LCA100
350V, 120mA Single-Pole
Normally Open Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Ratings
350
120
25
Units
VP
mArms & mADC
The LCA100 is a 350V, 120mA, 25, normally
open (1-Form-A) relay. It features one of the lowest
on-resistances available in a 350V OptoMOS relay.
Approvals
Features
•
•
•
•
•
•
•
•
•
Description
3750Vrms Input/Output Isolation
Low Drive Power Requirements
Greater Reliability than Electromechanical Relays
FCC Compatible
VDE Compatible
No EMI/RFI Generation
Small 6-Pin DIP Package
Flammability Rating UL 94 V-0
Surface Mount Tape & Reel Version Available
• UL Recognized Component: File # E76270
• TUV EN 62368-1: Certificate # B 082667 0008
Ordering Information
Part #
LCA100
LCA100S
LCA100STR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1,000/Reel)
Pin Configuration
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security
• Industrial Controls
AC/DC Configuration
+ Control
– Control
Do Not Use
1
6
2
5
3
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
– Control
Do Not Use
1
6
2
5
3
4
+ Load
– Load
Switching Characteristics of
Normally Open Devices
Form-A
IF
90%
10%
ILOAD
ton
DS-LCA100-R04
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toff
1
INTEGRATED CIRCUITS DIVISION
LCA100
Absolute Maximum Ratings @ 25˚ C
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature, Ambient
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate output power linearly 6.67 mW / ºC
Ratings
350
5
50
1
150
800
3750
-40 to +85
-40 to +125
Units
VP
V
mA
A
mW
mW
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Blocking Voltage
Load Current
Continuous, AC/DC Configuration
Continuous, DC Configuration
Peak
On-Resistance 1
Conditions
Symbol
Min
Typ
Max
Units
IL=1A
VDRM
350
-
-
VP
10ms
IL
IL
-
-
120
200
350
mArms & mADC
mADC
mAP
-
25
8
1
ILEAK
-
µA
IF=0mA, V=50V, f=1MHz
ton
toff
COUT
-
35
5
5
-
ms
ms
pF
IL = 120mA
IF = 5mA
VR = 5V
IF
IF
VF
IR
0.4
0.9
-
0.7
1.36
-
5
1.5
10
mA
mA
V
µA
VIO=0V, f=1MHz
CIO
-
3
-
pF
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
1
2
IL=120mA
IL=200mA
VL=350V
IF = 5mA, VL = 10V
ILPK
RON
Measurement taken within 1 second of on-time.
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INTEGRATED CIRCUITS DIVISION
LCA100
PERFORMANCE DATA*
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
25
Device Count (N)
20
15
10
5
15
10
5
0
0
1.364
1.72
Device Count (N)
15
10
5
0
1.87
2.02 2.17 2.32 2.46
Turn-On Time (ms)
0.90
0.95 1.00 1.05
LED Current (mA)
1.10
10
5
0.06
0.08
0.10 0.13 0.15 0.17
Turn-Off Time (ms)
0.19
Typical On-Resistance Distribution
(N=50, IL=120mADC)
35
30
20
15
10
5
25
20
15
10
5
0
0.85
15
2.61
Typical IF for Switch Dropout
(N=50, IL=120mADC)
25
20
20
0
1.366
1.368
1.370
1.372
LED Forward Voltage Drop (V)
Typical IF for Switch Operation
(N=50, IL=120mADC)
25
Device Count (N)
20
Device Count (N)
Device Count (N)
25
Typical Turn-Off Time
(N=50, IF=5mA, IL=120mADC)
25
Device Count (N)
30
Typical Turn-On Time
(N=50, IF=5mA, IL=120mADC)
0
1.15
0.85
0.90
0.95 1.00 1.05
LED Current (mA)
1.10
1.15
13.93 14.05 14.17 14.29 14.41 14.54 14.66
On-Resistance (:)
Typical Blocking Voltage Distribution
(N=50)
35
Device Count (N)
30
25
20
15
10
5
0
369.8 374.6 379.4 384.1 388.9 393.7 398.4
Blocking Voltage (VP)
Typical Turn-On Time
vs. LED Forward Current
(IL=130mADC)
3.0
1.7
2.5
1.6
IF=10mA
IF=5mA
IF=2mA
1.5
1.4
1.3
1.2
1.1
2.0
1.5
1.0
0.5
-50
-25
0
25
50
Temperature (ºC)
75
100
0.25
0.20
0.15
0.10
0.05
0
0
1.0
Typical Turn-Off Time
vs. LED Forward Current
(IL=130mADC)
0.30
Turn-Off Time (ms)
1.8
Turn-On Time (ms)
LED Forward Voltage Drop (V)
Typical LED Forward Voltage Drop
vs. Temperature
0
5
10 15 20 25 30 35 40
LED Forward Current (mA)
45
50
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
R04
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3
INTEGRATED CIRCUITS DIVISION
LCA100
PERFORMANCE DATA*
2.5
2.0
IF=5mA
IF=10mA
1.0
0.5
0
-40
0
20
40
60
80
Temperature (ºC)
100 120
Typical IF for Switch Operation
vs. Temperature
(IL=80mA)
5
4
3
2
1
-20
0
20
40
60
Temperature (ºC)
80
100
180
Blocking Voltage (VP)
DC Configuration
IF=10mA
160
140
IF=5mA
120
AC/DC Configuration
IF=10mA
80
IF=5mA
60
0
-40
-20
0
20
40
60
80
Temperature (ºC)
100
IF=5mA/10mA
10
-40
150
2
1
-20
0
20
40
60
80
Temperature (ºC)
100 120
Typical Load Current vs. Load Voltage
(IF=5mA)
100
50
0
-50
-100
-150
-20
0
