Preliminary Technical Information
IXBR42N170
High Voltage, High Gain
BIMOSFETTM Monolithic
Bipolar MOS Transistor
VCES = 1700V
IC90 = 32A
VCE(sat) ≤ 2.9V
ISOPLUS247TM
E153432
Symbol
Test Conditions
Maximum Ratings
VCES
TC = 25°C to 150°C
1700
V
VCGR
TJ = 25°C to 150°C, RGE = 1MΩ
1700
V
VGES
Continuous
± 20
V
VGEM
Transient
± 30
V
IC25
TC = 25°C
57
A
IC90
TC = 90°C
32
A
ICM
TC = 25°C, 1ms
300
A
SSOA
VGE = 15V, TVJ = 125°C, RG = 10Ω
ICM = 100
A
(RBSOA)
Clamped inductive load
VCES ≤ 1350
V
PC
TC = 25°C
200
W
-55 ... +150
°C
TJM
150
°C
Tstg
-55 ... +150
°C
300
260
°C
°C
20..120 / 4.5..27
Nm/lb.in.
2500
3000
V~
V~
5
g
TJ
TL
TSOLD
1.6mm (0.062 in.) from case for 10s
Plastic body for 10 seconds
FC
Mounting force
VISOL
50/60 Hz, RMS
IISOL ≤ 1mA
G
Weight
z
z
z
BVCES
IC = 250μA, VGE = 0V
1700
z
VGE(th)
IC = 250μA, VCE = VGE
2.5
ICES
VCE = 0.8 • VCES
VGE = 0V
IGES
VCE = 0V, VGE = ± 20V
VCE(sat)
IC = 42A, VGE = 15V, Note 1
5.5
© 2008 IXYS CORPORATION, All rights reserved
Silicon chip on Direct-Copper Bond
(DCB) substrate
Isolated mounting surface
2500V electrical isolation
Low gate drive requirement
High power density
z
z
Switched-mode and resonant-mode
power supplies
Uninterruptible power supplies (UPS)
Laser generator
Capacitor discharge circuit
AC switches
V
50 μA
1.5 mA
TJ = 125°C
TJ = 125°C
= Emitter
Applications:
z
V
E
Advantages
z
Characteristic Values
Min. Typ. Max.
Isolated Tab
Features
z
Symbol Test Conditions
(TJ = 25°C unless otherwise specified)
E
G = Gate
C = Collector
z
t = 1min
t = 1s
C
2.7
±100
nA
2.9
V
V
DS100043(10/08)
IXBR42N170
Symbol
Test Conditions
(TJ = 25°C unless otherwise specified)
Characteristic Values
Min. Typ.
Max.
gfS
24
IC = 42A, VCE = 10V, Note 1
ISOPLUS247 (IXBR) Outline
32
S
3990
pF
225
pF
Cres
70
pF
Qg
188
nC
Cies
Coes
Qge
VCE = 25V, VGE = 0V, f = 1MHz
IC = 42A, VGE = 15V, VCE = 0.5 • VCES
Qgc
td(on)
tr
td(off)
tf
td(on)
Resistive Switching times, TJ = 25°C
IC = 42A, VGE = 15V
VCE = 850V, RG = 10Ω
29
nC
76
nC
37
ns
139
ns
340
ns
665
ns
36
ns
tr
Resistive Switching times, TJ = 125°C
188
ns
td(off)
IC = 42A, VGE = 15V
330
ns
VCE = 850V, RG = 10Ω
740
ns
tf
RthJC
0.62
RthCS
°C/W
° C/W
0.15
Reverse Diode
Symbol Test Conditions
(TJ = 25°C unless otherwise specified)
Characteristic Values
Min. Typ. Max.
VF
IF = 42A, VGE = 0V
2.8
trr
IF = 21A, VGE = 0V, -diF/dt = 100A/μs
IRM
VR = 100V
V
1.32
μs
36
A
Note 1: Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%.
