IXFV36N50PS
IXFV36N50P
IXFH36N50P
IXFT36N50P
PolarTM HiPerFETTM
Power MOSFETs
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
VDSS
ID25
=
=
≤
≤
RDS(on)
trr
500V
36A
Ω
170mΩ
200ns
PLUS220SMD (IXFV...S)
G
S
D (Tab)
PLUS220 (IXFV)
Symbol
Test Conditions
Maximum Ratings
VDSS
TJ = 25°C to 150°C
500
V
VDGR
TJ = 25°C to 150°C, RGS = 1MΩ
500
V
VGSS
Continuous
±30
V
VGSM
Transient
±40
V
ID25
TC = 25°C
36
A
IDM
TC = 25°C, Pulse Width Limited by TJM
90
A
IA
EAS
TC = 25°C
TC = 25°C
36
1.5
A
J
dv/dt
IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 150°C
10
V/ns
PD
TC = 25°C
540
W
-55 ... +150
150
-55 ... +150
°C
°C
°C
300
260
°C
°C
1.13/10
Nm/lb.in.
20..120 /4.5..27
N/lb.
4.0
4.0
6.0
g
g
g
TJ
TJM
Tstg
TL
TSOLD
1.6mm (0.062 in.) from Case for 10s
Plastic Body for 10s
Md
Mounting Torque (TO-247)
FC
Mounting Force
Weight
PLUS220
TO-268
TO-247
(PLUS220)
G
Characteristic Values
Min.
Typ.
Max.
BVDSS
VGS = 0V, ID = 250μA
500
VGS(th)
VDS = VGS, ID = 4mA
3.0
IGSS
VGS = ±30V, VDS = 0V
IDSS
VDS = VDSS, VGS= 0V
G
S
D (Tab)
TO-247 (IXFH)
G
RDS(on)
VGS = 10V, ID = 0.5 • ID25, Note 1
© 2011 IXYS CORPORATION, All Rights Reserved
D
S
G = Gate
S = Source
D (Tab)
D
= Drain
Tab = Drain
Features
z
z
Low Package Inductance
Fast Intrinsic Rectifier
Low RDS(on) and QG
V
5.0
V
±100
nA
Advantages
z
z
TJ = 125°C
D (Tab)
S
TO-268 (IXFT)
z
Symbol
Test Conditions
(TJ = 25°C Unless Otherwise Specified)
D
25 μA
500 μA
z
High Power Density
Easy to Mount
Space Savings
170 mΩ
DS99364F(07/11)
IXFH36N50P IXFV36N50P
IXFT36N50P IXFV36N50PS
Symbol
Test Conditions
(TJ = 25°C Unless Otherwise Specified)
gfs
Characteristic Values
Min.
Typ.
Max.
VDS = 20V, ID = 0.5 • ID25, Note 1
23
Ciss
Coss
36
S
5500
pF
510
pF
40
pF
25
27
ns
ns
75
21
ns
ns
93
nC
30
nC
31
nC
VGS = 0V, VDS = 25V, f = 1MHz
Crss
td(on)
tr
Resistive Switching Times
td(off)
tf
RG = 3Ω (External)
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qg(on)
Qgs
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
0.23 °C/W
RthJC
RthCS
(TO-247 & PLUS220)
0.25
°C/W
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25°C Unless Otherwise Specified)
IS
VGS = 0V
ISM
Characteristic Values
Min.
Typ.
Max.
36
A
Repetitive, Pulse Width Limited by TJM
144
A
VSD
IF = IS, VGS = 0V, Note 1
1.5
V
trr
QRM
IRM
IF = 25A, -di/dt = 100A/μs
Note
0.8
8.0
VR = 100V, VGS = 0V
200 ns
μC
A
1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXFH36N50P IXFV36N50P
IXFT36N50P IXFV36N50PS
TO-268 Outline
PLUS220 (IXFV) Outline
Terminals: 1 - Gate
3 - Source
2,4 - Drain
TO-247 Outline
1
2
PLUS220SMD (IXFV_S) Outline
∅P
3
e
Terminals: 1 - Gate
3 - Source
Dim.
Millimeter
Min. Max.
