LCA110LSTR

LCA110LSTR

  • 厂商:

    IXYS(艾赛斯)

  • 封装:

    SMD6

  • 描述:

    LCA110LSTR

  • 详情介绍
  • 数据手册
  • 价格&库存
LCA110LSTR 数据手册
LCA110L 350V, 120mA Single-Pole Current Limiting, Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 350 120 35 Units VP mArms & mADC  Features • Built-in Current Limiting • 3750Vrms Input/Output Isolation • Low Drive Power Requirements • Greater Reliability than Electromechanical Relays • No EMI/RFI Generation • Small 6-Pin Package • Flammability Rating UL 94 V-0 • Surface Mount, Tape & Reel Version Available Description LCA110L is a current-limited, normally open (1-Form-A) solid state relay that uses optically coupled MOSFET technology to provide 3750Vrms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Use the LCA110L to replace mechanical relays, and gain the superior reliability associated with semiconductor devices, which, because they have no moving parts, can offer faster, bounce-free switching in a more compact surface mount or through-hole package. Approvals Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Security • Industrial Controls • UL Recognized Component: File # E76270 • CSA Certified Component: Certificate # 1175739 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # LCA110L LCA110LS LCA110LSTR Description 6 Pin DIP (50/Tube) 6 Pin Surface Mount (50/Tube) 6 Pin Surface Mount (1000/Reel) Pin Configuration AC/DC Configuration + Control – Control NC 1 6 2 5 3 4 Load Do Not Use Load DC Only Configuration + Control – Control NC 1 6 2 5 3 4 + Load – Load Switching Characteristics of Normally Open (Form A) Devices Form-A IF 90% 10% ILOAD ton DS-LCA110L-R06 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION LCA110L Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / °C 2 Derate output power linearly 6.67 mW / °C Ratings 350 5 50 1 150 800 3750 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current, Continuous AC/DC Configuration DC Configuration Load Current Limiting, AC/DC Configuration On-Resistance 1 AC/DC Configuration DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 350 - - VP - IL - - IF=2mA, VL=8V ICL ±130 ±170 120 200 ±210 mArms & mADC mADC mA RON - 35 10 1  ILEAK 19 7 - - 25 3 3 - IL=120mA IL=200mA VL=350VP µA IF=0mA, VL=50V, f=1MHz ton toff COUT IL=120mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 1.1 1.0 1.36 - 2 1.5 10 mA mA V µA VIO=0V, f=1MHz CIO - 3 - pF IF=5mA, VL=10V - ms pF Measurement taken within 1 second of on-time. www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION LCA110L PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) Device Count (N) 25 20 15 10 5 20 15 10 5 0 0 1.364 0.15 20 20 15 10 5 0 0.25 0.35 0.45 0.55 0.65 Turn-On Time (ms) 0.75 1.05 1.35 1.65 LED Current (mA) 1.95 10 5 0.025 Typical IF for Switch Dropout (N=50, IL=120mADC) 0.075 0.125 0.175 Turn-Off Time (ms) 0.225 Typical On-Resistance Distribution (N=50, IF=2mA, IL=120mADC) 35 30 15 10 5 25 20 15 10 5 0 0.45 15 0.75 Device Count (N) 25 Device Count (N) 25 20 0 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=120mADC) Device Count (N) 25 Device Count (N) 30 Typical Turn-Off Time (N=50, IF=5mA, IL=120mADC) Typical Turn-On Time (N=50, IF=5mA, IL=120mADC) 0 2.25 0.45 0.75 1.05 1.35 1.65 1.95 LED Current (mA) 2.25 17.0 17.4 17.8 18.2 18.6 19.0 On-Resistance (:) 19.4 Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 376.3 382.8 389.3 395.8 402.3 408.8 415.3 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=120mADC) 1.7 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 1.1 1.0 -50 -25 0 25 50 Temperature (ºC) 75 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 Typical Turn-Off Time vs. LED Forward Current (IL=120mADC) 0.35 0.30 Turn-Off Time (ms) 1.8 Turn-On Time (ms) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 0.25 0.20 0.15 0.10 0.05 