printed circuit (conductor 0.035x2mm) IFAVM maximum average forward current ISM maximum pulsed source current 2 It tp = 0.1 ms; non repetitive 2 I t value for fusing tp = 0.1 ms KT KP temperature coefficient of VBO coefficient for energy per pulse EP (material constant) RthJA thermal resistance junction to ambient IBO breakover current IH TVJ = 150°C 250 TVJ = 150°C A 2 3.1 As -3 0.7·10 K-1 700 K/Ws 60 45 K/W K/W TVJ = 25°C TVJ = 150°C 15 6 mA mA holding current TVJ = 25°C TVJ = 150°C 20 12 mA mA VH holding voltage TVJ = 25°C 8 V (dv/dt)cr critical rate of rise of voltage VD = 0.9·VBO TVJ = 25°C TVJ = 150°C 3000 1000 V/µs V/µs (di/dt)cr critical rate of rise of curent IT = 100 A; VD = VBO; f = 50 Hz IT = 600 A; non repetitive TVJ = 150°C 200 500 A/µs A/µs tq turn-off time VD = 0.75·VBO; VR = 0 V; IT = 100 A TVJ = 125°C dv/dt(lin.) = 5000 V/µs; di/dt = -500 A/µs VT forward voltage drop IT = 10 A TVJ = 125°C TVJ = 150°C 1.3 1.2 V V VT0 rT threshold voltage slope resistance for power-loss calculation only TVJ = 150°C 0.75 0.05 V Ω 68 kÿ Vd natural convection with air speed 2 m/s 4 200 µs 400 nH 100 nF IXBOD It = 400 A, di/dt = 2000 A/µs IXYS reserves the right to change limits, test conditions and dimensions. © 2020 IXYS All rights reserved Data according ot IEC 60747 and per semiconductor unless otherwise specified 20210720b 2-4 IXBOD2 Package FP-Case Ratings Symbol Definitions Conditions Tamb Tstg TVJM ambient temperature (cooling medium) storage temperature maximum virtual junction temperature min. typ. -40 -40 -40 Weight max. 150 150 150 0.9 °C °C °C g Product Marking Logo XXXXXXXX Part Number yywwZ Date Code K A Location Ordering Part Name Marking on Product Standard IXBOD2-04 IXBOD2-04 Box 100 511174 Standard IXBOD2-05 IXBOD2-05 Box 100 tbd Standard IXBOD2-06 IXBOD2-06 Box 100 tbd Standard IXBOD2-07 IXBOD2-07 Box 100 508425 Standard IXBOD2-08 IXBOD2-08 Box 100 507602 Standard IXBOD2-09 IXBOD2-09 Box 100 511668 Standard IXBOD2-10 IXBOD2-10 Box 100 508078 Standard IXBOD2-11 IXBOD2-11 Box 100 511860 Standard IXBOD2-12 IXBOD2-12 Box 100 511675 Standard IXBOD2-13 IXBOD2-13 Box 100 511682 Standard IXBOD2-14 IXBOD2-14 Box 100 509782 IXYS reserves the right to change limits, test conditions and dimensions. © 2020 IXYS All rights reserved Delivering Mode Base Qty Ordering Code Data according ot IEC 60747 and per semiconductor unless otherwise specified 20210720b 3-4 IXBOD2 Outlines FP-case A K Dimensions in mm (1 mm = 0.0394“) 1.2 1.5 7.5 4 1 11.5 9 1.5 10 0.8 A IXYS reserves the right to change limits, test conditions and dimensions. © 2020 IXYS All rights reserved 0.5 K Data according ot IEC 60747 and per semiconductor unless otherwise specified 20210720b 4-4