PolarTM Power MOSFETs
HiPerFETTM
IXFV52N30P
IXFV52N30PS
IXFH52N30P
VDSS
ID25
=
=
RDS(on)
trr
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
300V
52A
73m
200ns
PLUS220 (IXFV)
Symbol
Test Conditions
VDSS
VDGR
TJ = 25°C to 150°C
TJ = 25°C to 150°C, RGS = 1M
VGSS
VGSM
Continuous
Transient
ID25
IDM
TC = 25°C
TC = 25°C, Pulse Width Limited by TJM
IA
EAS
G
D
S
Maximum Ratings
300
300
V
V
± 20
± 30
V
V
52
150
A
A
TC = 25°C
TC = 25°C
52
1
A
J
dv/dt
IS IDM, VDD VDSS, TJ 150°C
10
V/ns
PD
TC = 25°C
400
W
-55 ... +150
150
-55 ... +150
°C
°C
°C
300
260
°C
°C
TJ
TJM
Tstg
TL
TSOLD
Maximum Lead Temperature for Soldering
Plastic Body for 10s
Md
Mounting Torque (TO-247)
1.13/10
Nm/lb.in
FC
Mounting Force (PLUS220)
11..65/2.5..14.6
N/lb
Weight
PLUS220 & PLUS220SMD
TO-247
4
6
g
g
D (Tab)
PLUS220SMD (IXFV_S)
G
S
D (Tab)
TO-247 (IXFH)
G
D
S
G = Gate
S = Source
D (Tab)
D
= Drain
Tab = Drain
Features
Fast Intrinsic Rectifier
Avalanche Rated
Low RDS(ON) and QG
Low Package Inductance
Advantages
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
BVDSS
VGS = 0V, ID = 250μA
300
VGS(th)
VDS = VGS, ID = 4mA
2.5
IGSS
VGS = 20V, VDS = 0V
IDSS
VDS = VDSS, VGS= 0V
RDS(on)
VGS = 10V, ID = 0.5 • ID25, Note 1
TJ = 125C
V
5.0
V
100
nA
25 A
1 mA
73 m
Applications
© 2013 IXYS CORPORATION, All Rights Reserved
High Power Density
Easy to Mount
Space Savings
Switch-Mode and Resonant-Mode
Power Supplies
DC-DC Converters
Laser Drivers
AC and DC Motor Drives
Robotics and Servo Controls
DS99197G(10/13)
IXFH52N30P IXFV52N30P
IXFV52N30PS
Symbol
Test Conditions
(TJ = 25C Unless Otherwise Specified)
gfs
Characteristic Values
Min.
Typ.
Max.
VDS = 10V, ID = 0.5 • ID25, Note 1
20
Ciss
Coss
30
S
3490
pF
550
pF
130
pF
24
ns
22
ns
60
ns
20
ns
110
nC
25
nC
53
nC
VGS = 0V, VDS = 25V, f = 1MHz
Crss
td(on)
tr
td(off)
tf
Resistive Switching Times
VGS = 10V, VDS = 0.5 • VDSS, ID = 52A
RG = 4 (External)
Qg(on)
Qgs
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
(TO-247 & PLUS220)
0.25
Source-Drain Diode
TJ = 25C Unless Otherwise Specified)
IS
VGS = 0V
ISM
VSD
trr
QRM
IRM
1 = Gate
2,4 = Drain
3 = Source
0.31 C/W
RthJC
RthCS
PLUS220 (IXFV) Outline
C/W
Characteristic Values
Min.
Typ.
Max.
52
A
Repetitive, pulse width limited by TJM
150
A
IF = IS, VGS = 0V, Note 1
1.5
V
IF = 25A, -di/dt = 100A/s
VR = 100V, VGS = 0V
160
200 ns
800
nC
7
A
TO-247 (IXFH) Outline
P
Note 1: Pulse test, t 300s, duty cycle, d 2%.
e
PLUS220SMD (IXFV_S) Outline
Dim.
Millimeter
Min. Max.