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
IXYS reserves the right to change limits, test conditions and dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXBR42N170
Fig. 1. Output Characteristics
@ 25ºC
Fig. 2. Extended Output Characteristics
@ 25ºC
300
90
VGE = 15V
13V
11V
80
70
240
9V
210
IC - Amperes
IC - Amperes
60
50
40
7V
30
150
120
9V
60
10
7V
30
5V
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0
4.0
2
4
6
8
10
12
14
16
VCE - Volts
VCE - Volts
Fig. 3. Output Characteristics
@ 125ºC
Fig. 4. Dependence of VCE(sat) on
Junction Temperature
90
18
20
1.7
VGE = 15V
13V
11V
80
VGE = 15V
1.6
1.5
VCE(sat) - Normalized
70
IC - Amperes
11V
180
90
20
60
9V
50
40
7V
30
20
I
C
= 84A
1.4
1.3
1.2
I
C
= 42A
1.1
1.0
0.9
I
0.8
5V
10
C
= 21A
0.7
0
0.6
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
-50
-25
0
25
50
75
100
VCE - Volts
TJ - Degrees Centigrade
Fig. 5. Collector-to-Emitter Voltage
vs. Gate-to-Emitter Voltage
Fig. 6. Input Admittance
125
150
160
5.5
TJ = 25ºC
5.0
140
TJ = - 40ºC
25ºC
125ºC
120
IC - Amperes
4.5
VCE - Volts
VGE = 15V
13V
270
4.0
I
3.5
C
= 84A
3.0
100
80
60
42A
40
2.5
2.0
20
21A
0
1.5
5
6
7
8
9
10
11
12
VGE - Volts
© 2008 IXYS CORPORATION, All rights reserved
13
14
15
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5
VGE - Volts
IXYS REF: B_42N170(7N)10-07-08
IXBR42N170
Fig. 8. Forward Voltage Drop of
Intrinsic Diode
Fig. 7. Transconductance
55
120
TJ = - 40ºC
50
110
100
45
TJ = 25ºC
80
35
IF - Amperes
g f s - Siemens
90
25ºC
40
125ºC
30
25
20
TJ = 125ºC
70
60
50
40
15
30
10
20
5
10
0
0
0
20
40
60
80
100
120
140
160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
Fig. 9. Gate Charge
2.6
2.8
3.0
3.2
Fig. 10. Capacitance
16
10,000
VCE = 850V
14
Capacitance - PicoFarads
I C = 42A
I G = 10mA
12
VGE - Volts
2.4
VF - Volts
IC - Amperes
10
8
6
4
Cies
1,000
Coes
100
Cres
2
f = 1 MHz
10
0
0
20
40
60
80
100
120
140
160
180
0
200
5
10
15
20
25
30
35
40
VCE - Volts
QG - NanoCoulombs
Fig. 12. Maximum Transient Thermal
Impedance
Fig. 11. Reverse-Bias Safe Operating Area
1.00
110
100
90
Z(th)JC - ºC / W
IC - Amperes
80
70
60
0.10
50
40
30
20
10
0
200
TJ = 125ºC
RG = 10Ω
dV / dt < 10V / ns
400
600
800
1000
1200
1400
1600
1800
VCE - Volts
IXYS reserves the right to change limits, test conditions and dimensions.
0.01
0.0001
0.001
0.01
0.1
Pulse Width - Seconds
1
10
IXBR42N170
Fig. 13. Resistive Turn-on
Rise Time vs. Junction Temperature
Fig. 14. Resistive Turn-on
Rise Time vs. Drain Current
360
360
RG = 10Ω
320
VGE = 15V
VCE = 850V
I
C
= 84A
t r - Nanoseconds
t r - Nanoseconds
280
240
200
160
I
C
= 42A
320
RG = 10Ω
280
VCE = 850V
VGE = 15V
TJ = 125ºC
240
200
160
TJ = 25ºC
120
80
120
40
80
0
25
35
45
55
65
75
85
95
105
115
125
20
25
30
35
40
45
TJ - Degrees Centigrade
Fig. 15. Resistive Turn-on
Switching Times vs. Gate Resistance
100
I C = 84A
400
80
300
60
I C = 42A
800
20
20
25
30
35
40
45
50
340
I C = 42A
600
320
500
300
25
35
45
RG = 10Ω, VGE = 15V
440
1200
420
1100
tf
1000
TJ = 125ºC, VGE = 15V
400
900
360
800
340
700
320
600
300
TJ = 25ºC, 125ºC
300
45
50
55
60
85
95
105
115
260
125
65
70
75
IC - Amperes
© 2008 IXYS CORPORATION, All rights reserved
80
85
1800
td(off) - - - -
1600
1400
VCE = 850V
900
1200
800
1000
I C = 42A
700
800
I
600
C
= 84A
600
500
400
260
400
200
240
300
280
400
40
75
t d(off) - Nanoseconds
380
t d(off) - Nanoseconds
t f - Nanoseconds
td(off) - - - -
VCE = 850V
35
65
Fig. 18. Resistive Turn-off
Switching Times vs. Gate Resistance
t f - Nanoseconds
tf
1100
30
55
TJ - Degrees Centigrade
1200
25
280
I C = 84A
300
55
1300
20
360
700
Fig. 17. Resistive Turn-off
Switching Times vs. Drain Current
500
85
td(off) - - - -
RG - Ohms
1000
80
RG = 10Ω, VGE = 15V
400
40
100
15
75
VCE = 850V
t f - Nanoseconds
120
500
10
70
t d(off) - Nanoseconds
VCE = 850V
200
65
380
tf
140
t d(on) - Nanoseconds
t r - Nanoseconds
td(on) - - - -
TJ = 125ºC, VGE = 15V
600
60
900
160
tr
55
Fig. 16. Resistive Turn-off
Switching Times vs. Junction Temperature
800
700
50
IC - Amperes
0
10
15
20
25
30
35
40
45
50
55
RG - Ohms
IXYS REF: B_42N170(7N)10-07-08
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.