A
4.7
5.3
2.2
2.54
A1
A2
2.2
2.6
b
1.0
1.4
1.65
2.13
b1
2.87
3.12
b2
C
.4
.8
D
20.80 21.46
E
15.75 16.26
e
5.20
5.72
L
19.81 20.32
L1
4.50
∅P 3.55
3.65
Q
5.89
6.40
R
4.32
5.49
S
6.15 BSC
2 - Drain
Inches
Min. Max.
.185 .209
.087 .102
.059 .098
.040 .055
.065 .084
.113 .123
.016 .031
.819 .845
.610 .640
0.205 0.225
.780 .800
.177
.140 .144
0.232 0.252
.170 .216
242 BSC
© 2011 IXYS CORPORATION, All Rights Reserved
IXFH36N50P IXFV36N50P
IXFT36N50P IXFV36N50PS
Fig. 1. Output Characteristics @ T J = 25ºC
Fig. 2. Extended Output Characteristics @ T J = 25ºC
36
80
VGS = 10V
7V
VGS = 10V
70
30
7V
60
6V
ID - Amperes
ID - Amperes
24
18
50
6.5V
40
30
12
6V
5V
20
5.5V
6
10
4V
5V
0
0
0
1
2
3
4
5
6
0
7
5
10
20
25
Fig. 4. RDS(on) Normalized to ID = 18A Value vs.
Junction Temperature
Fig. 3. Output Characteristics @ T J = 125ºC
36
3.4
VGS = 10V
7V
VGS = 10V
30
3.0
R DS(on) - Normalized
6V
24
ID - Amperes
15
VDS - Volts
VDS - Volts
5.5V
18
12
5V
2.6
I D = 36A
2.2
I D = 18A
1.8
1.4
1.0
6
0.6
4.5V
0
0.2
0
2
4
6
8
10
12
14
16
-50
-25
0
25
50
75
100
VDS - Volts
TJ - Degrees Centigrade
Fig. 5. RDS(on) Normalized to ID = 18A Value vs.
Drain Current
Fig. 6. Maximum Drain Current vs.
Case Temperature
125
150
125
150
40
3.4
VGS = 10V
35
3.0
30
2.6
ID - Amperes
R DS(on) - Normalized
TJ = 125ºC
2.2
1.8
TJ = 25ºC
1.4
25
20
15
10
1.0
5
0
0.6
0
10
20
30
40
50
60
70
80
ID - Amperes
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
-50
-25
0
25
50
75
TC - Degrees Centigrade
100
IXFH36N50P IXFV36N50P
IXFT36N50P IXFV36N50PS
Fig. 7. Input Admittance
Fig. 8. Transconductance
70
TJ = - 40ºC
50
60
TJ = 125ºC
25ºC
- 40ºC
50
g f s - Siemens
ID - Amperes
40
30
20
25ºC
40
125ºC
30
20
10
10
0
0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
0
7.0
10
20
30
40
VGS - Volts
50
60
70
80
90
90
100
ID - Amperes
Fig. 10. Gate Charge
Fig. 9. Forward Voltage Drop of Intrinsic Diode
100
10
90
9
VDS = 250V
80
8
I G = 10mA
70
7
60
6
VGS - Volts
IS - Amperes
I D =18A
50
40
TJ = 125ºC
30
5
4
3
TJ = 25ºC
20
2
10
1
0
0
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
0
10
20
VSD - Volts
30
40
50
60
70
80
QG - NanoCoulombs
Fig. 12. Forward-Bias Safe Operating Area
Fig. 11. Capacitance
100
10,000
25µs
1,000
ID - Amperes
Capacitance - PicoFarads
RDS(on) Limit
Ciss
Coss
100µs
10
1ms
100
DC
10ms
TJ = 150ºC
TC = 25ºC
Single Pulse
Crss
f = 1 MHz
10
1
0
5
10
15
20
25
VDS - Volts
© 2011 IXYS CORPORATION, All Rights Reserved
30
35
40
10
100
VDS - Volts
1,000
IXFH36N50P IXFV36N50P
IXFT36N50P IXFV36N50PS
Fig. 13. Maximum Transient Thermal Impedance
1
Fig. 13. Maximum Transient Thermal Impedance
aaaa
0.4
Z (th)JC - ºC / W
0.1
0.01
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS REF: F_36N50P (7J) 7-15-11-E
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