A
4.7
5.3
A1
2.2
2.54
A2
2.2
2.6
b
1.0
1.4
1.65
2.13
b1
b2
2.87
3.12
C
.4
.8
D
20.80 21.46
E
15.75 16.26
e
5.20
5.72
L
19.81 20.32
L1
4.50
P 3.55
3.65
Q
5.89
6.40
R
4.32
5.49
S
6.15 BSC
1 = Gate
2,4 = Drain
3 = Source
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
1 = Gate
2 = Drain
3 = Source
Inches
Min. Max.
.185 .209
.087 .102
.059 .098
.040 .055
.065 .084
.113 .123
.016 .031
.819 .845
.610 .640
0.205 0.225
.780 .800
.177
.140 .144
0.232 0.252
.170 .216
242 BSC
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXFH52N30P IXFV52N30P
IXFV52N30PS
Fig. 1. Output Characteristics @ TJ = 25ºC
Fig. 2. Extended Output Characteristics @ TJ = 25ºC
VGS = 10V
8V
50
VGS = 10V
9V
140
7V
120
40
8V
I D - Amperes
I D - Amperes
100
30
6V
20
80
7V
60
40
6V
10
20
5V
5V
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0
5
10
15
20
25
30
VDS - Volts
VDS - Volts
Fig. 4. RDS(on) Normalized to ID = 26A Value vs.
Junction Temperature
Fig. 3. Output Characteristics @ TJ = 125ºC
3.0
VGS = 10V
8V
7V
50
VGS = 10V
2.6
RDS(on) - Normalized
I D - Amperes
40
6V
30
20
I D = 52A
2.2
I D = 26A
1.8
1.4
1.0
10
5V
0.6
0
0.2
0
1
2
3
4
5
6
7
8
9
10
-50
-25
0
25
50
75
100
VDS - Volts
TJ - Degrees Centigrade
Fig. 5. RDS(on) Normalized to ID = 26A Value vs.
Drain Current
Fig. 6. Maximum Drain Current vs.
Case Temperature
125
150
125
150
4.0
VGS = 10V
50
40
TJ = 125ºC
3.0
I D - Amperes
RDS(on) - Normalized
3.5
2.5
2.0
30
20
TJ = 25ºC
1.5
10
1.0
0.5
0
0
20
40
60
80
I D - Amperes
© 2013 IXYS CORPORATION, All Rights Reserved
100
120
140
-50
-25
0
25
50
75
TC - Degrees Centigrade
100
IXFH52N30P IXFV52N30P
IXFV52N30PS
Fig. 7. Input Admittance
Fig. 8. Transconductance
60
100
90
TJ = - 40ºC
50
80
g f s - Siemens
I D - Amperes
70
60
50
TJ = 125ºC
25ºC
- 40ºC
40
25ºC
40
125ºC
30
20
30
20
10
10
0
0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
0
8.0
10
20
30
40
VGS - Volts
50
60
70
80
90
100
I D - Amperes
Fig. 9. Forward Voltage Drop of Intrinsic Diode
Fig. 10. Gate Charge
160
10
VDS = 150V
9
140
I D = 26A
8
I G = 10mA
120
100
VGS - Volts
I S - Amperes
7
80
60
TJ = 125ºC
5
4
3
TJ = 25ºC
40
6
2
20
1
0
0
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
0
20
VSD - Volts
60
80
100
120
QG - NanoCoulombs
Fig. 11. Capacitance
Fig. 12. Forward-Bias Safe Operating Area
10,000
1000
RDS(on) Limit
Ciss
100
I D - Amperes
Capacitance - PicoFarads
40
1,000
C oss
25µs
100µs
10
1ms
TJ = 150ºC
TC = 25ºC
Single Pulse
Crss
f = 1 MHz
100
10ms
DC
1
0
5
10
15
20
25
30
35
40
VDS - Volts
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
10
100
VDS - Volts
1,000
IXFH52N30P IXFV52N30P
IXFV52N30PS
Fig. 13. Maximum Transient Thermal Impedance
10
1
Fig. 13. Maximum Transient Thermal Impedance
aaaaaa
Z (th )JC - ºC / W
0.5
0.1
0.01
0.00001
0.0001
0.001
0.01
0.1
Pulse Width - Second
© 2013 IXYS CORPORATION, All Rights Reserved
IXYS REF: T_52N30P(6S) 9-26-13
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.