IXFH60N65X2-4
X2-Class
HiPerFETTM
Power MOSFET
VDSS
ID25
RDS(on)
= 650V
= 60A
52m
D
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
G
Ss
TO-247-4L
S
D
S
Ss
G
Symbol
Test Conditions
VDSS
TJ = 25C to 150C
650
V
VDGR
TJ = 25C to 150C, RGS = 1M
650
V
VGSS
Continuous
30
V
VGSM
Transient
40
V
ID25
TC = 25C
60
A
IDM
TC = 25C, Pulse Width Limited by TJM
120
A
IA
TC = 25C
15
A
EAS
TC = 25C
2.5
J
dv/dt
IS IDM, VDD VDSS, TJ 150°C
50
V/ns
PD
Maximum Ratings
TC = 25C
780
W
-55 ... +150
C
TJM
150
C
Tstg
-55 ... +150
C
300
260
°C
°C
1.13 / 10
Nm/lb.in
6
g
TJ
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
Md
Mounting Torque
S = Source G = Gate
D = Drain
Ss = Source Sense
Features
International Standard Package
Low RDS(ON) and QG
Avalanche Rated
Low Package Inductance
Advantages
Weight
( D )Tab
High Power Density
Easy to Mount
Space Savings
Applications
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
BVDSS
VGS = 0V, ID = 1mA
650
VGS(th)
VDS = VGS, ID = 4mA
3.5
IGSS
VGS = 30V, VDS = 0V
IDSS
VDS = VDSS, VGS = 0V
RDS(on)
VGS = 10V, ID = 0.5 • ID25, Note 1
V
5.0
V
100 nA
TJ = 125C
© 2020 IXYS CORPORATION, All Rights Reserved
Switch-Mode and Resonant-Mode
Power Supplies
DC-DC Converters
PFC Circuits
AC and DC Motor Drives
Robotics and Servo Controls
25 A
2.5 mA
52 m
DS100747A(1/20)
IXFH60N65X2-4
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max
gfs
VDS = 10V, ID = 0.5 • ID25, Note 1
23
RGi
Gate Input Resistance
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
td(on)
tr
td(off)
tf
0.8
6300
pF
pF
1.7
pF
207
855
pF
pF
30
ns
23
ns
63
ns
12
ns
108
nC
40
nC
34
nC
Effective Output Capacitance
Energy related
Time related
VGS = 0V
VDS = 0.8 • VDSS
Resistive Switching Times
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 3 (External)
Qg(on)
Qgs
S
3540
Crss
Co(er)
Co(tr)
38
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
0.16 C/W
RthJC
RthCS
C/W
0.21
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
IS
VGS = 0V
ISM
Characteristic Values
Min.
Typ.
Max
60
A
Repetitive, Pulse Width Limited by TJM
240
A
VSD
IF = IS, VGS = 0V, Note 1
1.4
V
trr
QRM
IRM
IF = 30A, -di/dt = 100A/µs
180
1.4
16.0
ns
µC
A
6,162,665
6,259,123B1
6,306,728B1
6,404,065B1
6,534,343
6,583,505
VR = 100V
Note 1. Pulse test, t 300s, duty cycle, d 2%.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,683,344
6,710,405B2
6,710,463
6,727,585
7,005,734B2
6,759,692
7,063,975B2
6,771,478B2 7,071,537
7,157,338B2
IXFH60N65X2-4
Fig. 2. Extended Output Characteristics @ TJ = 25oC
Fig. 1. Output Characteristics @ TJ = 25oC
60
160
VGS = 10V
9V
V GS = 10V
140
50
9V
8V
120
I D - Amperes
I D - Amperes
40
7V
30
20
100
8V
80
60
40
6V
10
7V
20
5V
0
6V
0
0
0.5
1
1.5
2
2.5
3
3.5
0
5
10
15
20
25
30
VDS - Volts
VDS - Volts
Fig. 3. Output Characteristics @ TJ = 125oC
Fig. 4. RDS(on) Normalized to ID = 30A Value vs.
