IXTR102N65X2
X2-Class
Power MOSFET
VDSS
ID25
N-Channel Enhancement Mode
Avalanche Rated
650V
54A
33m
RDS(on)
D
(Electrically Isolated Tab)
=
=
G
S
ISOPLUS247
E153432
Symbol
Test Conditions
Maximum Ratings
VDSS
VDGR
TJ = 25C to 150C
TJ = 25C to 150C, RGS = 1M
650
650
V
V
VGSS
VGSM
Continuous
Transient
30
40
V
V
ID25
IDM
TC = 25C
TC = 25C, Pulse Width Limited by TJM
54
204
A
A
IA
EAS
TC = 25C
TC = 25C
25
3
A
J
PD
TC = 25C
330
W
dv/dt
IS IDM, VDD VDSS, TJ 150°C
50
V/ns
-55 ... +150
150
-55 ... +150
C
C
C
300
260
°C
°C
TJ
TJM
Tstg
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
VISOL
50/60 Hz, 1 Minute
FC
Mounting Force
2500 V
20..120/4.5..27
N/lb
5
g
Weight
G
D
Isolated Tab
S
G = Gate
S = Source
D
= Drain
Features
Silicon Chip on Direct-Copper Bond
(DCB) Substrate
Isolated Mounting Surface
2500V~ Electrical Isolation
Low QG
Avalanche Rated
Low Package Inductance
Advantages
Symbol
Test Conditions
(TJ = 25C Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
BVDSS
VGS = 0V, ID = 1mA
650
VGS(th)
VDS = VGS, ID = 250µA
3.0
IGSS
VGS = 30V, VDS = 0V
IDSS
VDS = VDSS, VGS = 0V
RDS(on)
VGS = 10V, ID = 51A, Note 1
TJ = 125C
© 2020 IXYS CORPORATION, All Rights Reserved
High Power Density
Easy to Mount
Space Savings
V
5.0
V
100
nA
25
500
A
A
33 m
Applications
Switch-Mode and Resonant-Mode
Power Supplies
DC-DC Converters
PFC Circuits
AC and DC Motor Drives
Robotics and Servo Controls
DS100681B(1/20)
IXTR102N65X2
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
gfs
VDS = 10V, ID = 51A, Note 1
RGi
Gate Input Resistance
Characteristic Values
Min.
Typ.
Max
50
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
Crss
82
S
0.7
10.9
nF
6100
pF
12.6
pF
367
1420
pF
pF
37
ns
28
ns
67
ns
11
ns
152
nC
57
nC
33
nC
Effective Output Capacitance
Co(er)
Co(tr)
Energy related
td(on)
Resistive Switching Times
tr
td(off)
tf
Time related
VGS = 0V
VDS = 0.8 • VDSS
VGS = 10V, VDS = 0.5 • VDSS, ID = 51A
RG = 2(External)
Qg(on)
Qgs
VGS = 10V, VDS = 0.5 • VDSS, ID = 51A
Qgd
0.38 C/W
RthJC
RthCS
C/W
0.15
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
IS
VGS = 0V
102
A
ISM
Repetitive, Pulse Width Limited by TJM
408
A
VSD
IF = IS , VGS = 0V, Note 1
1.4
V
trr
QRM
IRM
450
IF = 51A, -di/dt = 100A/s
11.7
VR = 100V, VGS = 0V
52
ns
µC
A
Note 1. Pulse test, t 300s, duty cycle, d 2%.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXTR102N65X2
Fig. 1. Output Characteristics @ TJ = 25oC
Fig. 2. Extended Output Characteristics @ TJ = 25oC
110
240
VGS = 10V
8V
100
VGS = 10V
90
80
70
I D - Amperes
I D - Amperes
200
8V
160
7V
7V
60
6V
50
40
120
80
6V
30
20
40
5V
10
5V
0
0
0
0.5
1
1.5
2
2.5
3
3.5
0
5
10
VDS - Volts
110
3.5
VGS = 10V
7V
R DS(on) - Normalized
80
I D - Amperes
25
6V
70
60
50
40
30
VGS = 10V
3.0
90
5V
20
2.5
I D = 102A
2.0
I D = 51A
1.5
1.0
0.5
10
4V
0.0
0
0
4.5
1
2
3
4
5
6
7
8
-50
9
-25
0
25
50
75
100
125
VDS - Volts
TJ - Degrees Centigrade
Fig. 5. RDS(on) Normalized to ID = 51A Value vs.