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R06 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LCA110L 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 IF=2mA IF=5mA IF=10mA IF=20mA -40 -20 0 20 40 60 Temperature (ºC) 80 180 IF=2mA IF=5mA -20 0 20 40 60 Temperature (ºC) 80 1.0 100 Typical IF for Switch Dropout vs. Temperature (IL=120mADC) -20 0 20 40 60 Temperature (ºC) 1.5 1.0 30 20 -20 0 20 40 60 Temperature (ºC) 80 -40 100 100 14 -3 -2 -1 0 1 Load Voltage (V) 2 400 3 Leakage (nA) Blocking Voltage (VP) 16 410 390 380 370 0 20 40 60 Temperature (ºC) 80 100 12 10 8 6 4 360 350 -40 -20 Typical Leakage vs. Temperature Measured across Pins 4 & 6 Typical Blocking Voltage vs. Temperature -150 120 40 420 -100 100 50 150 -50 20 40 60 80 Temperature (ºC) 0 Typical Load Current vs. Load Voltage (IF=2mA) 0 0 10 -40 50 -20 60 2.0 80 40 Typical On-Resistance vs. Temperature (IF=2mA, IL=120mADC) 0 -40 IF=10mA IF=5mA IF=2mA 60 -40 0.5 0 80 20 On-Resistance (:) LED Current (mA) 1.5 120 100 2.5 2.0 140 0 3.0 0.5 Load Current (mA) Maximum Load Current vs. Temperature 160 -40 2.5 LED Current (mA) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 100 Typical IF for Switch Operation vs. Temperature (IL=120mADC) 3.0 Typical Turn-Off Time vs. Temperature (IF=120mADC) Load Current (mA) Typical Turn-On Time vs. Temperature (IL=120mADC) Turn-Off TIme (ms) Turn-On Time (ms) PERFORMANCE DATA* 2 -20 0 20 40 60 Temperature (ºC) 80 100 80 100 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Typical Current Limiting vs. Temperature (IF=2mA) 350 Current (mA) 300 250 200 150 100 50 0 -40 -20 0 20 40 60 Temperature (ºC) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION LCA110L Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification LCA110LS MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles LCA110LS 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device LCA110L Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R06 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LCA110L MECHANICAL DIMENSIONS LCA110L 8.382±0.381 (0.330±0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54±0.127 (0.100±0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144±0.508 (0.360±0.020) 6.350±0.127 (0.250±0.005) 1.524 TYP (0.060 TYP) Pin 1 1.651±0.254 (0.065±0.010) 2.540±0.127 (0.100±0.005) 7.620±0.127 (0.300±0.005) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 5.080±0.127 (0.200±0.005) Controlling dimension: inches 3.302±0.051 (0.130±0.002) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457±0.076 (0.018±0.003) LCA110LS 8.382±0.381 (0.330±0.015) 9.524±0.508 (0.375±0.020) Pin 1 0.635±0.127 (0.025±0.005) 2.54 (0.10) 6.350±0.127 (0.250±0.005) 0.457±0.076 (0.018±0.003) 1.651±0.254 (0.065±0.010) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302±0.051 (0.130±0.002) 4.445±0.254 (0.175±0.010) Controlling dimension: inches 1.524 TYP (0.060 TYP) 1.651±0.254 (0.065±0.010) 6 PCB Land Pattern 2.54±0.127 (0.100±0.005) Dimensions mm (inches) www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION LCA110L MECHANICAL DIMENSIONS LCA110LSTR Tape & Reel 330.2 Dia (13.00 Dia) P1 = 12.00 (0.472) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) A0 = 10.10 (0.398) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-LCA110L-R06 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 10/28/2021
LCA110LSTR
物料型号: LCA110L

器件简介: - LCA110L是一个电流限制型、常开(1-Form-A)固态继电器,使用光耦MOSFET技术提供高达3750Vrms的输入到输出隔离。

引脚分配: - 6针DIP封装和6针表面贴装封装两种形式。

参数特性: - 阻断电压:350V - 负载电流:120mA - 最大导通电阻:35mΩ

功能详解: - 内置电流限制 - 输入/输出隔离 - 低驱动功率需求 - 比机电继电器更高的可靠性 - 不产生EMI/RFI - 小型6引脚封装 - 可表面贴装,胶带和卷轴版本

应用信息: - 电信、电信交换、Tip/Ring电路、调制解调器开关、挂钩开关、拨号脉冲、地面启动、振铃注入、仪表、多路复用器、数据采集、电子开关、I/O子系统、电表(瓦时、水、气)、医疗设备-患者/设备隔离、安全、工业控制等。

封装信息: - 提供6针DIP、6针表面贴装和6针卷轴表面贴装版本。
LCA110LSTR 价格&库存

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