Junction Temperature
60
3.4
VGS = 10V
8V
50
3.0
V GS = 10V
I D - Amperes
R DS(on) - Normalized
2.6
40
7V
30
6V
20
I D = 60A
2.2
1.8
I D = 30A
1.4
1.0
10
0.6
5V
0
0.2
0
1
2
3
4
5
6
7
8
-50
-25
0
25
VDS - Volts
Fig. 5. RDS(on) Normalized to ID = 30A Value vs.
Drain Current
4.5
100
125
150
BV DSS / VGS(th) - Normalized
1.2
3.5
R DS(on) - Normalized
75
Fig. 6. Normalized Breakdown & Threshold Voltages
vs. Junction Temperature
1.3
VGS = 10V
4.0
50
TJ - Degrees Centigrade
T J = 125oC
3.0
2.5
2.0
T J = 25oC
1.5
1.0
BVDSS
1.1
1.0
0.9
0.8
VGS(th)
0.7
0.6
0.5
0.5
0
20
40
60
80
100
I D - Amperes
© 2020 IXYS CORPORATION, All Rights Reserved
120
140
160
-60
-40
-20
0
20
40
60
80
TJ - Degrees Centigrade
100
120
140
160
IXFH60N65X2-4
Fig. 8. Input Admittance
Fig. 7. Maxing Drain Current vs. Case Temperature
70
90
80
60
70
50
- Amperes
40
o
TJ = 125 C
50
o
25 C
o
- 40 C
40
I
I
D
30
D
- Amperes
60
30
20
20
10
10
0
0
-50
-25
0
25
50
75
100
125
150
3.5
4.0
4.5
5.0
5.5
TC - Degrees Centigrade
6.0
6.5
7.0
7.5
8.0
VGS - Volts
Fig. 9. Transconductance
Fig. 10. Forward Voltage Drop of Intrinsic Diode
70
200
o
TJ = - 40 C
180
60
160
o
40
140
- Amperes
25 C
o
125 C
S
30
120
100
80
I
g f s - Siemens
50
o
TJ = 125 C
60
20
40
10
o
TJ = 25 C
20
0
0
0
10
20
30
40
50
60
70
80
0.3
90
0.4
0.5
0.6
0.7
0.9
1
1.1
1.2
1.3
Fig. 12. Capacitance
Fig. 11. Gate Charge
100,000
10
VDS = 325V
9
I D = 30A
8
Capacitance - PicoFarads
I G = 10mA
7
V GS - Volts
0.8
V SD - Volts
I D - Amperes
6
5
4
3
2
Ciss
10,000
1,000
Coss
100
10
f = 1 MHz
1
Crss
1
0
0
10
20
30
40
50
60
70
80
90
100
110
QG - NanoCoulombs
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
1
10
100
VDS - Volts
1000
IXFH60N65X2-4
Fig. 13. Output Capacitance Stored Energy
Fig. 14. Forward-Bias Safe Operating Area
45
1000
40
RDS(on) Limit
100
25µs
30
I D - Amperes
EOSS - MicroJoules
35
25
20
100µs
10
15
1
10
o
TJ = 150 C
o
5
TC = 25 C
Single Pulse
0
1
0
100
200
300
400
1ms
Fig. 15. Maximum Transient0.1Thermal Impedance
500
600
10
VDS - Volts
100
1,000
VDS - Volts
Fig. 15. Maximum Transient Thermal Impedance
aaaaa
0.3
Z (th)JC - K / W
0.1
0.01
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
© 2020 IXYS CORPORATION, All Rights Reserved
IXYS REF: F_60N65X2(X7-S602) 11-19-15
IXFH60N65X2-4
TO-247 - 4L Outline
PINS:
1,5 - Drain
2 - Source
3 - Source Sense
4 - Gate
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXFH60N65X2-4
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© 2020 IXYS CORPORATION, All Rights Reserved