Drain Current
Fig. 6. Normalized Breakdown & Threshold Voltages
vs. Junction Temperature
1.2
150
V GS = 10V
4.0
BVDSS / VGS(th) - Normalized
1.1
3.5
RDS(on) - Normalized
20
Fig. 4. RDS(on) Normalized to ID = 51A Value vs.
Junction Temperature
Fig. 3. Output Characteristics @ TJ = 125oC
100
15
VDS - Volts
o
TJ = 125 C
3.0
2.5
2.0
o
TJ = 25 C
1.5
BVDSS
1.0
0.9
V GS(th)
0.8
0.7
1.0
0.6
0.5
0
40
80
120
160
I D - Amperes
© 2020 IXYS CORPORATION, All Rights Reserved
200
240
-60
-40
-20
0
20
40
60
80
T J - Degrees Centigrade
100
120
140
160
IXTR102N65X2
Fig. 8. Input Admittance
Fig. 7. Maximum Drain Current vs. Case Temperature
60
160
140
50
120
I D - Amperes
I D - Amperes
40
30
20
100
o
TJ = 125 C
80
o
25 C
o
- 40 C
60
40
10
20
0
0
-50
-25
0
25
50
75
100
125
150
3.0
3.5
4.0
4.5
TC - Degrees Centigrade
5.0
5.5
6.0
6.5
7.0
VGS - Volts
Fig. 10. Forward Voltage Drop of Intrinsic Diode
Fig. 9. Transconductance
160
300
o
TJ = - 40 C
140
250
120
200
I S - Amperes
g f s - Siemens
o
25 C
100
o
125 C
80
60
150
100
o
TJ = 125 C
40
o
TJ = 25 C
50
20
0
0
0
20
40
60
80
100
120
140
160
0.2
0.3
0.4
0.5
0.6
I D - Amperes
0.7
0.8
0.9
1.0
1.1
1.3
1.4
Fig. 12. Capacitance
Fig. 11. Gate Charge
100,000
10
V DS = 325V
Ciss
Capacitance - PicoFarads
I D = 51A
8
VGS - Volts
1.2
VSD - Volts
I G = 10mA
6
4
10,000
1,000
C oss
100
10
2
C rss
f = 1 MHz
1
0
0
20
40
60
80
100
120
140
160
QG - NanoCoulombs
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
1
10
100
VDS - Volts
1000
IXTR102N65X2
Fig. 13. Output Capacitance Stored Energy
Fig. 14. Forward-Bias Safe Operating Area
70
1000
RDS(on) Limit
100
50
25µs
I D - Amperes
E OSS - MicroJoules
60
40
30
10
100µs
20
1
1ms
o
TJ = 150 C
o
TC = 25 C
Single Pulse
10
0
10ms
0.1
0
100
200
300
400
500
600
10
100
VDS - Volts
1,000
VDS - Volts
Fig. 15. Maximum Transient Thermal Impedance
1
Z (th)JC - K / W
0.1
0.01
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
© 2020 IXYS CORPORATION, All Rights Reserved
IXYS REF: T_102N65X2(X8-R4T50) 8-05-15-B
IXTR102N65X2
ISOPLUS247 (IXTR) Outline
1 = Gate
2,4 = Drain
3 = Source
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXTR102N65X2
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© 2020 IXYS CORPORATION, All Rights Reserved