IXFR200N10P
PolarTM HiPERFET
Power MOSFET
VDSS
ID25
= 100V
= 120A
< 9m
RDS(on)
(Electrically Isolated Tab)
N-Channel Enhancement Mode
Avalanche Rated
ISOPLUS247
E153432
Symbol
Test Conditions
Maximum Ratings
VDSS
TJ = 25C to 175C
100
V
VDGR
TJ = 25C to 175C, RGS = 1M
100
V
VGSS
Continuous
20
V
VGSM
Transient
30
V
ID25
IDM
TC = 25C
TC = 25C, Pulse Width Limited by TJM
120
400
A
A
IA
EAS
TC = 25C
TC = 25C
60
4
A
J
dv/dt
IS IDM, VDD VDSS, TJ 150°C
10
V/ns
PD
TC = 25C
300
W
-55...+175
C
TJM
175
C
Tstg
-55...+175
C
TJ
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
VISOL
50/60 Hz, 1 Minute
FC
Mounting Force
300
260
°C
°C
2500
V~
20..120/4.5..27
N/lb
5
g
G
Isolated Tab
S
G = Gate
S = Source
D
= Drain
Features
Weight
D
Silicon chip on Direct-Copper Bond
(DCB) Substrate
- UL Recognized Package
- Isolated Mounting Surface
- 2500V~ Electrical Isolation
Low RDS(on) and QG
Avalanche Rated
Low Package Inductance
Fast Intrinsic Rectifier
Advantages
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min. Typ. Max.
BVDSS
VGS = 0V, ID = 250μA
100
VGS(th)
VDS = VGS, ID = 8mA
2.5
IGSS
VGS = 20V, VDS = 0V
IDSS
VDS = VDSS, VGS = 0V
RDS(on)
VGS = 10V, ID = 100A, Note 1
VGS = 15V, ID = 400A, Note 1
V
Applications
5.0
V
100
nA
• DC-DC Coverters
• Battery Chargers
• Switch-Mode and Resonant-Mode
Power Supplies
• DC Choppers
• AC and DC Motor Drives
• Uninterrupted Power Supplies
• High Speed Power Switching
Applications
25 A
500 A
TJ = 150C
© 2017 IXYS CORPORATION, All Rights Reserved
High Power Density
Easy to Mount
Space Savings
6
9 m
m
DS99238F(02/17)
IXFR200N10P
Symbol
Test Conditions
(TJ = 25C, unless otherwise specified)
Characteristic Values
Min.
Typ.
Max.
gfs
60
VDS = 10V, ID = 60A, Note 1
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
Crss
td(on)
tr
td(off)
tf
Resistive Switching Times
VGS = 10V, VDS = 0.5 • VDSS, ID = 60A
RG = 3.3 (External)
Qg(on)
Qgs
VGS = 10V, VDS = 0.5 • VDSS, ID = 100A
Qgd
97
S
7600
pF
2900
pF
860
pF
30
ns
35
ns
150
ns
90
ns
235
nC
50
nC
135
nC
RthJC
ISOPLUS247 (IXTR) Outline
1 - Gate
2,4 - Drain
3 - Source
0.50 C/W
RthCS
0.15
C/W
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25C, unless otherwise specified)
Characteristic Values
Min.
Typ.
Max.
IS
VGS = 0V
200
A
ISM
Repetitive, pulse width limited by TJM
400
A
VSD
IF = IS, VGS = 0V, Note 1
1.5
V
trr
IRM
QRM
IF = 25A, -di/dt = 100A/s,
VR = 50V, VGS = 0V
Note:
6.0
0.4
150 ns
A
μC
1. Pulse test, t 300s; duty cycle, d 2%.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXFR200N10P
Fig. 1. Output Characteristics @ TJ = 25ºC
Fig. 2. Extended Output Characteristics @ TJ = 25ºC
200
350
VGS = 10V
180
VGS = 10V
9V
300
160
250
I D - Amperes
I D - Amperes
9V
8V
140
120
100
80
7V
60
200
8V
150
100
7V
40
6V
50
20
0
0.2
0.4
0.6
0.8
1
1.2
1.4
0
1.6
0.5
1
1.5
2.5
3
3.5
4
4.5
VDS - Volts
Fig. 3. Output Characteristics @ TJ = 150ºC
Fig. 4. RDS(on) Normalized to ID = 100A Value vs.
Junction Temperature
2.4
VGS = 10V
9V
180
2.0
R DS(on) - Normalized
8V
140
120
100
5
VGS = 10V
2.2
160
7V
80
60
I D = 200A
1.8
I D = 100A
1.6
1.4
1.2
1.0
40
6V
0.8
20
0
5V
0
1
1
2
2
3
0.6
3
4
-50
-25
0
VDS - Volts
25
50
75
100
125
150
175
TJ - Degrees Centigrade
Fig. 5. RDS(on) Normalized to ID = 100A Value vs.
Drain Current
Fig. 6. Maximum Drain Current vs. Case Temperature
140
2.4
2.2
120
TJ = 150ºC
2.0
100
1.8
I D - Amperes
RDS(on) - Normalized
2
VDS - Volts
200
I D - Amperes
6V
0
0
1.6
VGS = 10V
1.4
VGS = 15V
80
60
1.2
40
TJ = 25ºC
1.0
20
0.8
0.6
0
0
50
100
150
200
I D - Amperes
© 2017 IXYS CORPORATION, All Rights Reserved
250
300
350
-50
-25
0
25
50
75
100
TC - Degrees Centigrade
125
150
175
IXFR200N10P
Fig. 7. Input Admittance
Fig. 8. Transconductance
300
140
TJ = - 40ºC
120
250
100
g f s - Siemens
I D - Amperes
200
150
100
TJ = 125ºC
25ºC
25ºC
80
125ºC
60
40
50
20
- 40ºC
0
0
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
8.5
9.0
0
50
100
150
VGS - Volts
200
250
300
350
I D - Amperes
Fig. 10. Gate Charge
Fig. 9. Forward Voltage Drop of Intrinsic Diode
10
350
VDS = 50V
9
300
I D = 100A
8
TJ = 25ºC
250
I G = 10mA
7
V GS - Volts
I S - Amperes
TJ = 125ºC
200
150
6
5
4
3
100
2
50
1
0
0
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
0
40
VSD - Volts
120
160
200
240
QG - NanoCoulombs
Fig. 11. Capacitance
Fig. 12. Forward-Bias Safe Operating Area
1000
100,000
f = 1 MHz
RDS(on) Limit
100µs
Ciss
10,000
100
I D - Amperes
Capacitance - PicoFarads
80
Coss
1,000
1ms
10
10ms
DC
TJ = 175ºC
Crss
TC = 25ºC
Single Pulse
100
1
0
5
10
15
20
25
30
35
40
VDS - Volts
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
1
10
100
VDS - Volts
1000
IXFR200N10P
Fig. 13. Maximum Transient Thermal Impedance
1
Z (th)JC - K / W
0.1
0.01
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
© 2017 IXYS CORPORATION, All Rights Reserved
IXYS REF: T_200N10P (88) 2-08-17
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.