20
40
60
Temperature (ºC)
80
100 120
-3
-2
-1
0
1
Load Voltage (V)
2
3
Typical Leakage vs. Temperature
Measured across Pins 4&6
410
0.016
405
0.014
400
0.012
395
390
385
0.010
0.008
0.006
0.004
380
375
-40
120
DC Configuration
15
Typical Blocking Voltage
vs. Temperature
200
IF=5mA
20
120
3
-40
100 120
220
Load Current (mA)
20
40
60
80
Temperature (ºC)
4
Maximum Load Current
vs. Temperature
100
0
Leakage (PA)
-40
AC/DC Configuration
0
-20
0
0
IF=10mA
25
5
Typical IF for Switch Dropout
vs. Temperature
(IL=80mA)
5
LED Current (mA)
LED Current (mA)
-20
Typical Steady-State
On-Resistance vs. Temperature
(IL=120mADC)
30
Load Current (mA)
1.5
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-40
Turn-Off Time (ms)
Turn-On Time (ms)
3.0
Typical Turn-Off Time
vs. Temperature
(IL=80mADC)
On-Resistance (:)
Typical Turn-On Time
vs. Temperature
(IL=80mADC)
0.002
-20
0
20
40
60
Temperature (ºC)
80
100
10s
100s
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Load Current (A)
Energy Rating Curve
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10Ps 100Ps 1ms 10ms 100ms
1s
Time
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
4
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R04
INTEGRATED CIRCUITS DIVISION
LCA100
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product
performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Classification
LCA100S
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell
time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater.
The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering
processes.
Device
Classification Temperature (Tc)
Dwell Time (tP)
Max Reflow Cycles
LCA100S
250ºC
30 seconds
3
For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is
provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder
wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the
last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below.
Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering
process.
Device
LCA100
Maximum Pin Temperature
260ºC
Maximum Body Temperature
250ºC
Maximum Dwell Time
10 seconds*
Wave Cycles
1
*Total cumulative duration of all waves.
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to
the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake
cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability
of the wash parameters used to clean the board, determination of the bake temperature and duration necessary
to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying
methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must
not be exposed to halide flux or solvents.
R04
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5
INTEGRATED CIRCUITS DIVISION
LCA100
MECHANICAL DIMENSIONS
LCA100
8.382±0.381
(0.330±0.015)
PCB Hole Pattern
7.239 TYP
(0.285 TYP)
2.54±0.127
(0.100±0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
9.144±0.508
(0.360±0.020)
6.350±0.127
(0.250±0.005)
1.524 TYP
(0.060 TYP)
Pin 1
1.651±0.254
(0.065±0.010)
2.540±0.127
(0.100±0.005)
7.620±0.127
(0.300±0.005)
7.620±0.254
(0.300±0.010)
0.254±0.0127
(0.010±0.0005)
5.080±0.127
(0.200±0.005)
Controlling dimension: inches
3.302±0.051
(0.130±0.002)
4.064 TYP
(0.160 TYP)
Dimensions
mm
(inches)
0.457±0.076
(0.018±0.003)
LCA100S
8.382±0.381
(0.330±0.015)
9.524±0.508
(0.375±0.020)
Pin 1
0.635±0.127
(0.025±0.005)
2.54
(0.10)
6.350±0.127
(0.250±0.005)
0.457±0.076
(0.018±0.003)
1.651±0.254
(0.065±0.010)
7.620±0.254
(0.300±0.010)
0.254±0.0127
(0.010±0.0005)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302±0.051
(0.130±0.002)
4.445±0.254
(0.175±0.010)
Controlling dimension: inches
1.524 TYP
(0.060 TYP)
1.651±0.254
(0.065±0.010)
6
PCB Land Pattern
2.54±0.127
(0.100±0.005)
Dimensions
mm
(inches)
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R04
INTEGRATED CIRCUITS DIVISION
LCA100
LCA100STR Tape & Reel
P1 = 12.00
(0.472)
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B0 = 10.10
(0.398)
K0 = 4.90
(0.19)
K1 = 3.80
(0.15)
A0 = 10.10
(0.398)
User Direction of Feed
Embossed
Carrier
Embossment
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: https://www.ixysic.com
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.
7
Specification: DS-LCA100-R04
©Copyright 2021, Littelfuse, Inc.
OptoMOS® is a registered trademark of IXYS Integrated Circuits
All rights reserved. Printed in USA.
10/28/2021
