Preliminary Technical Information
IXGR48N60B3*
IXGR48N60B3D1
GenX3TM 600V IGBTs
(Electrically Isolated Back
Surface)
*Obsolete Part Number
VCES =
IC25 =
VCE(sat) ≤
tfi(typ) =
600V
60A
2.1V
116ns
Medium-Speed Low-Vsat PT
IGBTs 5-40 kHz Switching
IXGR_B3
IXGR_B3D1
Symbol
Test Conditions
VCES
TC = 25°C to 150°C
600
V
VCGR
TJ = 25°C to 150°C, RGE = 1MΩ
600
V
VGES
Continuous
± 20
V
VGEM
Transient
± 30
V
IC25
IC110
IF110
TC = 25°C
TC = 110°C
TC = 110°C (48N60B3D1)
60
27
27
A
A
A
ICM
TC = 25°C, 1ms
280
A
SSOA
VGE = 15V, TVJ = 125°C, RG = 5Ω
ICM = 120
A
(RBSOA)
Clamped Inductive Load
PC
TC = 25°C
ISOPLUS247TM
E153432
Maximum Ratings
@ ≤ VCE
G
-55 ... +150
°C
TJM
150
°C
z
Tstg
-55 ... +150
°C
z
z
TL
1.6mm (0.062 in.) from Case for 10s
300
°C
z
TSOLD
Plastic Body for 10 seconds
260
°C
z
FC
Mounting Force
20..120 / 4.5..27
N/lb.
VISOL
50/60 Hz, RM, t = 1min
2500
V~
5
g
z
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
BVCES
IC = 250μA, VGE = 0V
600
VGE(th)
IC = 250μA, VCE = VGE
3.0
ICES
VCE = VCES, VGE = 0V
IGES
VCE = 0V, VGE = ± 20V
VCE(sat)
IC = 40A, VGE = 15V, Note 1
z
V
5.5
48N60B3D1
V
TJ = 125°C
z
z
1.75 mA
z
2.1
V
V
z
z
z
z
z
© 2011 IXYS CORPORATION, All Rights Reserved
Silocon Chip on Direct-Copper Bond
(DCB) Substrate
Isolated Mounting Surface
Optimized for Low Conduction and
Switching Losses
2500V~ Electrical Isolation
Anti-Parallel Ultra Fast Diode
Square RBSOA
High Power Density
Low Gate Drive Requirement
Applications
25 μA
±100 nA
1.77
1.74
E = Emitter
Advantages
z
48N60B3
Isolated Tab
Features
W
Weight
E
G = Gate
C = Collector
150
TJ
C
Power Inverters
UPS
Motor Drives
SMPS
PFC Circuits
Battery Chargers
Welding Machines
Lamp Ballasts
DS99743B(02/11)
IXGR48N60B3
IXGR48N60B3D1
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified
Characteristic Values
Min.
Typ.
Max.
gfs
20
IC = 30A, VCE = 10V, Note 1
VCE = 25V, VGE = 0V, f = 1MHz
pF
170
pF
48N60B3D1
200
45
pF
pF
115
nC
21
nC
40
nC
22
ns
25
ns
Qg
IC = 40A, VGE = 15V, VCE = 0.5 • VCES
Qgc
td(on)
tri
Eon
td(off)
tfi
S
2980
Cres
Qge
30
48N60B3
Cies
Coes
ISOPLUS247 (IXGR) Outline
Inductive Load, TJ = 25°C
IC = 30A, VGE = 15V
0.84
VCE = 480V, RG = 5Ω
130
Note 2
Eoff
td(on)
mJ
200
ns
116
200
ns
0.66
1.20
mJ
19
ns
25
ns
IC = 30A, VGE = 15V
1.71
mJ
VCE = 480V, RG = 5Ω
190
ns
tri
Inductive Load, TJ = 125°C
Eon
td(off)
tfi
Note 2
Eoff
157
ns
1.30
mJ
RthJC
0.83 °C/W
RthCS
0.15
°C/W
Reverse Diode (FRED) (D1 Version ONLY)
Symbol Test Conditions
(TJ = 25°C, Unless Otherwise Specified
VF
IRM
trr
IF = 30A, VGE = 0V, Note 1
Characteristic Values
Min.
Typ.
Max.
2.8
TJ = 150°C
V
V
4
A
100
ns
1.5
1.5 °C/W
°C/W
IF = 30A, VGE = 0V, VR = 100V
-diF/dt = 100A/μs
IF = 1A, -di/dt = 100A/μs, VR = 30V TJ = 100°C
RthJC
RthCS
Notes:
1.6
1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%.
2. Switching times & energy losses may increase for higher VCE(clamp), TJ or RG.
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
IXYS Reserves the Right to Change Limits, Test Conditions and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
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and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.